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149results about How to "Reduce signal crosstalk" patented technology

Signal connector

The embodiment of the invention discloses a signal connector. The signal connector comprises a first plug-in connector and a second plug-in connector, wherein the first plug-in connector comprises a signal transmission unit comprising a signal transmission part, a first shielding component and a second shielding component, and a first matched fixing end for containing the signal transmission unit; the second plug-in connector comprises a second matched fixing end for containing a second signal terminal pair and a third shielding component; and when the first plug-in connector is in plug-in connection with the second plug-in connector, a first signal terminal pair and the second signal terminal pair are arranged in a connection way, the third shielding component and a first clamping joint of the signal transmission unit are arranged in a clamping way, the third shielding component is connected with the first shielding component and the second shielding component in a clamping way so as to form an O-shaped shielding cavity structure coating the first signal terminal pair and the second signal terminal pair, and the O-shaped shielding cavity structure is used for shielding the signals transmitted by the first signal terminal pair and the second signal terminal pair. By the embodiment, the signal crosstalk problem of the signal connector in a high-speed system can be solved.
Owner:HUAWEI MACHINERY

Ultrasonic receiving transducer based on Helmholtz resonant cavity

The invention discloses an ultrasonic receiving transducer based on a Helmholtz resonant cavity. The ultrasonic receiving transducer based on the Helmholtz resonant cavity comprises the Helmholtz resonant cavity and an MEMS piezoelectric ultrasonic transducer which are combined through bonding, wherein the MEMS piezoelectric ultrasonic transducer is composed of a piezoelectric laminated structureand a silicon substrate with a cavity body, the Helmholtz resonant cavity is composed of a silicon structure with a cavity body and an upper opening, the silicon structure is located above the piezoelectric laminated structure, a Helmholtz resonant cavity hole is formed in the upper opening, and air in the Helmholtz resonant cavity hole forms an air column of the Helmholtz resonant cavity; the middle part of the silicon substrate structure with the cavity body and at the bottom is etched to form a bulged silicon substrate strut, an annular groove is etched in the piezoelectric laminated structure around the silicon substrate strut, a plurality of radial grooves are etched in the piezoelectric laminated structure by taking the silicon substrate strut as a center, and the piezoelectric laminated structure is partitioned into a plurality of fan-shaped structures or a plurality of trapezoidal structures; and the plurality of fan-shaped structures or the plurality of trapezoidal structuresform a cantilever beam, one end, making contact with the silicon substrate strut, of the cantilever beam, forms a fixed end, and one end, away from the silicon substrate strut, of the cantilever beam,forms a free end. The performance of the ultrasonic receiving transducer can be improved.
Owner:武汉敏声新技术有限公司

Electric connector

InactiveCN105261892AReduce signal crosstalkImprove high frequency transmission capabilityCoupling protective earth/shielding arrangementsMechanical engineeringMetal
The invention relates to an electric connector comprising an insulation body, two terminal module groups and a metal housing. The insulation body comprises a main body part and a plate-shaped abutted-connection part extending forward from the main body part. The abutted-connection part comprises an upper surface and a lower surface which are opposite and a front end surface and two side surfaces positioned between the upper surface and the lower surface. Each terminal module group comprises an insulation block and a row of conductive terminals fixed on the insulation block. Each conductive terminal comprises a grounding terminal and several differential signal terminals. Each conductive terminal comprises contact parts arranged on the upper surface and the lower surface. The metal housing circles around the outer sides of the terminal module groups. The electric connector is also provided with a metal shielding sheet positioned between the upper surface and the lower surface of the abutted-connection part. The shielding sheet is provided with at least one through hole and an elastic arm extending upwards or downwards in a projection mode from the inner edge of each through hole. Each insulation block is provided with at least one groove used for accommodating the elastic arm. The contacts parts of the grounding terminal are exposed outside of the groove to make contact with the elastic arm. The electric connector of the invention can reduce signal crosstalk.
Owner:LUXSHARE ELECTRONICS TECH (KUNSHAN) LTD

High-density type parallel transmission optical device

The invention discloses a high-density type parallel transmission optical device which is applicable to a CXP encapsulating and plug type optical device and a CXP active optical cable (AOC), wherein the CXP encapsulating and plug type optical device and the CXP AOC are applied to data communication currently. The high-density type parallel transmission optical device comprises a transmitting PCB, a receiving PCB, a multi-path transmitting chip, a multi-path receiving chip, a transmission driving chip, a receiving amplifying chip, multi-path lens arrays, sealing cover plates and a connecting line, wherein the number of the multi-path lens arrays is two, and the number of the sealing cover plates is two. The high-density type parallel transmission optical device is characterized in that the parallel transmission optical device further comprises a changeover array optical fiber jumper assembly. The high-density type parallel transmission optical device is capable of effectively reducing the surface-mounting accuracy requirements of the multi-path transmitting chip and the multi-path receiving chip to further reduce encapsulating difficulty, effectively solving the signal crosstalk problem and the radiating problem, and improving the performance stability.
Owner:WUHAN TELECOMM DEVICES

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

A package for reducing signal cross talk between wire bonds of semiconductor packages. The package includes a semiconductor die having a plurality of bond pads formed thereon. The bond pads arranged in a first subset of bond pads and a second subset of bond pads. The package also includes a substrate having a plurality of contact points, the plurality of contact points are arranged in a first subset of contact points and a second subset of contact points. To reduce signal cross talk, the wire bonds are arranged such that a first subset of wire bonds are electrically coupled between the first subset of bond pads and the first subset of the contact points. The first subset of wire bonds have ball bonds formed on the first subset of bond pads and stitch bonds formed on the first subset of contact points respectively. A second subset of wire bonds are electrically coupled between the second subset of bond pads and the second subset of the contact points. The second subset of wire bonds have stitch bonds formed on the first subset of bond pads and ball bonds formed on the first subset of contact points respectively. The different height profiles of the first set and the second set of wire bonds tends to reduce signal cross talk between the wires.
Owner:LSI CORPORATION

Electrical connector assembly

The invention discloses an electrical connector assembly. The electrical connector assembly comprises a first connector, an intermediate shielding sheet arranged on a first insulating body and locatedbetween two rows of first terminal groups, a second connector, an intermediate iron sheet arranged on a second insulating body and located between two rows of second terminal groups, wherein the intermediate iron sheet comprises a main body part, and at least one elastic abutting joint portion and at least one abutting portion are bent and extended from the main body portion in a vertical direction; the elastic abutting portion is located in front of the abutting portion, and the abutting portion abuts against the second ground terminal to form a ground loop, and enhance the grounding effectof the electrical connector assembly; when the second connector is in butt joint with the first connector, the second ground terminal is in contact with a first ground terminal, the elastic abutting joint portion elastically abuts against the intermediate shielding sheet or the first grounding terminal in the vertical direction, so that resonance generated by the intermediate shielding sheet and the intermediate iron sheet is effectively eliminated, the signal transmission efficiency and quality of the electrical connector assembly are improved, and safety guarantee is provided for the use ofthe electrical connector assembly and electrical equipment thereof.
Owner:DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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