5 results about "Power cycling" patented technology

This invention provides a power cycle testing method and apparatus for power semiconductor devices, relating to the field of semiconductor device testing technology. It is applied to a test circuit containing multiple power units. The method includes: applying a periodic switching drive signal to the test circuit, causing the switching transistors within the test circuit to operate in a dynamic switching mode simulating actual operating conditions, thereby applying cyclic electrothermal stress to the power semiconductor device under test (DUT) contained in the test circuit; for the same test circuit, changing the drive signal to a measurement drive signal to switch the test circuit to a static conduction mode, thereby forming a DC current path for measuring the on-state voltage drop of the DUT; and measuring the on-state voltage drop of the DUT when a stable current flows through it in the static conduction mode.

A voltage across a first capacitor and a voltage across a second capacitor are set to a reference voltage via a reference voltage source. The first and second capacitors are disconnected from the reference voltage source and the reference voltage is turned-off. A processing device turns-on the reference voltage in response to determining a voltage difference between the first and second capacitors due to leakage current is at or above a threshold level. The first and second capacitors are connected to the reference voltage source to return the voltage across the first capacitor and the voltage across the second capacitor to the reference voltage.

A charging and discharging device is disclosed, aiming to charge and supply power simultaneously while reducing power cycling stress. As a charging and discharging ECU installed in an electric vehicle, used to control the charging and supply of power to an external power source, the charging and discharging ECU includes: a receiving unit that receives a charging and supply start time sent from a collector that manages the external power source; a prediction unit that predicts the charging and supply start time sent from the collector; and a setting unit that determines the charging start time and charging end time for timed charging. The setting unit determines the charging end time based on the charging and supply start time predicted by the prediction unit.

An integrated router is provided. The integrated router includes at least one network interface, a power supply input, a power supply output, and a power cycling switch. The at least one network interface is operative to place a first network device in electronical communication with a second network device. The power supply input is operative to receive electrical power from a power supply. The power supply output is operative to provide the electrical power to the second network device. The power cycling switch electrically connects the power supply input to the power supply output and is operative to be toggled by a remote network device via the at least one network interface so as to power cycle the second network device.

This invention provides a power semiconductor package structure with electrothermal topology separation and its formation method. The package structure includes: a power semiconductor chip having an active device region and a peripheral non-active region; a first terminal and a second terminal located on one side of the first surface of the chip; a vertical conductive structure located in the peripheral non-active region and connected to the first terminal; a back conductive layer connected to the vertical conductive structure and the active device region; and a thermally conductive insulating layer and a bottom heat diffusion layer located on the back side of the back conductive layer. The first terminal, the vertical conductive structure, the back conductive layer, the active device region, and the second terminal are sequentially electrically connected to form a conductive path. The thermally conductive insulating layer and the bottom heat diffusion layer do not carry the main current and are electrically isolated from the conductive path. By establishing physical separation between the main current path and the heat flow path in the package architecture, the current loop area is reduced to decrease parasitic inductance, the heat dissipation area is increased, and the thermal resistance is reduced, thereby improving reliability and service life under high-power cycling.