33 results about "4,4'-Oxydianiline" patented technology

It is equipped with a negative-electrode current collector, and a negative-electrode mixture-material layer comprising a negative-electrode mixture material that includes a negative-electrode active material containing silicon (Si) and a binding agent at least, the negative-electrode mixture-material layer being formed on a surface of the negative-electrode current collector; andthe binding agent includes a polyimide-silica hybrid resin being made by subjecting a silane-modified polyamic acid to sol-gel curing and dehydration ring-closing, the silane-modified polyamic acid being expressed by the following formula (wherein: “R1” specifies an aromatic tetracarboxylic dianhydride residue including 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue in an amount of 90% by mole or more; “R2” specifies an aromatic diamine residue including a 4,4′-diaminodiphenyl ether residue in an amount of 90% by mole or more; “R3” specifies an alkyl group whose number of carbon atoms is from 1 to 8; “R4” specifies an alkyl group or an alkoxy group whose number of carbon atoms is from 1 to 8 independently of one another; “q” is from 1 to 5,000; “r” is from 1 to 1,000; and “m” is from 1 to 100).

The present invention provides a carbon black-dispersed polyamic acid solution composition having a high solids content and a high carbon black content. The invention further provides an intermediate transfer belt using the polyamic acid solution composition. The carbon black-dispersed polyamic acid solution composition is obtained by uniformly dispersing carbon black in a polyamic acid solution obtained by reacting biphenyltetracarboxylic dianhydride and an aromatic diamine in an organic polar solvent. The biphenyltetracarboxylic dianhydride includes 2,3,3′,4′-biphenyltetracarboxylic dianhydride and 3,3′,4,4′-biphenyltetracarboxylic dianhydride. The aromatic diamine includes 4,4′-diaminodiphenyl ether and p-phenylenediamine. The polyamic acid solution has a solids content of 25 weight % or more.

The invention relates to a self-lubricating polyamidoimide enamelled wire paint preparation method, which comprises the following steps: 1)preparation method of polyamidoimide resin: employing dimethyl acetamide, 4,4'-diaminodiphenyl ether, dissolving and then adding pyromellitic dianhydride by eight batches, stirring and reacting until the color is transparent; 2)preparation method of wax slurry: adding xylene and wax under stirring, gradually heating from room temperature to 100-120 DEG C in 3-5 hours, insulating for 2-3 hours, cooling to room temperature; and 3)preparation method of the enamelled wire paint: taking polyamidoimide resin and wax slurry, stirring and uniformly mixing, heating to 160-180 DEG C, insulating for 10-20 hours, and cooling to room temperature to obtain the self-lubricating polyamidoimide enamelled wire. According to the invention, wax slurry with good lubricity is introduced in the polyamidoimide enamelled wire, maximum static friction coefficient of the enamelled wire is reduced, and the maximum static friction coefficient of the enamelled wire is about 0.060.

A polyimide film with advantageous handleability, flexibility, dimensional stability and heat resistance is provided. The polyimide film is characterized by block-copolymerizing an aromatic diamine component comprising 10˜25 mol % of paraphenylenediamine (a1) and 75˜90 mol % of 4,4′-diaminodiphenyl ether (a2) with an aromatic tetracarboxylic acid component consisting of 75˜99.9 mol % of pyromellitic acid dianhydride (b1) and 0.1˜25 mol % of 3,3′,4,4′-biphenyl tetracarboxylic acid dianhydride (b2). The Young's modulus, linear expansion coefficient, water absorption rate and glass transition temperature of such polyimide films can be controlled within very useful ranges.

Disclosed is a polyimide film which exhibits high adherability to a metal foil via an adhesive layer containing a thermoplastic polyimide without requiring a special surface treatment. Specifically disclosed is a non-thermoplastic polyimide film obtained by imidizing a polyamic acid solution which is obtained from aromatic diamine and aromatic acid dianhydride. This non-thermoplastic polyimide film is characterized in that the aromatic diamine contains 4,4′-diaminodiphenylether and bis{4-(4-aminophenoxy)phenyl}propane, and the solution containing a polyamic acid is obtained by a specific production method.

The invention relates to a preparation method of high-performance organic fibers, particularly a preparation method of high-performance organic fibers on the basis of 4,4'-diaminodiphenyl ether. The invention aims to solve the common problems of poor interfacial binding property and low interfacial shear strength between fibers and resin substrate due to smooth surface, low activity and low soakage tendency with resin in the traditional PBO (poly(p-phenylene-2,6-benzobisoxazole)) fibers. The method comprises the following steps: adding 4,6-diamino-resorcinol hydrochloride, 4,4'-diaminodiphenyl ether, 2,5-dihydroxyterephthalic acid, polyphosphoric acid and phosphorus pentoxide into a polymerization kettle, dissolving by heating, adding phosphorus pentoxide, heating, adding polymethylphenylsiloxane, heating, filtering, degassing, extruding, preparing protofibrils, washing with water, washing with alcohol, washing with alkali, drying, and heating in a nitrogen protective atmosphere to obtain the high-performance organic fibers. The tensile strength of the high-performance organic fibers reaches 2.5-5.5 GPa. The invention is applicable to the field of preparation of organic fibers.

