Optical module including silicon photonics chip and coupler chip

Abstract

An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

Description

RELATED APPLICATIONS[0001]This application claims the benefit under 35 U.S.C. §119(e) to U.S. Application No. 62 / 131,971 filed on Mar. 12, 2015; U.S. Application No. 62 / 131,989 filed on Mar. 12, 2015; U.S. Application No. 62 / 132,739 filed on Mar. 13, 2015; U.S. Application No. 62 / 134,166 filed on Mar. 17, 2015; U.S. Application No. 62 / 134,173 filed on Mar. 17, 2015; U.S. Application No. 62 / 134,229 filed on Mar. 17, 2015; U.S. Application No. 62 / 158,029 filed on May 7, 2015; and U.S. Application No. 62 / 215,932 filed on Sep. 9, 2015. The entire contents of each of U.S. Application No. 62 / 131,971; 62 / 131,989; 62 / 132,739; 62 / 134,166; 62 / 134,173; 62 / 134,229; 62 / 158,029; and 62 / 215,932 are hereby incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to optical modules. More specifically, the present invention relates to optical modules with Silicon Photonic devices.[0004]2. Description of the Related Art[0005]The use...

AI Technical Summary

Benefits of technology

The present invention provides an optical module that includes a waveguide interconnect that transfers light signals between a Silicon Photonics chip and a coupler chip. The coupler chip can change the size of a beam defined by the light signals, and includes a multiplexer and a demultiplexer for optical signal processing. The optical module also includes a spacer that attaches the Silicon Photonics chip and the coupler chip, with the coupler chip including alignment protrusions and a point contact for precise alignment. The optical module can be used in a transceiver with a latch for easy detachment of the coupler chip. The cross-sectional size of the beam is preferably largest at an interface between the Silicon Photonics chip and the coupler chip. The optical module also includes a printed circuit board and a housing for protection and easy installation. The technical effects of the present invention include improved optical signal processing, simplified assembly, and improved reliability.

Problems solved by technology

Although optical interconnects are already present in the heart of telecommunication networks (transoceanic networks, metropolitan and access networks, etc.), they have not yet reached the level of integration and cost and energy efficiency sufficient to supplant electrical interconnects on short links.

Optical interconnects based on vertical cavity surface emitting lasers (VCSELs) are, for example, still ten times more expensive than electrical interconnects.

The expense associated with coupling light into and out of a Silicon Photonics element has limited commercial viability for optically based short links.

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