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75 results about "Plasma current" patented technology

Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer

A method of forming a conductor in a thin film structure on a semiconductor substrate includes forming high aspect ratio openings in a base layer having vertical side walls, depositing a dielectric barrier layer comprising a dielectric compound of a barrier metal on the surfaces of the high aspect ratio openings including the vertical side walls, depositing a metal barrier layer comprising the barrier metal on the first barrier layer, depositing a main conductor species seed layer on the metal barrier layer and depositing a main conductor layer. The method further includes annealing the main conductor layer by (a) directing light from an array of continuous wave lasers into a line of light extending at least partially across the thin film structure, and (b) translating the line of light relative to the thin film structure in a direction transverse to the line of light. The method of Claim 1 further comprising, prior to the annealing step, depositing an amorphous carbon optical absorber layer on the main conductor layer. The step of depositing an amorphous carbon optical absorber layer includes introducing a carbon-containing process gas into a reactor chamber containing the substrate in a process zone of the reactor, applying RF source power to an external reentrant conduit of the reactor to generate a reentrant toroidal RF plasma current passing through the process zone and applying a bias voltage to the substrate.
Owner:APPLIED MATERIALS INC

Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer

A method of forming a conductor in a thin film structure on a semiconductor substrate includes forming high aspect ratio openings in a base layer having vertical side walls, depositing a dielectric barrier layer comprising a dielectric compound of a barrier metal on the surfaces of the high aspect ratio openings including the vertical side walls, depositing a metal barrier layer comprising the barrier metal on the first barrier layer, depositing a main conductor species seed layer on the metal barrier layer and depositing a main conductor layer. The method further includes annealing the main conductor layer by (a) directing light from an array of continuous wave lasers into a line of light extending at least partially across the thin film structure, and (b) translating the line of light relative to the thin film structure in a direction transverse to the line of light. The method of Claim 1 further comprising, prior to the annealing step, depositing an amorphous carbon optical absorber layer on the main conductor layer. The step of depositing an amorphous carbon optical absorber layer includes introducing a carbon-containing process gas into a reactor chamber containing the substrate in a process zone of the reactor, applying RF source power to an external reentrant conduit of the reactor to generate a reentrant toroidal RF plasma current passing through the process zone and applying a bias voltage to the substrate.
Owner:APPLIED MATERIALS INC

Plasma immersion ion implantation with highly uniform chamber seasoning process for a toroidal source reactor

A method is provided for performing plasma immersion ion implantation with a highly uniform seasoning film on the interior of a reactor chamber having a ceiling and a cylindrical side wall and a wafer support pedestal facing the ceiling. The method includes providing a gas distribution ring with plural gas injection orifices on a periphery of a wafer support pedestal, the orifices facing radially outwardly from the wafer support pedestal. Silicon-containing gas is introduced through the gas distribution orifices of the ring to establish a radially outward flow pattern of the silicon-containing gas. The reactor includes pairs of conduit ports in the ceiling adjacent the side wall at opposing sides thereof and respective external conduits generally spanning the diameter of the chamber and coupled to respective pairs of the ports. The method further includes injecting oxygen gas through the conduit ports into the chamber to establish an axially downward flow pattern of oxygen gas in the chamber. RF power is coupled into the interior of each of the conduits to generate a toroidal plasma current of SixOy species passing through the chamber to deposit a seasoning layer of a SixOy material on surfaces within the chamber, while leaving the pedestal without a wafer so as to expose a wafer support surface of the pedestal.
Owner:APPLIED MATERIALS INC

Polarized electron cyclotron emission (ECE) diagnosis system for measuring plasma current distribution

The present invention belongs to the nuclear fusion plasma diagnosis field, in particular relates to a polarized ECE diagnosis system for measuring the plasma current distribution and the safety factor distribution. The system is composed of a frequency sweep source, a signal generator, a frequency multiplier, a mixer, an isolator, a polarized antenna system, an intermediate frequency system, a demodulation system, a video amplification system, a data acquisition and analysis system and the like. By measuring a polarized distribution ratio of the ECE, a pitch angle of the magnetic field distribution, the plasma current distribution and the safety factor q distribution are obtained. According to the present invention, by utilizing the basic properties of an X mold and an O mold of an ECE wave and by two antenna channels, the intensity ratio of the ECE waves of different angles is measured, and the pitch angle of the magnetic field distribution is obtained, and further the current distribution and the safety factor distribution are obtained. The measurement of the system is not influenced by the external conditions, such as the plasma heating, etc., to be the passive measurement, so that the data of the current distribution and the safety factor distribution can be obtained at any time.
Owner:SOUTHWESTERN INST OF PHYSICS

Welding gun pose-variable closed geometric component GMAW added material manufacturing method

The invention provides a welding gun pose-variable closed geometric component GMAW added material manufacturing method. A closed geometric component consists of multiple layers of single-way thin-wall pieces connected end to end; an angle between the growth direction of a forming layer and a projection thereof on a substrate plane is smaller than and equal to 90 degrees; the method adopts a method for controlling the arc starting and quenching end joint quantity of the forming layer to improve the forming quality in the end-to-end connecting place; in the forming process, a welding gun gesture is adjusted to enable a welding gun to always point to the growth direction of the forming layer; and the generated arc force and plasma current force direction is parallel to the growth direction of the forming layer, so that the improvement of the stability of a molten pool of the forming layer is facilitated, and the large-dip-angle growth of the forming layer is realized. The method effectively overcomes the difficulties of weak forming quality of the end-to-end connecting place of the closed geometric component and low inclined surface forming capacity, is simple in operation, and is easy to realize automation of the GMAW added material manufacturing process.
Owner:SOUTHWEST JIAOTONG UNIV
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