Colored polyimide film

A color polyimide film and polyimide technology, applied in the field of color polyimide film, can solve the problem that the polyimide film and the printed circuit board cannot be well matched

Active Publication Date: 2015-03-18
TAIMIDE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the desired gloss and light transmittance can be achieved by adding colorants and matting agents. However, it is well known that the addition of a large amount of colorants and matting agents to polyimide films often affects the properties of the film itself, such as thermal expansion coefficient or mechanical properties. , so that the polyimide film cannot be well matched with the printed circuit board

Method used

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  • Colored polyimide film
  • Colored polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0043] Repeat the steps of Example 1, but the weight of each component is changed to about 38g of the PAA solution of Example 1, about 26.47g of DMAc, about 2.71g of carbon black slurry, and about 3.33g of PIP slurry.

[0044]

[0045] Put about 400g of DMAc into the reaction flask, add about 47.85g (0.2393mole) of 4,4'-ODA and stir until completely dissolved, then add about 51.11g (0.2344mole) of PMDA, and continue stirring for about 4 hours to carry out the reaction , forming a polyamic acid solution with a viscosity of about 200,000 cps.

[0046] The obtained polyamic acid solution of about 30g, the DMAc of about 26.47g, the red slurry of about 7.95g, the white slurry of about 2.38g are mixed with the PIP slurry of about 3.33g, then with the same step as Example 1 A polyimide film was prepared.

[0047]

[0048] Repeat the steps of Comparative Example 1, but the weight of each component is changed to about 38g of the polyamic acid solution of Comparative Example 1, abo...

Embodiment 3

[0070] Put about 400g of DMAc into the reaction flask, add about 44.03g (0.2202mole) of 4,4'-ODA and about 2.64g (0.0244mole) of p-PDA, stir until completely dissolved, then add about 52.26g ( 0.2397mole) of PMDA, continued stirring for about 4 hours to react, forming a polyamic acid (PAA) solution with a viscosity of about 200,000cps.

[0071] The obtained polyamic acid solution of about 25g, the DMAc of about 22.62g, the red slurry of about 4.8g, the white slurry of about 3.52g are mixed with the PIP slurry of about 8.39g, then with the same step as Example 1 A polyimide film was prepared.

Embodiment 4

[0073] Repeat the steps of Example 1, but each component weight is changed to the PAA solution of Example 1 of about 25g, the DMAc of about 28.55g, the red slurry of about 4.77g, the white slurry of about 3.5g, and the PIP slurry.

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Abstract

A colored polyimide film includes a polyimide polymer obtained by reacting diamine monomers with dianhydride monomers, wherein the diamine monomers are oxydianiline (ODA) and phenylene diamine (PDA) monomers, and the dianhydride monomers are pyromellitic dianhydride (PMDA); a matting agent comprised of polyimide particles; and one or more color pigment. The polyimide films described herein have low gloss, low transparency, and low coefficient of thermal expansion.

Description

【Technical field】 [0001] The invention relates to a colored polyimide film, in particular to a polyimide film with specific color, shielding properties and good film properties. 【Background technique】 [0002] Flexible printed circuit boards are widely used in 3C products, optical lens modules, LCD modules and solar cells, and polyimide (PI) meets the requirements of flexible printed circuit boards for mechanical strength, flexibility, solvent resistance, It can be used as the base material or coverlay material of flexible circuit boards due to the requirements of dielectric properties and heat resistance. Generally speaking, the polyimide film is yellow and transparent. Therefore, the circuit patterns on the printed circuit board can still be observed when the polyimide film is covered on the printed circuit board. In order to further meet the aesthetic requirements and at the same time protect the technical secrets that may be involved in the circuit layout on the printed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10B32B15/08
CPCC08L2205/025Y10T428/31681C08L79/08H05K1/0373H05K1/0393H05K1/053C09D179/08C08G73/1042C08G73/105C08G73/1071H05K2201/0154C08K3/0033C08K5/0041C08K3/013B32B15/08C08G73/10C08J5/18C08K3/00
Inventor 钟文轩李美慧
Owner TAIMIDE TECH
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