70 results about "Piezoelectric resonators" patented technology

A piezoelectric device includes a piezoresonator body and a set of electrodes disposed on the piezoresonator body. The piezoresonator body includes a bulk region and a contact element integral with and protruding from the bulk region, and further includes opposing first and second surfaces. A pair of excitation electrodes are disposed on the first surface. A common electrode is disposed on the second surface. The piezoresonator body is characterized by a longitudinal axis and a transverse axis, and further characterized by a natural resonant frequency (v1) of first-order longitudinal standing vibrations along the transverse axis and a natural resonant frequency (v2) of second-order bending standing vibrations along the longitudinal axis, with v1 < v2 ≤ 1.1v1.

The invention relates to a piezoelectric resonator, which belongs to the technical field of micro electro mechanical systems, and comprises a resonant body on which micropore structures are periodically arranged; the resonant body is fixed on the substrate, and a cavity or an acoustic reflecting layer is arranged between the substrate and the resonant body; wherein the micropore structure and part of the resonance body around the micropore structure form an in-plane coupling unit which is used for exciting the coupling mode of the resonator. Compared with the prior art, the in-plane coupling units arranged in the x-y plane of the resonator can excite transverse modes in the x-axis direction and the y-axis direction at the same time, an in-plane two-dimensional transverse coupling mode is formed, and the transverse coupling mode is the basis for achieving the photoetching tuning characteristic of the resonator. Appropriate sizes and in-plane arrangement of the in-plane coupling units are defined through a photoetching process, and the resonant frequency of the resonator can be adjusted in a wide frequency band range.

A piezoelectric vibration element includes a piezoelectric piece having a main surface; an excitation electrode disposed on the main surface of the piezoelectric piece; and a connection electrode disposed on the main surface of the piezoelectric piece and electrically connected to the excitation electrode, wherein when the main surface of the piezoelectric piece is viewed in a plan, the piezoelectric piece has a through-hole in an area between the excitation electrode and the connection electrode, and wherein an internal wall of the through-hole located closer to the excitation electrode has at least four slopes.

A piezoelectric Micro-Electro-Mechanical Systems (MEMS) resonator employs a thin-film piezoelectric layer as an anchor, which eliminates a dominant loss source, anchor loss, which stems from the irreversible mechanical energy radiation through the anchors. By implementing fundamental or higher-order thickness Lame modes (TLMs) in the thickness direction, the piezoelectric resonator exhibits a substantial reduction of thermoelastic damping (TED) and increase of anchor quality factor. The piezoelectric resonator also provides temperature stability by utilizing a substrate with a turnover temperature, minimizing deviation on resonance frequency. This approach enables the use of thin-film piezoelectric materials as anchors, which can be precisely controlled to minimize losses. The piezoelectric resonator's compact design and CMOS-compatibility make it suitable for batch production at a minimal cost per unit. Furthermore, the highly frequency-stable temperature point of the piezoelectric resonator can be used for implementing oven-controlled oscillators for ultra-stable clock generation in various applications.

The invention provides a packaging structure for a piezoelectric MEMS resonator and an electronic component, and belongs to the field of semiconductor devices.The packaging structure comprises a device wafer, a cap wafer, a first insulating layer and a metal layer, and the first insulating layer and the metal layer are arranged on the cap wafer. The substrate layer comprises a substrate area and a first resonance cavity area surrounded by the substrate area; the device silicon layer, the first dielectric layer, the piezoelectric layer and the top electrode layer are arranged on the substrate layer; the cap wafer comprises a cap layer; the first annular isolation groove is formed in the cap layer, and the first annular isolation groove is filled with a second dielectric layer; wherein the surface, bonded with the cap wafer, of the device wafer is the surface, far away from the substrate layer, of the device silicon layer, the surface, bonded with the device wafer, of the cap wafer is the surface, far away from the first insulating layer, of the cap layer, and the cap layer is made of low-resistance monocrystalline silicon. According to the packaging structure, the packaging vacuum degree can be effectively improved, and the working performance of the resonator is improved.

A dc-dc converter can include a plurality of switches, a piezoelectric resonator (PR) for power stage energy storage, and a means for controlling one or more switching sequences. The switches operate in accordance with the switching sequences to transfer energy from the input to the output via the PR while providing low-loss resonant soft-charging of the PR's capacitance. The switching sequences include: connected stages in which a first and second PR terminals are both connected to one of the input, the output, or the other PR terminal; and open stages in which at least one of the first or second PR terminal is not connected by a closed switch to one of the input, the output, or the other PR terminal.

