Easily workable high-performance polyimide material and its preparation method

A polyimide, high-performance technology, applied in the field of high-performance polyimide materials and their preparation, can solve problems such as affecting the performance of final products and uneven molecular weight distribution of polyimide

Inactive Publication Date: 2003-07-09
DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since polyamic acid will be converted into low-molecular-weight polyimide at low temperature, it will cause decomposition of polyamic aci

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] In a 500ml round bottom flask, dissolve 20.02 grams of 4,4'-diaminodiphenyl ether, 27.92 grams of 4,4'-diphenyl ether tetra-acid dianhydride and 0.48 grams of phthalic anhydride in 274.32 grams of N-methyl base pyrrolidone, stirred at 20° C. for 4 hours to obtain a polyamic acid solution with a solid content of 15%.

[0025] Add 32.27 grams of glacial acetic acid and 8.52 grams of 2-hydroxypyridine to the polyamic acid solution, and after stirring for 3 hours at 30°C, polyimide powder is precipitated in the solution, and this mixed solution containing polyimide powder is heated at 120 °C for 6 hours. The mixture was cooled and then filtered, and the obtained powder was dried in a vacuum oven at 160° C. for 10 hours to obtain a polyimide resin product. Test its solvent resistance and thermal performance, the results are shown in Table 1.

[0026] Put the polyimide resin in the mold, put it into the press at room temperature, and gradually raise the temperature of the m...

Embodiment 2

[0028] In a 500ml round bottom flask, dissolve 19.02 grams of 4,4'-diaminodiphenyl ether, 31.02 grams of 4,4'-diphenyl ether tetra-acid dianhydride and 1.02 grams of aniline in 204.24 grams of N,N-dimethyl Acetamide was stirred at 25° C. for 2 hours to obtain a polyamic acid solution with a solid content of 20%.

[0029] Add 25.53 grams of glacial acetic acid and 6.74 grams of 2-hydroxypyridine to the polyamic acid solution, and after stirring at 35°C for 5 hours, polyimide powder is precipitated in the solution, and this mixed solution containing polyimide powder is heated at 120 °C for 4 hours. The mixture was cooled and then filtered, and the obtained powder was dried in a vacuum oven at 160° C. for 10 hours to obtain a polyimide resin product. Test its solvent resistance and thermal performance, the results are shown in Table 1.

[0030] The preparation and performance test of the polyimide material board are the same as in Example 1, and the test results are shown in Ta...

Embodiment 3

[0032] The preparation method of polyamic acid solution is the same as example 1. Add 48.04 grams of acetic anhydride and 6.20 grams of pyridine to the polyamic acid solution, and after stirring at 30°C for 2 hours, polyimide powder is precipitated in the solution, and this mixed solution containing polyimide powder is heated at 140°C for 7 Hour. The mixture was cooled and then filtered, and the obtained powder was dried in a vacuum oven at 160° C. for 10 hours to obtain a polyimide resin product. Test its solvent resistance and thermal performance, the results are shown in Table 1.

[0033] The preparation and performance test of the polyimide material board are the same as in Example 1, and the test results are shown in Table 2.

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PUM

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Abstract

The present invention uses 4,4-diphenyl ether tetrahydric dianhydride and 4,4'-diaminodiphyl ether as polymerization monomer, and adopts the solution polycondensation method combining chemical imidation process and thermal imidation process to synthesize the high-temp.-resistant and solvent-resistant polyimide resin. Said invented polyimide resin possesses good working property, the polyimide plate material die-moulded by using said polyimide resin possesses high strength and fire resistance, its glas-stransition temperature is 267.7 deg.C, 5% thermal weight loss temperature is 543.1 deg.c, tensile strength is 145 MPa, impact strength is 192 KJ/sq.m, compressive strength is 1635 MP and oxygen index is 46.2.

Description

Technical field: [0001] The invention relates to an easy-to-process high-performance polyimide material and a preparation method thereof. Specifically, the present invention relates to a polyimide material with excellent comprehensive properties such as solvent resistance, high temperature resistance, combustion resistance, high strength, and easy processing, and a preparation method thereof. Background technique: [0002] Polyimide material is a kind of high-performance polymer material characterized by imide ring structure. Because it has good high temperature resistance, excellent mechanical properties, chemical corrosion resistance and high radiation resistance, And widely used in aviation, aerospace, electrical, mechanical, chemical, microelectronics and other fields. [0003] Polyimide material is obtained by molding polyimide resin. The performance of polyimide resin directly affects the performance indicators such as thermal stability, impact resistance and mechanic...

Claims

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Application Information

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IPC IPC(8): C08G73/10
Inventor 孙彩霞王复东徐杰
Owner DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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