Single light port multipath parallel light reception coupling system assembly packaging device and system thereof
A coupling system and packaging device technology, which is applied in the single optical port multi-channel parallel optical receiving coupling system component packaging device and its system field, can solve the problems of unfavorable mass production, complicated procedures, small installation deviation, etc., and achieve simplification Effects of optical alignment process, reduction of optical packaging cost, and reduction of the number of optical components
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Embodiment 1
[0028] Such as figure 1 As shown, this embodiment provides a packaging device for a single optical port multi-channel parallel light receiving coupling system assembly, including a housing 1, an adapter assembly 2 and a collimator lens 3; the upper surface of the housing 1 is provided with a first concave The groove 12 and the second groove 16, the optical components are coupled and positioned in the first groove 12, the lower surface of the housing 1 is provided with a third groove 17, and one end of the housing 1 is provided with a through hole 11, and the through hole 11 is connected to the second groove 16. The first groove 12 communicates, one end of the collimating lens 3 is connected to the adapter assembly 2, the other end of the collimating lens 3 passes through the through hole 11 to the first groove 12, the first groove 12 and the second groove 16 The first slope 14 and the second slope 15 are respectively provided on adjacent side walls, the second slope 15 is prov...
Embodiment 2
[0033] This embodiment is a specific application of the single optical port multi-channel parallel optical receiving coupling system component packaging device in the above-mentioned embodiment 1 in the optical packaging of the receiving end of the 100G high-speed LAN-WDM optical module. Such as Figure 5As shown, a LAN-WDM optical demultiplexer 5 is coupled and fixed on the island boss 13 of the first groove 12, the flexible circuit 6 is mounted on a metal heat sink 7, a four-channel PD chip array 8 and A four-channel TIA chip 9 is installed on the flexible circuit board 6 through a high-precision placement machine, and then through gold wire bonding (Wire Bonding), to realize the electrical performance connection between the soft belt and the PD chip and the TIA chip; the flexible circuit is mounted The metal heat sink 7 of the plate 6 is fixed on the lower surface of the housing 1 by optical glue 4, the PD chip array 8 and the four-channel TIA chip 9 on the flexible circuit...
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