The invention discloses a crystal oscillator production method, and relates to the field of crystal oscillators, and the crystal oscillator production method comprises the following steps: providing a substrate, a porous plate, a top plate and a plurality of piezoelectric resonators; a plurality of through holes are formed in the porous plate; the lower end of the perforated plate is fixedly connected with the upper end of the base plate; the plurality of piezoelectric resonators are fixedly mounted at the upper end of the substrate before or after the porous plate is fixedly connected with the substrate and are electrically connected with the substrate; the piezoelectric resonators and the through holes are arranged in a one-to-one correspondence manner, so that the plurality of piezoelectric resonators are respectively and correspondingly accommodated in the plurality of through holes; and segmenting a structure formed by the substrate, the porous plate, the piezoelectric resonance body and the top plate according to preset shapes and intervals to obtain a plurality of single crystal oscillators. The technology provided by the invention can realize batch production of crystal oscillators, and can be suitable for production of crystal oscillators made of various different materials.

An apparatus for detecting a position of a wafer includes a plurality of lift pins disposing the wafer on a support stand and a plurality of piezoelectric resonators at lower portions of the plurality of lift pins, respectively, wherein at least one first piezoelectric resonator among the plurality of piezoelectric resonators is configured to vibrate a corresponding lift pin of the plurality of lift pins, at least one second piezoelectric resonator among the plurality of piezoelectric resonators is configured to detect a resonant frequency of a combined structure including the wafer and the plurality of lift pins, the resonant frequency corresponding to the vibration, and the apparatus further includes a controller configured to determine the position of the wafer according to a change in the resonant frequency.

The invention relates to the technical field of oil and gas field development, and discloses a linkage type intelligent opening system for intelligent fracturing sliding bushings and a control method thereof.The system comprises the multiple intelligent fracturing sliding bushings internally provided with multi-dimensional coding response units; the multi-dimensional coding response unit comprises a micro piezoelectric resonator array, the micro piezoelectric resonator array is composed of a plurality of piezoelectric crystals with inherent acoustic resonant frequencies, and acoustic fingerprint codes of the intelligent fracturing sliding sleeve are formed by the set combination of the inherent acoustic resonant frequencies of the piezoelectric crystals; and the micro magnetostriction exciter has the optimal response frequency sensitive to the alternating magnetic field with the set frequency, and the optimal response frequency forms a magnetic field response code of the intelligent fracturing sliding sleeve. By compounding the acoustic fingerprint codes and the magnetic field response codes, opening of the intelligent fracturing sliding sleeve does not respond to interference of a single underground field source, such as sound waves or magnetic field fluctuation without specific codes, so that the unexpected opening probability is reduced, and the specificity of target selection is improved.

To provide a piezoelectric resonator which can resist high electromagnetic fields while keeping the energy consumption and volume reduced.SOLUTION: A piezoelectric resonator, in particular for a rotary piezoelectric motor, includes a stationary base 3 and an oscillating mass 2 extending about a longitudinal axis. The oscillating mass is provided with at least one inertia-block 4, preferably two opposing inertia-blocks. The piezoelectric resonator includes a flexible blade guide connecting the oscillating mass to the base, so that the oscillating mass can be oscillated about a center of rotation in a pendulum movement. The flexible blade guide includes: a first flexible blade 6 connected to the base and / or to the oscillating mass to allow the displacement of the oscillating mass relative to the base; and a spiral spring 5 connected to the base and / or to the oscillating mass. The spiral spring includes at least partially an electrically actuatable piezoelectric material to thereby deform the spiral spring and oscillate the oscillating mass.SELECTED DRAWING: Figure 1

A piezoelectric resonator includes a piezoelectric element having a first surface and a second surface on an opposite side of the piezoelectric element from the first surface, a first set of electrodes electrically connected to the first surface, the first set of electrodes comprising one or more electrodes of a first polarity alternating with electrodes of a second polarity in a first sequence, and a second set of electrodes electrically connected to the second surface, the second set of electrodes comprising one or more electrodes of a first polarity alternating with electrodes of a second polarity in a second sequence opposite of the first sequence, the energizing of the electrodes causing the piezoelectric element operate in an overtone resonant mode.

