Method for preparing polyimide multilayer complex films containing inorganic nanometer powder

A multi-layer composite film, inorganic nano technology, applied in the fields of insulating materials and heat resistance, can solve problems such as the reduction of mechanical properties, and achieve the effects of convenient operation, simple process and improved mechanical properties

Inactive Publication Date: 2010-08-25
HARBIN UNIV OF SCI & TECH +1
View PDF0 Cites 22 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method solves the problem that the mechanical properties of the polyimide film are reduced after the introduction of inorganic fillers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] (1) 5g of nano-silica, 0.5g of 3-aminopropyltrimethoxysilane and 60ml of absolute ethanol were stirred at 60°C and carried out intermittent ultrasonication after drying, and the reflux reaction was completed after 0.5 hours. The reacted nano-powder is washed with absolute ethanol, then dried in an ordinary oven for 5 hours, taken out, ground with a mortar and put into a desiccator for standby.

[0023] (2) Dissolve 2.84g of 4,4'-diaminodiphenyl ether in 50ml of N,N-dimethylacetamide, stir at a certain speed to dissolve completely, and then add 3.12 g pyromellitic dianhydride to prepare a polyamic acid solution with high molecular weight.

[0024] (3) Dissolve 0.15 g of the nano-silica powder prepared in step 1 in 10 ml of N, N-dimethylacetamide, and add it to the polyamic acid solution dropwise after ultrasonic dispersion for 30 minutes, and continue Stir mechanically for 1 hour.

[0025] (4) After filtering the glue, first place the polyamic acid glue containing inor...

Embodiment 2

[0030] (1) Stir 5g of dried nano-titanium dioxide, 0.25g of 3-methacryloxypropyltrimethoxysilane and 40ml of absolute ethanol at 70°C and perform intermittent ultrasonication, and condense and reflux for 2 hours At the end, the reacted nano-powder is washed with absolute ethanol, then dried in an ordinary oven for 5 hours, taken out, ground with a mortar and put into a desiccator for later use.

[0031] (2) Dissolve 2.74g of 4,4'-diaminodiphenyl ether in 40ml of N,N-dimethylacetamide, stir at a certain speed to dissolve it completely, and then add 3.06 g pyromellitic dianhydride to prepare a polyamic acid solution with high molecular weight.

[0032] (3) Dissolve 0.10 g of nano-titanium dioxide prepared in step 1 in 20 ml of 4,4′-diaminodiphenyl ether, use ultrasonic dispersion for 1 hour, and then add it dropwise to the polyamic acid solution, and continue mechanical stirring for 1 hour Hour.

[0033] Carry out film laying by the method described in step (4) (5) (6) (7) in ...

Embodiment 3

[0035] (1) Stir the dried 5g of nano-alumina, 0.2g of vinyltriethoxysilane and 50ml of absolute ethanol at 80°C and perform intermittent ultrasonication, condensing and refluxing the reaction for 4 hours to end, and the reacted The nanopowder is washed with absolute ethanol, then dried in an ordinary oven for 5 hours, taken out, ground with a mortar and put into a desiccator for later use.

[0036] (2) Dissolve 2.6g of 4,4'-diaminodiphenyl ether in 40ml of N,N-dimethylacetamide, stir at a certain speed to dissolve it completely, and then add 2.96g Pyromellitic dianhydride to prepare a polyamic acid solution with high molecular weight.

[0037] (3) Dissolve 0.2 g of the nano-alumina prepared in step 1 in 30 ml of N, N-dimethylacetamide, and use ultrasonic dispersion for 20 minutes to add dropwise to the polyamic acid solution, and continue mechanical stirring for 1 Hour.

[0038] According to the method described in step (4)(5)(6)(7) in Example 1, film laying, the thermal imi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
tensile strengthaaaaaaaaaa
tensile strengthaaaaaaaaaa
elongation at breakaaaaaaaaaa
Login to view more

Abstract

The invention relates to a method for preparing polyimide multilayer complex films containing inorganic nanometer powder. Polyimide multilayer complex materials containing inorganic nanometer powder often reduce the mechanical property of films, and obviously reduce the property of the films especially when the nanometer powder is unevenly distributed. The method comprises the following steps of: (1) pre-processing the inorganic nanometer powder; (2) dissolving 4, 4'- diaminodiphenyl ether and pyromellitic dianhydride as raw material monomers into a solvent, and polymerizing to generate polyamic acid solution; (3) dispersing the pre-processed inorganic nanometer powder to the solvent through an ultrasound, and adding the solvent to the polyamic acid solution to prepare the polyamic acid solution containing the inorganic nanometer powder; (4) sequentially paving films on the polyamic acid solution containing the inorganic nanometer powder and the pure polyamic acid solution; and (5) putting the films in an oven for hot-imidization treatment at the temperature of 50 to 400 DEG C to obtain the polyimide hybrid multilayer complex films containing the inorganic nanometer powder. The invention is used for preparing the polyimide multilayer complex films containing the inorganic nanometer powder.

Description

Technical field: [0001] The invention relates to a heat-resistant and insulating material, in particular to a preparation method of a polyimide multilayer composite film containing inorganic nanometer powder. Background technique: [0002] Polyimide is a ring-chain polymer compound containing an imide ring structure in the main chain of the molecule, and is a heterocyclic compound with a semi-ladder structure. Due to the aromatic ring in the framework, the polymer has higher thermal stability, and it is also the polymer material with the highest heat resistance level in industrial applications so far. Because there are very stable aromatic heterocyclic structural units in the polyimide molecule, it has excellent thermal properties, mechanical properties and electrical properties unmatched by other polymers, so it is widely used in electrical insulation, aerospace and microelectronics industries. and other fields have been widely applied. However, with the development of sc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08K9/06
Inventor 刘立柱武天祥翁凌周佩君朱兴松高琳宋玉侠杨立倩
Owner HARBIN UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap