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Adhesive sheet, metal laminate sheet and printed wiring board

A technology of bonding board and bonding layer, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc.

Active Publication Date: 2008-06-04
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is possible to eliminate apparent film warping, i.e. externalized film warping, etc., but does not address the potential deformation that may be externalized due to high temperature processing, thereby causing curling, which is critical for use in High temperature processing for electronic component applications is especially required

Method used

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  • Adhesive sheet, metal laminate sheet and printed wiring board
  • Adhesive sheet, metal laminate sheet and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0172] Next, the present invention will be explained in more detail by referring to the following Examples and Comparative Examples, which are not to be construed as limiting. Evaluation methods of properties in the following examples are shown below, in which the degree of curl after heat treatment at 300°C is based on the above-mentioned method.

[0173] 1. Thickness of polyimide film

[0174] A micrometer (Millitron (registered trademark) 1245D manufactured by FEINPRUF) was used for the measurement.

[0175] 2. Warpage of polyimide film and board (apparent warpage)

[0176] As shown in Figure 1 (C), the 50mm × 50mm film test piece is stood still on a flat plane to form a concave surface, and the average distance from each vertex on the test piece to the flat plane (h1, h2, h3, h4: unit mm) was taken as the amount of warpage (mm), and a value shown by the percentage (%) of the amount of warpage relative to the distance (35.36 mm) from each vertex on the test piece to the c...

preparation Embodiment 1-3

[0193] A vessel equipped with a nitrogen inlet tube, a thermometer, and a stirring bar was replaced with nitrogen, and ODA was placed therein. Then, add DMAC, after dissolving completes, add PMDA, be 1 / 1 ODA and PMDA at 25 ℃ by being stirred in DMAC by the molar ratio by monomer by 5 hours, regulate monomer addition concentration simultaneously to be 15 mass %, to polymerize the mixture. As a result, a brown viscous polyamic acid solution was obtained.

[0194] AA (15 parts by mass) and IQ (3 parts by mass) were added to the resulting polyamic acid solution (100 parts by mass), and the mixture was applied to a polyester film (COSMOSHINE (registered trademark) A4100, produced by Toyo Boseki Kabushiki Kaisha) on a non-lubricating surface, with a coating width of 740 mm (gap of squeegee / belt 430 μm). The film was dried during continuous passage through a continuous drying oven with 4 drying zones. In each zone, 3 rows of slit-shaped air outlets are respectively set above and b...

preparation Embodiment 4-6

[0215] Using PMDA and BPDA as the aromatic tetracarboxylic dianhydride component and ODA and P-PDA as the diamine component, the four monomers were mixed with PMDA / BPDA / ODA at a molar ratio of 1 / 0.5 / 1 / 0.5 / P-PDA was polymerized in DMF while adjusting the monomer addition concentration to 16% by mass to produce a solution of polyamic acid in DMF. The resulting polyamic acid solution was coated on a stainless steel belt (the gap between the squeegee / belt was 400 μm), and dried in the same manner as in Preparation Examples 1-3. Green films having various thicknesses of 49.5 μm were obtained by peeling the polyamic acid film which became self-supporting after drying from the stainless steel belt, ie, Preparation Examples 4-6. |IM of each GF A -IM B | values ​​are 1.4, 4.2 and 4.8.

[0216] By passing the film through a nitrogen-substituted continuous heat treatment furnace, the obtained GF was heated in 2-steps under the following conditions to carry out imidization reaction: 1...

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Abstract

Disclosed is an adhesive sheet comprising a base film and an adhesive layer formed on at least one side of the base film. The base film is composed of a polyimide film whose degree of curling is not more than 10% after a heat treatment at 300 DEG C. Since this adhesive sheet is suppressed in warping or strain caused by high-temperature treatments, it can be used for electronic devices and the like which are exposed to high temperatures and enables to improve the qualities and yields of the electronic devices and the like.

Description

technical field [0001] The invention relates to a bonded board, a metal-laminate board and a printed circuit board. More specifically, the present invention relates to an adhesive sheet for forming an insulating layer for a printed circuit board, etc., which is used for a flexible printed circuit substrate, etc. the size of parts and reduce their weight; a metal-laminated board in which a metal foil is laminated on the bonded board; and, a printed circuit board obtained by processing the metal-laminated board. Background technique [0002] When an adhesive sheet or an adhesive film is used for an insulating layer formed in a printed circuit board or the like, what is called a prepreg in which a glass fiber cloth is impregnated with an uncured epoxy resin or the like has been used. Prepregs containing aramid fiber cloth instead of glass fiber cloth are already in use. Such a prepreg yields a thick cloth, but cannot be light and thin, and cannot meet the needs of recent year...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/34
CPCH05K3/386B32B15/08H05K3/4626H05K2201/0195H05K2201/0154Y10T428/24628Y10T428/31678B32B27/34
Inventor 前田乡司河原惠造堤正幸吉田武史
Owner TOYOBO CO LTD
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