An apparatus for detecting a position of a wafer includes a plurality of lift pins for disposing the wafer on a support bracket, and a plurality of piezoelectric resonators at lower portions of the plurality of lift pins, respectively, at least one first piezoelectric resonator of the plurality of piezoelectric resonators is configured to vibrate a corresponding lift pin of the plurality of lift pins, and at least one second piezoelectric resonator of the plurality of piezoelectric resonators is configured to detect a resonant frequency of a combined structure including the wafer and the plurality of lift pins, the resonant frequency corresponds to the vibration, and the apparatus further includes a controller configured to determine a position of the wafer as a function of a change in the resonant frequency.

The present invention is a crystal vibrator (100) provided with: a crystal vibration plate (10) having a first excitation electrode (111) and a second excitation electrode (112) paired with the first excitation electrode (111); and a first sealing member (20) and a second sealing member (30) that cover both main surfaces of the crystal vibration plate (10), wherein the first sealing member (20) and the crystal vibration plate (10) are joined and the second sealing member (30) and the crystal vibration plate (10) are joined so that a vibration part (11) including the first excitation electrode (111) and the second excitation electrode (112) is hermetically sealed, the first sealing member (20) is provided with a thin-film thermistor (500) on a second main surface (202) facing the vibration part (11), and a through-hole penetrating from a first main surface (201) to the second main surface (202) is not provided.

A sensing sensor module and a sensor module heat dissipation structure are provided. The sensing sensor module includes a piezoelectric oscillation portion in which a reaction electrode to which a target substance in a gas adheres and a reference electrode to which the target substance does not adhere are disposed on a sensor substrate as a piezoelectric resonator, a cooling element, and a supporting member. The cooling element cools the piezoelectric oscillation portion. The supporting member supports the cooling element. The supporting member has a center portion at which the cooling element is arranged and a flange-shaped base portion that has a circular ring shape and extends outward in a radial direction of the circular ring around the center portion. The base portion dissipates heat from the center portion.

The invention provides a piezoelectric vibrating piece and a piezoelectric vibrator using the piezoelectric vibrating piece. The piezoelectric vibrating piece can suppress the occurrence of defects caused by discharge between electrodes. The crystal resonator element includes: a crystal piece having a pair of main surfaces; an excitation electrode provided on the main surface; and an extraction electrode that is extracted from the excitation electrode. The main surface includes a first main surface and a second main surface facing the first main surface, and the excitation electrodes include a first excitation electrode provided on the first main surface and a second excitation electrode provided on the second main surface. The extraction electrodes include a first extraction electrode extracted from the first excitation electrode and a second extraction electrode extracted from the second excitation electrode. The crystal piece includes a creepage distance expansion portion that expands the creepage distance between the first excitation electrode and the second extraction electrode and / or the creepage distance between the second excitation electrode and the first extraction electrode.

The invention discloses a resonator based on a periodically polarized piezoelectric film, and belongs to the technical field of piezoelectric resonators. The resonator comprises a substrate, a periodically polarized piezoelectric film and an interdigital transducer. The substrate is a POI substrate, an SMR type substrate or a substrate structure with a cavity at the bottom; the periodic polarization piezoelectric film is formed by laminating at least two layers of piezoelectric films with opposite polarization directions, and a 180-degree phase difference exists between the adjacent layers; the interdigital transducer is arranged on the upper surface of the piezoelectric film, and electrode materials comprise one or more of titanium Ti, aluminum Al, copper Cu, gold Au, platinum Pt and silver Ag. According to the invention, the working frequency is effectively expanded on the premise of not sacrificing the thickness of the piezoelectric layer through the periodic polarization laminated structure, the quality factor Q value and the electromechanical coupling coefficient K2 are remarkably improved, the problem of performance degradation caused by thin film thinning of the high-frequency resonator is solved, and the high-frequency resonator is particularly suitable for the fields of millimeter wave communication, filters and sensors.

A sensing sensor includes a piezoelectric oscillation portion in which a reaction electrode to which a target substance in a gas adheres and a reference electrode to which the target substance does not adhere are disposed on a sensor substrate as a piezoelectric resonator, an exterior cover that has an opening portion through which the gas passes and covers the piezoelectric oscillation portion, and a support substrate that supports the piezoelectric oscillation portion. The sensor substrate is mounted on the support substrate such that the reaction electrode is opposed to the opening portion, and a temperature sensor is arranged on an opposite side surface of a surface on which the reaction electrode and the reference electrode are disposed.

