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Polyimide resin synthesis method

A technology of polyimide resin and synthesis method, which is applied in the field of polyimide resin synthesis, can solve problems such as unsatisfactory heat conduction and failure to meet the needs of electronic components, and achieve excellent electrical properties and improve service life.

Inactive Publication Date: 2013-02-20
宁波今山电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, thermally conductive polyimide films are basically dispersed at the nanometer level by compounding inorganic substances with low dielectric constants and polyimide, and through the effect of nanoscale inorganic substances, specific properties or anti-polymeric properties are produced. The performance of imide is improved, but it is not ideal in terms of thermal conductivity, which cannot meet the needs of electronic components in the microelectronics industry

Method used

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Embodiment 1

[0012] A kind of synthesis method of polyimide resin described in this embodiment, described resin solid is by pyromellitic dianhydride (PMDA) and 4,4'-diaminodiphenyl ether (ODA) synthesis reaction The polyamic acid (PAA) that obtains, described heat-conducting nano-powder mixture is Al 2 o 3 (Al2O3), NB (Nitride Boride) and AlN (Aluminum Nitride) are a mixture of three thermally conductive nano-powders, the ratio is calculated in parts by weight: Al 2 o 3 30 parts, NB40 parts, AlN30 parts, total amount is 1((the ratio of part is mixed, and heat-conducting nano-powder mixture accounts for 10% of resin solids total amount; During synthesis, at first pyromellitic dianhydride (PMDA) and 4,4'-diaminodiphenyl ether (ODA) calculates the required reaction amount according to the equimolar ratio (wherein: PMDA: molecular weight 218.12; ODA molecular weight: 200.24), and synthesizes polyamic acid (PAA), and its synthesis process In the process, first place the 4,4'-diaminodiphenyl ...

Embodiment 2

[0017] In the synthesis method of a polyimide resin provided in this embodiment, the heat-conducting nano-powder mixture is Al2O340%, NB50%, AlN60%, and the heat-conducting nano-powder mixture accounts for 30% of the total resin solids. During the synthesis of polyamic acid (PAA), the amount of pyromellitic dianhydride (PMDA) added is 95% of the total calculated amount. After testing, the performance indicators shown in the following table 2 can be achieved:

[0018] Table 2:

[0019]

Embodiment 3

[0021] A kind of synthetic method of polyimide resin that present embodiment provides, described heat-conducting nano-powder mixture is Al 2 o 3 10%, NB20%, AlN20%, heat-conducting nano-powder mixture accounts for 20% of the total resin solids, and during the synthesis of polyamic acid (PAA), the amount of pyromellitic dianhydride (PMDA) added reaches 93%. After testing, the performance indicators shown in Table 3 below can be achieved.

[0022] table 3:

[0023]

[0024]

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Abstract

The present invention discloses a polyimide resin synthesis method. The polyimide resin comprises a thermally conductive nanometer powder mixture and a resin solid, wherein the resin solid is polyamic acid, and the thermally conductive nanometer powder mixture is a mixture of three thermally conductive nanometer powders such as Al2O3, NB and AlN, and is 10-30% of the total amount of the resin solid. During synthesis, pyromellitic dianhydride reacts with 4,4'-diaminodiphenyl ether to obtain polyamic acid, the grinded thermally conductive nanometer powder mixture is added to the polyamic acid according to a certain proportion, then pyromellitic dianhydride is added to control a viscosity of the final reaction product to reach 85000-95000 CP, and deaeration slobbering film formation is performed to obtain the finished product. According to the polyimide resin synthesized by the method, a thermal conductivity coefficient can be more than three times the thermal conductivity coefficient of the ordinary polyimide film, excellent electrical property, excellent thermal property and excellent mechanical property are provided, and a storage life of the electronic component can be substantially improved.

Description

technical field [0001] The invention relates to a synthesis method of polyimide resin. Background technique [0002] Polyimide (PI) is a class of high-performance polymer materials characterized by imide rings. It has excellent dielectric properties, mechanical properties, thermal stability and solvent resistance, and has been widely used in the microelectronics industry. It has a wide range of applications and has become a new material for the connection and protection of electronic components. With the continuous development of integrated circuit manufacturing technology, the size of VLSI is gradually reduced, and the resistance and capacitance (Rc) of metal interconnection cause signal transmission delay, crosstalk and heating of electronic components, which directly affect the performance and service life of the device. . In order to solve the above problems, higher requirements are put forward for polyimide materials - reducing the dielectric constant and improving th...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08K3/22C08K3/38C08K3/28
Inventor 岑建军
Owner 宁波今山电子材料有限公司
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