The utility model provides an
electroplating bath body for improving
wafer film forming quality, which is applied to the technical field of
wafer electroplating and comprises a chamber base body, an
anode cage, an ionic membrane frame, an ionic
resistive element and a turbulent flow mechanism, a cation exchange membrane is mounted on the ionic membrane frame, and divides the chamber base body into an
anode chamber and a
cathode chamber; the
anode cage is located in the anode chamber, a plurality of circular baffles are arranged on the anode cage, an annular structure is formed, the interior of the anode cage is divided into a plurality of annular areas, and the heights of the circular baffles are different; the
ion resistive element and the turbulent flow mechanism are located in the
cathode chamber, the
ion resistive element is provided with an overflowing area, and the overflowing area is composed of a plurality of overflowing holes; the turbulent flow mechanism comprises a turbulent flow plate and a driving
assembly, and the turbulent flow plate is driven by the driving
assembly to do reciprocating translation. Through mutual cooperation of the anode cage, the
ion resistive element and the turbulent flow mechanism,
ion distribution and fluid movement in the cavity are regulated and controlled together, and the uniformity of ion and flow field distribution is improved.