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Light-emitting diode module

A technology of light-emitting diodes and electrodes, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., and can solve the problems that light-emitting diodes cannot improve process efficiency, etc.

Inactive Publication Date: 2013-05-08
FENG CHIA UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] According to patents such as Taiwan Patent No. I234300 and No. M288432, both of them disclose that there are temperature sensing components inside the light emitting diode, although the temperature sensing component mentioned above can be built in the light emitting diode and measured The reaction temperature of light-emitting diodes when they emit light, but the disclosed temperature sensing components and light-emitting diodes are assembled after being manufactured in different processes, so the process efficiency cannot be improved in the process of mass-produced light-emitting diodes

Method used

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Embodiment Construction

[0028] Please refer to Fig. 1 to Fig. 2, those shown in the figure are the selected embodiment structures of the present invention, which are for illustration purposes only, and are not limited by such structures in the patent application.

[0029] This embodiment provides a light-emitting diode module, as shown in Figures 1 to 2, the light-emitting diode module is mainly provided with a light-emitting diode die 2 on a silicon substrate 1, the silicon substrate 1 is molded at one time by a semiconductor process, and a temperature-sensitive measuring unit 3 and a light sensing unit 4, wherein the temperature sensing unit 3 is set at the bottom of the light emitting diode die 2, the light sensing unit 4 is distributed around the light emitting diode die 2, and the light emitting diode die The particle 2, the temperature sensing unit 3 and the light sensing unit 4 are packaged on the silicon substrate 1 within the scope of an optical encapsulation colloid 5, the optical encapsulat...

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Abstract

The present invention provides a light-emitting diode module which is provided with a light-emitting diode crystal grain on at least one silicon substrate. On the silicon substrate, a temperature sensing unit and a light sensing unit are formed in one time through a semiconductor process, wherein the temperature sensing unit is provided at the bottom of the light-emitting diode crystal grain. Furthermore the light sensing unit is arranged at the periphery of the light-emitting diode crystal grain. The light-emitting diode crystal grain is packaged in the range of optical packaging colloid on the silicon substrate. Furthermore the light-emitting diode crystal grain, the temperature sensing unit and the light sensing unit are respectively connected with a plurality of electrodes electrically. The plurality of electrodes can be electrically connected with an outer component.

Description

technical field [0001] The invention relates to a light-emitting diode, especially a light-emitting diode with temperature sensing and light sensing. Background technique [0002] Due to the characteristics of high luminous efficiency, long service life and low power consumption of light-emitting diodes (Light Emitting Diode, LED), and under the government's vigorous promotion of indoor and outdoor solid-state lighting, it has gradually replaced traditional high-pollution and high-energy-consuming lighting sources. And the functionality has also been extended from the traditional simple lighting function to multi-functional applications, such as the light-emitting diode visible light communication with considerable development potential in the future. The luminous efficiency is also due to the integration of many additional functions, and the demand for lighting has gradually increased from the previous low brightness. High brightness. [0003] However, LEDs also face more ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544H01L33/02
CPCH01L33/02H01L2924/0002H01L2224/8592H01L25/167H01L33/644H01L2224/49107H01L2224/48091H01L2224/49171H01L23/544H01L2224/73265H01L2924/00014
Inventor 邹庆福黄正翰曾国钧张圣伟
Owner FENG CHIA UNIVERSITY
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