High-temperature-resistant thermoplastic shape memory polyimide and preparation method thereof
A technology of polyimide and polyamic acid, which is applied in the field of polyimide and its preparation, can solve the problems of high temperature application, low glass transition temperature T, poor processing performance, thermal performance, mechanical performance and shape memory performance To achieve excellent thermodynamic effects, ensure stability, and excellent high and low temperature resistance
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specific Embodiment approach 1
[0039] Specific Embodiment 1: This embodiment is a high temperature resistant thermoplastic shape memory polyimide with 4,4'-(hexafluoroisopropylene) diphthalic anhydride and 4,4'-diaminodiphenyl ether as reactive monomers Prepared; the material ratio of the 4,4'-(hexafluoroisopropylene) diphthalic anhydride monomer to the 4,4'-diaminodiphenyl ether monomer is 1:1.
specific Embodiment approach 2
[0040] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the structural formula of a high temperature resistant thermoplastic shape memory polyimide is:
[0041]
[0042] Wherein, the range of n is 128-172. Other steps are the same as in the first embodiment.
specific Embodiment approach 3
[0043] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the weight-average molecular weight of a high-temperature-resistant thermoplastic shape-memory polyimide is 77.8 kg / mol-104.6 kg / mol. Other steps are the same as in the second embodiment.
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