Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

7results about How to "Good surface smoothness" patented technology

ITZO target material and preparation method thereof

PendingCN122277244Ahigh densitystable crystal structurePhysical chemistrySpray pyrolysis
This application relates to the field of oxide target technology, specifically disclosing an ITZO target and its preparation method. The preparation method of the ITZO target includes the following steps: applying an In-containing... 3+ Sn 4+ Zn 2+ A complexing agent is added to the solution to obtain a mixed solution; the mixed solution is then added dropwise to an ammonia solution and aged to obtain a precursor precipitate; the precursor precipitate is then subjected to spray pyrolysis, cold isostatic pressing, and warm isostatic pressing to obtain an ITZO preform; the ITZO preform is then subjected to programmed temperature calcination and programmed temperature cooling to obtain an ITZO target. This application obtains a uniformly composed and highly dense ITZO target by dynamically controlling the composition of the mixed gas during the programmed temperature cooling process through two static pressing treatments; using this target, a transparent conductive film with high visible light transmittance and excellent electrical properties can be prepared by sputtering, solving the technical problems of uneven composition, low density, and poor quality of sputtered films in existing targets.
Owner:XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD

A circuit board drilling device with a stable clamping structure

PendingCN122253290AReduce stress damageReduce the probability of deformationPrinted circuit manufactureMetal working apparatusIntegrated circuit manufacturingIc manufacturing
The application belongs to the technical field of integrated circuit manufacturing, and relates to a circuit board drilling device with a stable clamping structure. The device comprises a shell, the shell is fixedly connected with a connecting frame, the connecting frame is slidably connected with a first electric sliding frame, the first electric sliding frame is slidably connected with a second electric sliding frame, the second electric sliding frame is slidably connected with a third electric sliding frame, the third electric sliding frame is fixedly connected with a shell body, the shell body is rotationally connected with a rotating shaft, the rotating shaft is provided with a drill bit, the rotating shaft is slidably and rotationally connected with a rotating cylinder, the rotating cylinder is rotationally connected with an upper pressing plate, the upper pressing plate is slidably connected with a lower pressing plate, and the lower pressing plate is rotationally connected with a rotating pressing ring. The circuit board is clamped by the rotating pressing ring and the supporting frame. When the circuit board is twisted around the drilling position under stress, the clamping block no longer clamps the circuit board. The circuit board drives the rotating pressing ring to rotate, reduces the stress damage of the circuit board drilling position, and even reduces the probability of deformation of the circuit board, so as to guarantee the accuracy of the circuit board drilling and improve the quality of the circuit board drilling.
Owner:湖南高登电子有限公司

Alumina ceramic substrate material, method of manufacture and use

This invention relates to the field of electronic packaging substrates, and particularly to an alumina ceramic substrate material, its preparation method, and its application. The alumina ceramic substrate comprises 90-99 wt% alumina and 1-10 wt% sintering aids. The sintering aids have the following composition: xB₂O₃·zSiO₂·yBi₂O₃, where 15≦x≦25, 50≦y≦70, 15≦z≦25, and x+y+z=100, where x:y:z is the mass ratio. The density of the alumina ceramic substrate is ≥3.8 g / cm³. 3 The alumina ceramic substrate of this invention has the following characteristics: surface roughness ≤ 0.35 μm, breakdown strength ≥ 35 kV / mm, bending angle ≥ 350 MPa, and thermal conductivity ≥ 25 W / m·K. It also features high density, uniform microstructure, good surface flatness, high mechanical strength, high breakdown strength, low dielectric loss, and high thermal conductivity.
Owner:ZHEJIANG TI YOU SAI NEW MATERIAL CO LTD

Dielectric layer ion membrane, preparation method and application thereof

PendingCN122277969AQuickly respond to migration needsInhibition of mobilityChemical physicsUV curing
This invention provides a dielectric ion exchange membrane, its preparation method, and its application, relating to the field of membrane material preparation technology. The dielectric ion exchange membrane includes a substrate and an ion exchange membrane coated on the surface of the substrate. The ion exchange membrane comprises polyvinyl alcohol, an ion system, a UV-curable monomer, and a photoinitiator. By using UV curing technology, the crosslinking process and solvent evaporation can be precisely controlled during membrane formation, ensuring a smooth membrane surface and avoiding membrane curling caused by uneven shrinkage. The introduction of the UV-curable monomer is to form a crosslinked network under UV irradiation, inhibiting macroscopic structural flow and creep of the ion exchange membrane during film formation and service, improving the mechanical stability of the membrane, and forming a stable crosslinked structure, thereby forming a structurally stable dielectric ion exchange membrane and effectively preventing membrane curling during drying.
Owner:SIXING INTELLIGENT ROBOT (ZHEJIANG) CO LTD

A surface processing method for large-size cadmium zinc telluride substrate

The application discloses a large-size CdZnTe substrate surface processing method, comprising the following steps: obtaining a cut CdZnTe wafer, polishing a first surface of the CdZnTe wafer until the cutting fluctuation on the first surface is removed to obtain a first wafer; thinning a second surface of the CdZnTe wafer, and then mechanically polishing the second surface to obtain a second wafer; taking the second wafer off the thinning carrier, performing X-ray diffraction appearance testing, obtaining an X-ray diffraction appearance graph corresponding to the second wafer, selecting a region with uniform contrast on the X-ray diffraction appearance graph, and marking the corresponding position of the second wafer; according to the marking of the corresponding position of the second wafer, the second wafer is cut into a regular-shaped CdZnTe substrate; the CdZnTe substrate is placed on a polishing carrier for substrate polishing processing, the polished CdZnTe substrate is protected by gluing, and after being taken off the polishing carrier, the CdZnTe substrate is cleaned to obtain a processed CdZnTe substrate.
Owner:11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP

Air-stable sulfide solid-state electrolytes and methods of making the same

This application belongs to the field of lithium-ion battery technology, and specifically discloses an air-stable solid electrolyte. The solid electrolyte includes a core and a hydrophobic layer coating the surface of the core. The core comprises sulfide particles, and the thickness of the hydrophobic layer is 5–30 nm. The solid electrolyte according to the embodiments of this application has a surface-coated hydrophobic layer with low surface activity, exhibiting strong air stability and enabling the fabrication of solid-state batteries with excellent battery performance.
Owner:GUOLIAN CORE MATERIALS (BEIJING) TECHNOLOGY CO LTD

Blasgeformter schaumsotff und verfahren zur herstellung von blasgeformter schaumsotff

UndeterminedAT1898603Treduce weightImprove surface smoothness
A process for producing a blow-molded foam is described. The process includes kneading (S1) a polyolefin-based resin containing a foaming agent mixed therewith in an extruder, and extruding (S3) a parison (32) between split mold blocks from a die slit (21) at an extrusion rate of 700 kg / h or more. Further, a blow-molded foam is described. The blow-molded foam has a wall formed in such a manner that a thermoplastic polyolefin-based resin containing a foaming agent mixed therewith is subjected to blow molding, wherein the wall has a closed cell structure including a plurality of foamed cells, the foamed cells have an average cell diameter of less than 300 µm in the thickness direction of the wall, an outer face of the wall has a center-line average surface roughness Ra of less than 9.0 µm, and the foamed cells have a cell diameter having a standard deviation of less than 40 µm in the thickness direction of the wall.
Owner:KYORAKU CO LTD