Miniature atomic air chamber encapsulation apparatus and technology method

An atomic gas chamber and packaging process technology, applied in microstructure technology, welding equipment, opto-mechanical equipment, etc., can solve the problems of mass production difficulty, low production efficiency, and light loss of ordinary glass blowing technology

Inactive Publication Date: 2009-05-27
PEKING UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] (2) Ordinary glass blowing technology is still relatively difficult in mass production, and the production efficiency is very low
[0010] (3) Due to the application of micro-atomic gas cells in many fields, it is necessary to transmit light, such as the micro-rubidium cells in the micro-atomic clock equipment, and the glass gas cells made by ordinary glass blowing technology, the flatness of the surface is relatively low (ie The radius of curvature of the surface is too small), so that the loss of light is serious when passing through

Method used

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  • Miniature atomic air chamber encapsulation apparatus and technology method
  • Miniature atomic air chamber encapsulation apparatus and technology method
  • Miniature atomic air chamber encapsulation apparatus and technology method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] The following embodiments describe in detail the components and design parameters of the miniature gas chamber packaging device.

[0080] This equipment is mainly composed of sample chamber (ie vacuum chamber), vacuum unit, heating and temperature control device, DC high voltage device, air intake device and bonding process monitoring device. like Image 6 As shown, the connection relationship is: the vacuum chamber is connected with the vacuum unit and the air intake device, the latter is used to evacuate or inflate the vacuum chamber; the heating and temperature control device includes the heating wire and temperature measuring probe in the vacuum chamber, and the vacuum chamber and the The temperature control instrument connected to it; the DC high-voltage device includes an insulating indenter and a grounded sample stage in the vacuum chamber, and a DC high-voltage power supply connected to it outside the vacuum chamber; the bonding process monitoring device is conn...

Embodiment 2

[0090] The following examples illustrate in detail that by using the equipment described in the first example above, an inert gas of a certain pressure (such as helium, argon or neon) can be sealed in a micro-gas chamber with a three-layer structure of "glass-perforated silicon wafer-glass". , and ensure that its leak rate is small enough. Proceed as follows:

[0091] First, material selection and preparation: In the above-mentioned three-layer structure of "glass-perforated silicon wafer-glass", the glass sheets on both sides are made of Pyrex heat-resistant glass (thickness 0.2mm-0.5mm) rich in alkali metal oxides, and the middle The samples are double-sided polished P-type single crystal silicon wafers (thickness 0.5mm-5mm). Both the glass and the silicon wafer are cut into small pieces by photolithography, and the size of the silicon wafer is 15mm×15mm; the size of the glass is 8mm×8mm and 20mm×10mm, which are used to package the first side and the second side of the per...

Embodiment 3

[0098] The following examples describe in detail, using the equipment described in Example 1 above and the double-sided bonding packaging process described in Example 2, using the in-situ chemical reaction method of barium azide and rubidium chloride to realize the "glass-drilling" The process of encapsulating metal rubidium in a micro-gas chamber with a three-layer silicon wafer-glass structure. Proceed as follows:

[0099] First, the implementation steps of material selection and preparation, sample cleaning, and first-side bonding are exactly the same as the process steps corresponding to the second embodiment above.

[0100] Second, according to the chemical reaction (BaN 6 +2RbCl→BaCl 2 +3N 2 ↑+2Rb↑) The mass ratio of the balance formula, weigh a certain amount of barium azide (BaN 6 ) and rubidium chloride (RbCl). After the two are mixed, they are added to an appropriate amount of deionized water to form a solution. The reaction mixture is obtained after baking to ...

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Abstract

The invention discloses packaging equipment for a micro atomic gas chamber and a process technology method thereof. The equipment comprises a sample chamber, a pressure bar, a sample wafer, a sample stage, a heating wire, a temperature measurement probe, a vacuum pump connector, an inflation inlet, a direct-current high-voltage power supply, a voltmeter, a resistor, and other measurement and control devices. The method comprises: step 1, the selection of materials; step 2, the processing of the materials; step 3, the washing of the sample wafer; step 4, the bonding of a first surface; step 5, the bonding of a second surface; and step 6, the detection of a sample, and is a method which closes metal rubidium generated by adopting an in-situ chemical reaction method in a micro gas chamber. The method has the advantages that the special equipment is a common high vacuum system which is based on an anode bonding technology principle and adopts a relatively cheap mechanical pump, namely molecular pump air-bleed set; at the same time, inert gas is used to take measures such as the repeated inflation to the vacuum system to clean, the high temperature baking to the local sample wafer to remove gas and so on, to lighten the influence of residual gas and adsorbed gas as far as possible, particularly lighten the oxidation of rubidium.

Description

technical field [0001] The invention relates to a micro-atomic gas chamber packaging equipment and a process technology method, which belongs to the field of micro-electromechanical system (MEMS) manufacturing, and relates to the design and manufacture of a set of special equipment for micro-gas chamber packaging based on the principle of anode bonding and the packaging of micro-gas chambers Related process technologies, especially related to the proprietary process technology of miniature rubidium (Rb) atomic gas chamber packaging. The miniature rubidium atomic gas chamber is the core component of new concept devices such as miniature atomic clocks and miniature magnetometers; these devices have broad application prospects in modern high-tech fields. Background technique [0002] With the development of modern manufacturing technology, the concept of "microsystem" has long been proposed. The size and power consumption of information sensing, storage and processing devices ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
Inventor 郭等柱苏娟汪中陈徐宗张耿民赵兴钰
Owner PEKING UNIV
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