The invention relates to a PES (polyether sulfone) toughened bisphthalonitrile resin material and belongs to the technical field of a thermosetting resin material. The disclosed nitrile-group and side-group containing PES toughened bisphthalonitrile resin material comprises the following components in part by mass: 5 to 20 parts of nitrile-group and side-group containing PES, 3 parts of curing agent 4,4minute-diaminodiphenyl ether sulfone and 100 parts of bisphthalonitrile low polymer. In the preparing process, the raw materials are mixed in part by mass and are stirred and blended in an NMP, filtrate is dried on a sample disk to obtain a sample sheet and then the sample sheet is heated and cured in the range of 240 to 350 DEG C. The nitrile-group and side-group containing PES toughened bisphthalonitrile resin prepared by the invention has higher mechanical intensity and toughness than common bisphthalonitrile resin and original heat resistance of a substrate is basically kept; a preparation method of the resin material disclosed by the invention has the characteristics of simple process, convenience for operation and suitability for industrial production.

The invention relates to a preparation method of a polyester enamelled wire paint with good heat resistance capable of being directly welded, which comprises the following steps: 1)preparation method of weldability resin: employing m-phthalic acid, glycol and 4,4'-diaminodiphenyl ether for resin synthesis, placing m-phthalic acid, glycol and 4,4'-diaminodiphenyl ether in a reaction apparatus in order, gradually heating to 200 DEG C while stirring from room temperature, insulating and reacting until color is transparent, pumping under vacuum to a theoretical liquid volume; and 2)taking polyester resin and methylphenol, stirring for one hour at 180 DEG C, cooling to room temperature, adding xylene and stirring for one hour to obtain the polyester enamelled wire paint with good heat resistance capable of being directly welded. The enamelled wire coated by the polyester enamelled wire paint is capable of being directly welded at 450 DEG C, no welding slag is generated after direct welding, thermal shock temperature is more than 175 DEG C, and cut-through temperature is more than 270 DEG C.

The invention relates to a preparation method of high-performance organic fibers, particularly a preparation method of high-performance organic fibers on the basis of 4,4'-diaminodiphenyl ether. The invention aims to solve the common problems of poor interfacial binding property and low interfacial shear strength between fibers and resin substrate due to smooth surface, low activity and low soakage tendency with resin in the traditional PBO (poly(p-phenylene-2,6-benzobisoxazole)) fibers. The method comprises the following steps: adding 4,6-diamino-resorcinol hydrochloride, 4,4'-diaminodiphenyl ether, 2,5-dihydroxyterephthalic acid, polyphosphoric acid and phosphorus pentoxide into a polymerization kettle, dissolving by heating, adding phosphorus pentoxide, heating, adding polymethylphenylsiloxane, heating, filtering, degassing, extruding, preparing protofibrils, washing with water, washing with alcohol, washing with alkali, drying, and heating in a nitrogen protective atmosphere to obtain the high-performance organic fibers. The tensile strength of the high-performance organic fibers reaches 2.5-5.5 GPa. The invention is applicable to the field of preparation of organic fibers.

The present invention provides a carbon black-dispersed polyamic acid solution composition having a high solids content and a high carbon black content. The invention further provides an intermediate transfer belt using the polyamic acid solution composition. The carbon black-dispersed polyamic acid solution composition is obtained by uniformly dispersing carbon black in a polyamic acid solution obtained by reacting biphenyltetracarboxylic dianhydride and an aromatic diamine in an organic polar solvent. The biphenyltetracarboxylic dianhydride includes 2,3,3′,4′-biphenyltetracarboxylic dianhydride and 3,3′,4,4′-biphenyltetracarboxylic dianhydride. The aromatic diamine includes 4,4′-diaminodiphenyl ether and p-phenylenediamine. The polyamic acid solution has a solids content of 25 weight % or more.

The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4′-oxydianiline, a third imaged metal layer, a second electrically insulating layer and a forth imaged metal layer. The circuit board does not have an adhesive layer between the second imaged metal layer and the polyimide bondply or the third imaged layer and the polyimide bondply.

The invention relates to the field of the ceramic / polyimide composite film and the preparation method thereof, and particularly discloses an amorphous calcium-copper-titanium-oxygen ceramic / polyimide composite film and a preparation method thereof.. The film and the method aim to solve the problems that the present crystalline calcium-copper-titanium-oxygen ceramic / polyimide composite film preparation method consumes high energy in sintering crystalline ceramics and the prepared crystalline calcium-copper-titanium-oxygen ceramic / polyimide composite film has lower specific inductive capacity during doping at low density (the mass percentage of the ceramics is lower than 20%). The amorphous calcium-copper-titanium-oxygen ceramic / polyimide composite film is prepared from amorphous calcium-copper-titanium-oxygen ceramic particles, (4, 4')- diaminodiphenyl ether, pyromellitic dianhydride and a solvent. The preparation method is as follows: I, preparing an amorphous calcium-copper-titanium-oxygen ceramic / polyamide acid mixed solution; and II, by the way of heating for imidization after coating application, preparing to obtain the amorphous calcium-copper-titanium-oxygen ceramic / polyimide composite film. The film and the method are applied to the fields of information, electronics and electricity.

The present invention relates to a binder resin composition for an electrode, including a polyamic acid and a solvent, wherein the polyamic acid is (i) a polyamic acid which includes a tetracarboxylic acid component including 10 to 100 mol % of 4,4′-oxydiphthalic acid and 90 to 0 mol % of 3,3′,4,4′-biphenyltetracarboxylic acid and / or pyromellitic acid and a diamine component including an aromatic diamine having 1 to 4 aromatic rings, (ii) a polyamic acid which includes a tetracarboxylic acid component including 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and a diamine component including 10 to 90 mol % of p-phenylene diamine and 90 to 10 mol % of 4,4′-diaminodiphenyl ether, or (iii) a polyamic acid which includes a tetracarboxylic acid component including 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and a diamine component including 40 mol % or more of a bis[4-(4-aminophenoxy)phenyl] compound.