Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

50 results about "Chemical exposure" patented technology

High temperature and chemical resistant process for wafer thinning and backside processing

A process which uses a silicone resin to form a wafer-to-carrier bonded package that enables wafer thinning and backside processing while the cured resin exhibits high chemical and thermal resistance. The process is versatile in that the constructed wafer package allows for a wide range of chemical exposures to include dilute acid and base etchants, resist and residue strippers, electroplating chemistries, and also providing use in a range of deposition and etch processes that may exceed 300° C. The process utilizes a mixture of silicone monomers that when applied to semiconductor wafers by a spin-coat application, the result is a planarization of the front side device area, and when a subsequent thin coat is applied will facilitate bonding of the wafer-to-carrier package when heat and pressure are applied. The cured silicone bonded wafer-to-carrier package allows for wafer thinning consistent to industry objectives. Backside processing may include thermal oxide deposition, installed vias, and subsequent metallization in plating baths. Upon completion of a thinned and processed wafer, detachment occurs as described in prior art. Specialty chemical systems which completely dissolves the cured silicone and allows the wafer substrate to be easily rinsed and dried and become available for subsequent processing or final dicing and packaging.
Owner:KMG ELECTRONICS CHEM

High Temperature and Chemical Resistant Process for Wafer Thinning and Backside Processing

A process which uses a silicone resin to form a wafer-to-carrier bonded package that enables wafer thinning and backside processing while the cured resin exhibits high chemical and thermal resistance. The process is versatile in that the constructed wafer package allows for a wide range of chemical exposures to include dilute acid and base etchants, resist and residue strippers, electroplating chemistries, and also providing use in a range of deposition and etch processes that may exceed 300° C. The process utilizes a mixture of silicone monomers that when applied to semiconductor wafers by a spin-coat application, the result is a planarization of the frontside device area, and when a subsequent thin coat is applied will facilitate bonding of the wafer-to-carrier package when heat and pressure are applied. The cured silicone bonded wafer-to-carrier package allows for wafer thinning consistent to industry objectives. Backside processing may include thermal oxide deposition, installed vias, and subsequent metallization in plating baths. Upon completion of a thinned and processed wafer, detachment occurs as described in prior art. Specialty chemical systems which completely dissolves the cured silicone and allows the wafer substrate to be easily rinsed and dried and become available for subsequent processing or final dicing and packaging.
Owner:KMG ELECTRONICS CHEM

Method and system for measuring emission power of ultraviolet lamp in water

The invention discloses a method for measuring the emission power of an ultraviolet lamp in water. The method comprises the following steps of: placing an ultraviolet lamp arranged in a quartz sleevein water, and placing a chemical exposure meter on a perpendicular bisector of the ultraviolet lamp; recording absorbance values of the ultraviolet lamp collected by the chemical exposure meter beforeand after irradiation by controlling positions of the chemical exposure meter at different distances from the ultraviolet lamp; calculating a radiation illuminance curve of the ultraviolet lamp withthe change of distance by a system; fitting the radiation illuminance curve with a radiation illuminance curve calculated by a radiation illuminance calculation formula by the system to obtain the emission power of the ultraviolet lamp. The invention also discloses a system for measuring the emission power of the ultraviolet lamp in water. The method and the system provided by the invention can measure the actual ultraviolet emission power of the combination of the underwater ultraviolet lamp and the quartz sleeve, the cost is low, the operation method is simple and the measurement can be carried out in a conventional laboratory, so that the method and the system can be widely applied to the field of ultraviolet lamps.
Owner:RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products