A system, method, and device for driving a converter including two input terminals, two output terminals, a piezoelectric resonator, and a plurality of switches connected to the resonator, a first switch being connected between an input terminal and the resonator and switchable between an open position and a closed position where an input voltage is applied to the resonator. The device includes a module for measuring an output variable, a module for controlling a switching of the switches to alternate phases with a substantially constant voltage and a substantially constant load at the terminals of the resonator, and a module for detecting a characteristic event dependent on the output variable. In the event of detection of the event, the control module commands the first switch into the open position for the duration of at least one resonance cycle.

To provide a piezoelectric device capable of securing reliability and electrical characteristics while reducing stray capacitance inside a package.SOLUTION: A piezoelectric resonator device includes a package having a bottom plate having a rectangular shape in a plan view and a wall portion provided along an edge of the bottom plate, an IC chip mounted in an inner region surrounded by the wall portion, and a piezoelectric resonator connected to a piezoelectric resonator connecting terminal provided on an upper surface of the IC chip, wherein the piezoelectric resonator protrudes from the upper surface of the IC chip toward the wall portion in a plan view, and an excitation electrode included in an electrode pattern formed on the piezoelectric resonator faces only the package in a plan view.SELECTED DRAWING: Figure 2

Provided is a piezoelectric vibration device that exhibits excellent reliability by preventing a sealing plate of the piezoelectric vibration device from cracking in a case where an external electronic component element is joined by a metal bump to the sealing plate.　Six sealing plate-connection electrode parts are arranged on the lower surface of an IC chip (the electronic component element), and six electronic component element-connection electrode parts 37a-37f to which the sealing plate-connection electrode parts of the IC chip are respectively connected are arranged in an electrode pattern 37 on the upper surface, not facing a piezoelectric vibration plate 2, of a first sealing member (an upper sealing plate) 3. Metal bumps are used to respectively join together the six sealing plate-connection electrode parts of the IC chip and the six electronic component element-connection electrode parts 37a-37f of the upper sealing plate 3. At this time, one of the metal bumps has no electrical connection function and only a mechanical joining function, and the remaining metal bumps have an electrical connection function.

This disclosure provides methods, devices, and systems for generating clock signals. The present implementations more specifically relate to generating multiple clock signals having different frequencies using a single piezoelectric resonator. In some aspects, a clock generator, including a piezoelectric resonator coupled to a voltage amplifier in a feedback network, may be operable in a high-performance mode and a low-power mode. When operating in the high-performance mode, the clock generator may produce a high frequency clock signal and a low frequency clock signal using the same piezoelectric resonator. In some implementations, the high frequency clock signal may be produced by a buffer amplifier coupled to an output of the voltage amplifier and the low frequency clock signal may be produced by a frequency divider coupled to the output of the voltage amplifier. When operating in the low-power mode, the clock generator produces only the low-frequency clock signal via the frequency divider.

The application relates to the field of semiconductor devices and provides a piezoelectric MEMS resonator and an electronic component. The resonator comprises a cap wafer and a device wafer, the cap wafer comprises a cap layer, and the device wafer comprises: a substrate layer; a resonant cavity arranged on the substrate layer; a device silicon layer located on the upper side of the resonant cavity; a piezoelectric layer located on the upper side of the device silicon layer; a top electrode located on the upper side of the piezoelectric layer; and a first dielectric layer located on the upper side of the top electrode and covering the top electrode, the first dielectric layer is bonded to the cap layer, at least a part of the first dielectric layer bonded to the cap layer projects on the vertical direction and overlaps the projection of the top electrode on the vertical direction, and the upper surface of the at least part of the first dielectric layer bonded to the cap layer is in the same plane. In this way, the bonding properties of the cap wafer and the device wafer are improved by flattening the surface of the dielectric layer covering the top electrode, and a good bonding effect is ensured.

A piezoelectric resonator device according to one or more embodiments may include a crystal resonator plate including first and second excitation electrodes sandwiched by first and second sealing members placed respectively above and below the crystal resonator plate so as to bond respective sealing parts to each other. The first sealing member includes a fourth through hole penetrating between a first main surface and a second main surface. An opening area of an opening in the first main surface side of the fourth through hole is larger than an opening area of an opening in the second main surface side. The width of a sealing-surface-side opening surrounding electrode is larger than the width of an outer-surface-side opening surrounding electrode in the Z′ axis direction.

