Through silicon via array-based three-dimensional spiral inductor

Abstract

The invention discloses a through silicon via array-based three-dimensional spiral inductor, which comprises a top layer, an intermediate layer and a bottom layer, wherein through silicon vias in the intermediate layer are arranged into an N*N square matrix (N is greater than or equal to 5); metal posts in the through silicon vias are connected with top-layer metal interconnection lines on the top layer and bottom-layer metal interconnection lines on the bottom layer to form a series path; the series path is of a three-dimensional spiral structure (namely the three-dimensional spiral inductor) in a vertical plane; current flows to another polar plate from one polar plate of the three-dimensional spiral inductor when the series path is used; and the current sequentially passes through each metal post except for the metal post at the center. An inductance value of each through silicon via is equal to the sum of self-inductance itself and mutual inductance of adjacent through silicon via; and the total inductance value of the three-dimensional spiral inductor is equal to superposition of self-inductance values and mutual inductance values of all through silicon vias in the array, so that the quality and the inductance value of the integrated inductor can be greatly improved by the three-dimensional spiral inductor disclosed by the invention.

Description

technical field [0001] The invention relates to an inductor, in particular to a three-dimensional spiral inductor based on a through-silicon via (TSV) array, and belongs to the field of integrated inductors oriented to radio frequency / microwave integrated circuits. Background technique [0002] As one of the three major passive devices, inductors are an important part of various circuits in modern communication systems. They are widely used in analog, analog-digital hybrid, radio frequency and microwave integrated circuits. It also has the functions of screening signals, filtering noise, stabilizing current and suppressing electromagnetic wave interference. [0003] The most common usage of inductors in circuits is to form LC filter circuits together with capacitors. [0004] At present, there are two types of inductors: discrete inductors and integrated inductors. Individual discrete inductors are generally large in size, which is not conducive to monolithic integration an...

AI Technical Summary

Problems solved by technology

[0004] At present, there are two types of inductors: discrete inductors and integrated inductors. Individual discrete inductors are generally large in size, which is not conducive to monolithic integration and system miniaturization; inductors made by integrated circuit manufacturing processes are generally made by The metal spiral is etched on the surface of the silicon substrate. The inductance of this type of inductor is very small, which limits the use of inductors in integrated circuits.

Images