A method of
processing a
wafer having a plurality of streets formed on the front surface in a lattice pattern and a plurality of devices formed in a plurality of areas sectioned by the plurality of streets, comprising an
adhesive tape amounting step for mounting the front surface of the outer
peripheral portion of an
adhesive tape having an
adhesive layer on the front surface and a plurality of via holes onto an opening of an annular frame to cover it; a frame fixing step for placing the rear surface of the adhesive tape mounted on the annular frame on the chuck table for suction-holding a workpiece of a
processing machine and fixing the annular frame; a
wafer affixing step for placing the
wafer on the front surface of the wafer affixing area of the adhesive tape, suction-holding the adhesive tape on the suction-holding area of the chuck table by exerting suction-force to the suction-holding area, and sucking the wafer to
affix it to the front surface of the adhesive tape; and a
processing step for processing the wafer along the streets.