This invention relates to the field of hinge technology for electronic flip devices, specifically to a hinge structure and an electronic device having the same. The hinge structure includes: a hinge component; a flexible circuit printed on the hinge component using an in-mold transfer
laser forming process; and a connecting joint fixedly connected to the hinge component, wherein the flexible circuit is electrically connected to the connecting joint. By printing the flexible circuit on the hinge component and connecting external wires to the flexible circuit using the connecting joint, the flexible circuit, used for
signal transmission and power supply, electrically connects the two parts that are connected by the hinge structure. By directly integrating the flexible circuit onto the hinge, replacing the original wires and flexible circuit board, in electronic devices with a hinge structure, there is no need for wires for
signal transmission or power supply inside or outside the hinge structure, avoiding interference between the wires and the hinge during hinge movement, ensuring smooth hinge rotation even after long-term use.