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Dimensionally-stable polyimide film and preparation method thereof

A polyimide film and dimensionally stable technology, applied in the field of dimensionally stable polyimide film and its preparation, can solve problems such as unsatisfactory dimensional stability, achieve low thermal shrinkage, high elastic modulus and stretch The effect of strength, good dimensional stability

Active Publication Date: 2012-07-11
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The tensile elastic modulus of the polyimide film described in this invention is 4.0GPa, the coefficient of thermal expansion is 18PPm / °C, and the thermal shrinkage rate is 0.06%, and the dimensional stability of the product is not ideal enough.

Method used

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  • Dimensionally-stable polyimide film and preparation method thereof
  • Dimensionally-stable polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 1) Preparation of component A: Add 22.42g (0.1mol) of 2-(4-aminophenyl)-5-aminobenzimidazole into 215g of N,N-dimethylacetamide solvent at 25°C, After stirring for 10min, PMDA was added, and the ratio of the amount of 2-(4-aminophenyl)-5-aminobenzimidazole and PMDA added was 1:1, and then continued to stir for 3h, and the obtained polyamic acid resin solution was It is component A, and the measured viscosity of component A is 49,000 centipoise (25°C);

[0033] 2) Preparation of component B: at 25°C, add 21.63g (0.2mol) of PDA to 325g of N,N-dimethylacetamide solvent, stir for 20min, then add PMDA, the content of the added PDA and PMDA The ratio of the quantities is 1:1, and then the stirring is continued for 4 hours, and the obtained polyamic acid resin solution is the B component, and the measured viscosity of the B component is 55,000 centipoise (25°C);

[0034] 3) Under the condition of 25°C, mix component A and component B according to the ratio of 40% and 60% by w...

Embodiment 2

[0037] 1) Preparation of A component: same as Example 1;

[0038] 2) Preparation of B component: same as Example 1;

[0039] 3) Under the condition of 25°C, mix component A and component B according to the ratio of 60% and 40% by weight respectively, and mechanically stir for 8 hours to obtain a resin that is fully mixed and uniform between the molecules of each component;

[0040] 4) Vacuum defoaming and filtering the uniformly mixed resin, followed by salivation, stretching and thermal imidization according to the conventional process to obtain a dimensionally stable polyimide film.

Embodiment 3

[0042] 1) Preparation of component A: Add 22.42g (0.1mol) of 2-(4-aminophenyl)-5-aminobenzimidazole into 250g of N,N-dimethylacetamide solvent at 25°C, After stirring for 10 min, BPDA was added, and the ratio of the amount of 2-(4-aminophenyl)-5-aminobenzimidazole to BPDA was 0.99:1, and the stirring was continued for 5 h, and the obtained polyamic acid resin solution was It is component A, and the measured viscosity of component A is 52,000 centipoise (25°C);

[0043] 2) Preparation of B component: same as Example 1;

[0044] 3) Under the condition of 25°C, mix component A and component B according to the ratio of 80% and 20% by weight respectively, and mechanically stir for 4 hours to obtain a resin that is fully mixed and uniform between the molecules of each component;

[0045] 4) Vacuum defoaming and filtering the uniformly mixed resin, followed by salivation, stretching and thermal imidization according to the conventional process to obtain a dimensionally stable polyim...

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Abstract

The invention discloses a dimensionally-stable polyimide film and a preparation method thereof. According to the weight percentage, the polyimide film is manufactured by evenly mixing 40 to 80 percent of component A, 0 to 60 percent of component B and 0 to 60 percent of component C and then conducting slobbering and imidization according to a conventional process, wherein the component A is polyamide acid resin solutions obtained after 2-(4-aminophenyl)-5-amido-benzimidazole reacts with pyromellitic dianhydride (PMDA) or biphenyltetracarboxylic acid dianhydride (BPDA); the component B is polyamide acid resin solutions obtained after p-phenylenediamine (PDA) reacts with the PMDA; and the component C is polyamide acid resin solutions obtained after 4,4'-diaminodiphenyl ether (ODA) reacts with the BPDA and the PMDA. The polyimide film provided by the invention has the advantages of lower thermal shrinkage rate, lower thermal expansion coefficient, higher elastic modulus and higher tensile strength and reflects better dimensional stability. The whole preparation method is simple and is easy to operate.

Description

technical field [0001] The invention relates to a polyimide film, in particular to a dimensionally stable polyimide film and a preparation method thereof. Background technique [0002] Polyimide film is an insulating material with excellent heat resistance, which is widely used in electronics, electrical engineering, aerospace and other industries. For polyimide films used in flexible circuit boards and other fields, on the basis of excellent heat and cold resistance, radiation resistance, and insulation reliability, they also need to have stability with small dimensional changes to the limit. It has low thermal shrinkage rate, low thermal expansion coefficient, or the same thermal expansion coefficient and high modulus as copper foil. The Chinese invention patent with publication number CN101358034 discloses a dimensionally stable polyimide film and its preparation method, wherein the polyimide film contains the following components: A component: in dimethylacetamide solve...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08G73/10C08J5/18
Inventor 董占林张俊丽韩艳霞
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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