The invention provides a resonant gas sensor and a manufacturing method thereof. The resonant gas sensor comprises a detection light source used for generating detection light capable of being absorbed by gas to be detected; the detection cavity is arranged on a light path of the detection light; the cavity wall, opposite to one side of the detection light source, of the detection cavity is made of a material which is transparent relative to detection light, the detection cavity is communicated with a detection environment through a through hole so as to obtain to-be-detected target gas in the detection environment, and a piezoelectric resonator capable of changing the resonance state along with the change of environment sound pressure is arranged in the detection cavity. According to the invention, two substrates are adopted to respectively manufacture different structures and are assembled through bonding. And the processes of the key structures are independent from each other and cannot influence each other when different structures are manufactured, so that the process stability is high. The sensor structure adopts a photoacoustic signal mode, the detection sensitivity is high, the response speed is high, and the detection range is large. And the detection cavity does not contain any material for absorbing the detected gas, so that timely response can be performed when the concentration is changed, and the situation of signal lag caused by gas residue is avoided.

A piezoelectric resonator (10) is provided with: a polarization-reversal piezoelectric laminate (11) in which ten or more piezoelectric layers (111, 112) are laminated such that the orientation of components of polarization in a direction parallel or perpendicular to the in-plane direction of the layers is alternately reversed, the piezoelectric layers (111, 112) each comprising a piezoelectric body and having substantially equal fundamental resonance frequencies, which are values obtained by dividing the sound velocity by two times the thickness; a pair of electrodes (121, 122) provided so as to sandwich the polarization-reversal piezoelectric laminate (11) from both sides in the lamination direction; and a support body (13) that supports one electrode (122) of the pair of electrodes (121, 122).

A sensing device includes a sensor substrate, a Peltier element unit, a circuit board, a base body, a cover body, and a base cover. The Peltier element unit in contact with the sensor substrate. The base body includes a first recessed portion for housing a region of the Peltier element unit at a side of the heat dissipation surface, a second recessed portion for housing the circuit board, and a partition plate interposed between the first recessed portion and the second recessed portion. The cover body houses the base body in a region where the first recessed portion is formed, the Peltier element unit projecting outside the first recessed portion, and the sensor substrate, the cover body having an opening formed at a position corresponding to a region where the piezoelectric resonator is disposed for adsorption of the substance to be sensed.

The present invention is a crystal vibrator (100) provided with: a crystal vibration plate (10) having a first excitation electrode (111) and a second excitation electrode (112) paired with the first excitation electrode (111); and a first sealing member (20) and a second sealing member (30) that cover both main surfaces of the crystal vibration plate (10), wherein the first sealing member (20) and the crystal vibration plate (10) are joined and the second sealing member (30) and the crystal vibration plate (10) are joined so that a vibration part (11) including the first excitation electrode (111) and the second excitation electrode (112) is hermetically sealed, the first sealing member (20) is provided with a thin-film thermistor (500) on a second main surface (202) facing the vibration part (11), and a through-hole penetrating from a first main surface (201) to the second main surface (202) is not provided.

The present application provides a kind of multi-point drive scraper conveyor device with fault identification and fault-tolerant control, it is related to coal mining technical field.The present application includes conveying module, drive module, fault detection module.The conveying module includes scraper chain of scraper conveyor and scraper installed on scraper chain and moved with scraper chain;Drive module includes motor mounting tray, disengaging track, motor at both ends in scraper chain and multi-stage motor arranged between both ends motor, fault detection module includes piezoelectric resonator, signal transceiver device and computer, when motor works and receives different pressure or vibration, different intensity of current is generated, piezoelectric resonator sends current intensity signal to computer, and judges the working state of motor, and motor automatic disengaging device is configured under both ends motor and multi-stage motor, when motor is judged as abnormal, motor will be disengaged from working position backward through disengaging device for repair.

A piezoelectric resonator with a built-in temperature sensor is used by being connected to an external electronic device including a temperature compensation circuit. The piezoelectric resonator includes a piezoelectric vibrating piece having a frequency versus temperature characteristic and a temperature sensor. The temperature sensor has its inter-terminal voltage detected as temperature information by the external electronic device. The piezoelectric resonator includes a resistor having one end connected to the temperature sensor and another end connected to a predetermined power source of the connected external electronic device. The resistor has a first resistance value for allowing the inter-terminal voltage to be a planned voltage using a preliminarily determined correction formula, or a second resistance value smaller than the first resistance value or a third resistance value larger than the first resistance value for allowing the inter-terminal voltage to be a correction voltage corresponding to an individual difference of the piezoelectric resonator.