The invention relates to a
wafer anti-sticking transmission mechanism, which comprises a
machine base, a driving motor, a first eccentric wheel, a sliding piece, a supporting
assembly and a second eccentric wheel, and is characterized in that the supporting
assembly comprises a swinging piece and a rod piece; the rod piece is inserted into the
wafer loading frame to extract the
wafer, the first eccentric wheel is driven by the driving motor to rotate so as to drive the sliding piece to reciprocate in the vertical direction, the second eccentric wheel is further driven by the sliding piece to rotate, and finally the swing pieces on the two sides and the rod piece are driven to swing synchronously. Continuous static contact between the surface of the rod piece and the surface of the wafer is effectively avoided, in the cooling stage after the wafer is subjected to chemical liquid treatment, the
dynamic contact mode can remarkably break the solidification and
crystallization process of a corrosive residual liquid film at a contact point, and therefore the adhesion problem between the rod piece and the wafer is fundamentally solved; along with the completion of the process, the temperature of the wafer is gradually reduced to
room temperature or a preset safe temperature range in a controllable environment; at this time, since adhesion has been successfully prevented, the wafer can be extracted or transferred efficiently and without loss.