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Method for manufacturing high-roughness electronic copper foil for ceramic-based high-frequency electronic copper-clad plate

A manufacturing method and technology of electronic copper foil, which are applied in the manufacture of printed circuits, the manufacture of printed circuit precursors, electrical components, etc. Good uniformity, improved high temperature oxidation resistance, high consistency

Active Publication Date: 2015-11-11
ANHUI TONGGUAN COPPER FOIL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of this invention is to solve the problem that traditional copper foil cannot meet the high peel strength and high temperature oxidation resistance of ceramic-based copper-clad laminates, and develop an electronic copper foil that meets the requirements of ceramic-based copper-clad laminates

Method used

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  • Method for manufacturing high-roughness electronic copper foil for ceramic-based high-frequency electronic copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Raw foil process: electroplating in the raw foil solution to generate raw foil, the current density of the electroplating operation in this process is 7100A / m 2 , the temperature of the raw foil liquid is controlled at 49°C, the concentration of sulfuric acid in the raw foil liquid is 145g / L, the concentration of divalent copper ions is 65g / L, and the flow rate is 46m 3 / h, the raw foil liquid also includes a raw foil additive, which contains sodium dodecylsulfonate at a concentration of 2.6g / L, medicinal dextrin at a concentration of 0.5g / L, and 0.25g / The hydrochloric acid of the high molecular weight gelatin (molecular weight 200000) of L concentration and 22mg / L concentration;

[0030] The first roughening process: after pickling the copper foil produced in the raw foil process, it is electroplated in the roughening solution, and the current density of the first stage of the electroplating operation is 30A / dm 2 , the current density of the second stage is 8A / dm 2 ...

Embodiment 2

[0042] Raw foil process: electroplating in the raw foil solution to generate raw foil, the current density of the electroplating operation in this process is 7500A / m 2 , the temperature of the raw foil liquid is controlled at 50°C, the concentration of sulfuric acid in the raw foil liquid is 147g / L, the concentration of divalent copper ions is 67g / L, and the flow rate is 47m 3 / h, the raw foil liquid also includes a raw foil additive, which contains sodium dodecylsulfonate at a concentration of 2.8g / L, medicinal dextrin at a concentration of 0.6g / L, and 0.27g / The hydrochloric acid of the high molecular weight gelatin (molecular weight 100000) of L concentration and 23mg / L concentration;

[0043] The first roughening process: after pickling the copper foil produced in the raw foil process, it is electroplated in the roughening solution, and the current density of the first stage of the electroplating operation is 29A / dm 2 , the current density of the second stage is 7A / dm 2 ...

Embodiment 3

[0055] Raw foil process: electroplating in the raw foil solution to generate raw foil, the current density of the electroplating operation in this process is 8000A / m 2 , the temperature of the raw foil liquid is controlled at 52°C, the concentration of sulfuric acid in the raw foil liquid is 150g / L, the concentration of divalent copper ions is 69g / L, and the flow rate is 48m 3 / h, the raw foil liquid also includes a raw foil additive, which contains sodium dodecylsulfonate at a concentration of 3.0g / L, medicinal dextrin at a concentration of 0.7g / L, and 0.28g / The hydrochloric acid of the high molecular weight gelatin (molecular weight 200000) of L concentration and 30mg / L concentration;

[0056] The first roughening process: after pickling the copper foil produced in the raw foil process, it is electroplated in the roughening solution, and the current density of the first stage of the electroplating operation is 31A / dm 2 , the current density of the second stage is 8A / dm 2 ...

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Abstract

The present invention discloses a method for manufacturing a high-roughness electronic copper foil for a ceramic-based high-frequency plate. The method comprises the procedures of crude foil, first roughening, second roughening, first curing, second curing, third curing, blackening, galvanizing, passivation, coupling agent spraying and drying. The copper foil rough surface roughness of the crude foil process of the invention is greatly improved, the contact area of the copper foil rough surface and resin is greatly increased, the problem of low peel strength caused by poor resin mobility is solved, the uniformity of a rough surface copper tooth of the copper foil produced by the production process is good, the consistency is high, a skin effect caused by a large copper tooth fluctuation is reduced, and the loss in the signal transmission process is reduced.

Description

technical field [0001] The invention relates to a method for manufacturing high-roughness electronic copper foil used for ceramic-based high-frequency copper-clad laminates. Background technique [0002] With the development of high-frequency and high-speed PCBs, traditional copper foils cannot meet the requirements of lowDk and lowDf of high-frequency PCBs, while ceramic materials have high resistance, outstanding high-frequency characteristics, and have high thermal conductivity, good chemical stability, and thermal stability. The advantages of stability and high melting point meet the anti-war requirements of high frequency PCB. [0003] Existing raw foil production process Cu 2+ : 70-80g / L, H 2 SO 4 : 100-140g / L, Cl - : 10-15ppm, electrolyte temperature 38-43℃, raw foil additive gelatin and surface treatment process galvanized rough surface current 45A and 45A and smooth surface 80A, surface treatment machine speed 22m / min. [0004] The roughness of the rough surfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18C25D7/06
CPCC25D7/0614H05K3/022H05K3/188H05K2203/0723
Inventor 丁士启于君杰贾金涛郑小伟唐海峰吴斌
Owner ANHUI TONGGUAN COPPER FOIL
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