38results about How to "Sufficient flatness" patented technology

Anisotropic film laminates for use in image-preserving reflectors such as rearview automotive mirror assemblies, and related methods of fabrication. A film may comprise an anisotropic layer such as a light-polarizing layer and other functional layers. The film having controlled water content is heated under omnidirectional pressure and vacuum to a temperature substantially equal to or above a lower limit of a glass-transition temperature range of the film so as to be laminated to a substrate. The laminate is configured as part of a mirror structure so as to increase contrast of light produced by a light source positioned behind the mirror structure and transmitted through the mirror structure towards a viewer. The mirror structure is devoid of any extended distortion and is characterized by SW and LW values less than 3, more preferably less than 2, and most preferably less than 1.

The present invention relates to a method for forming a heterogeneous assembly of first and second materials having different coefficients of thermal expansion. The method includes bonding a surface of a first substrate of a first material to a surface of a second substrate of a second material wherein the first substrate includes a zone of weakness therein to define a transfer layer adjacent the first surface, providing a stiffening substrate of a third material to maintain sufficient flatness and prevent breakage of the transfer layer during detachment from the first substrate, and detaching the transfer layer from the first substrate along the zone of weakness to form a heterogeneous assembly of the transfer layer and second substrate. The stiffening substrate is bonded to one of the first or second substrates and the third material has a coefficient of thermal expansion that is the same as or close to that of the material of the substrate to which the stiffening substrate is bonded to facilitate a successful detachment of the transfer layer from the first substrate.

There is provided a substrate processing apparatus which can process a substrate by using an electrolytic processing method, while reducing a load upon a CMP processing to the least possible extent. The substrate processing apparatus of the present invention includes: an electrolytic processing unit (36) for electrolytically removing the surface of the substrate W having a to-be-processed film formed in said surface, said unit including a feeding section (373) that comes into contact with said surface of the substrate W; a bevel-etching unit (48) for etching away the to-be-processed film remaining unprocessed at the portion of the substrate that has been in contact with the feeding section (373) in the electrolytic processing unit (36); a chemical mechanical polishing unit (34) for chemically and mechanically polishing the surface of the substrate.

The present invention releases a method of producing a metal separator for a solid polymer fuel cell by stainless steel, titanium, or titanium alloy during which securing lower cost and mass producibility by using a material having a high workability to form a complicated shape by a high productivity, then using an inexpensive blast process to drive a conductive substance into the surface of the metal separator member, that is, provides a stainless steel, titanium, or titanium alloy solid polymer fuel cell separator comprised of stainless steel, titanium, or titanium alloy in the surface of which a low ion release conductive substance is buried, having an arithmetic mean roughness (Ra) of the separator surface of 0.5 to 5.0 μm, having a 10-point mean roughness (Rz) of 3 to 20 μm, having an average spacing of surface relief shapes (Sm) of 300 μm or less, having values of a warp rate and twist rate of a separator of 0.1 or less, and having a contact resistance value with respect to carbon paper of 15 mΩcm² or less at a surface pressure of 1 MPa.

Provided is a group-III nitride semiconductor laser device with a laser cavity enabling a low threshold current, on a semipolar surface of a support base the c-axis of a hexagonal group-III nitride of which tilts toward the m-axis. In a laser structure 13, a first surface 13a is a surface opposite to a second surface 13b and first and second fractured faces 27, 29 extend each from an edge 13c of the first surface 13a to an edge 13d of the second surface 13b. A scribed mark SM1 extending from the edge 13c to the edge 13d is made, for example, at one end of the first fractured face 27, and the scribed mark SM1 or the like has a depressed shape extending from the edge 13c to the edge 13d. The fractured faces 27, 29 are not formed by dry etching and thus are different from the conventional cleaved facets such as c-planes, m-planes, or a-planes. It is feasible to use emission of a band transition enabling a low threshold current.

A magnetic recording medium includes a continuous recording layer, and a seed layer including a surface held in contact with the recording layer. The seed layer includes an oxidized region and a non-oxidized region in the surface held in contact with the recording layer. The recording layer includes a recording magnetic region and a non-recording magnetic region. The recording magnetic region corresponds in position to the non-oxidized region and has perpendicular magnetic anisotropy. The non-recording magnetic region corresponds in position to the oxidized region.

A semiconductor device includes a first wiring layer which is provided above a semiconductor substrate and includes a first insulating film and a wiring buried in the first insulating film, a second insulating film provided above the first wiring layer, a third insulating film provided on the second insulating film, and a capacitor element provided on the third insulating film. The wiring includes an upper surface having a protruding portion. The capacitor element includes a lower electrode provided on the third insulating film, a capacitor insulating film provided on the lower electrode, and an upper electrode provided on the capacitor insulating film.

A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.

The invention relates to the technical field of pipe maintenance equipment, in particular, remote pipe local annular repair equipment and method. The remote pipe local annular repair equipment comprises a detection mechanism, a repair mechanism, an auxiliary mechanism and two small-size intelligent vehicles. The detection mechanism and the repair mechanism are each arranged on the corresponding small-size intelligent vehicle. Each small-size intelligent vehicle comprises a base plate, a lifting plate, an ascending-and-descending block and a small-size hydraulic rod. One end of each lifting plate is in shaft connection with one end of the corresponding base plate in a matched manner. Each small-size hydraulic rod is mounted at the outer side of the corresponding base plate and used for driving the other end of the corresponding lifting plate to move. A top beam bracket is arranged above each base plate in an erected manner. Each ascending-and-descending block is movably arranged at oneend of the corresponding top beam bracket. The bottom of each ascending-and-descending block is in transmission fit with the free end of the corresponding lifting plate. The detection mechanism comprises a CCD camera and a light supplementing device, wherein the CCD camera and the light supplementing device are mounted at the front sides of the ascending-and-descending blocks corresponding to theCCD camera and the light supplementing device. The repair mechanism comprises a first spray head, a second spray head and a third spray head, wherein the first spray head, the second spray head and the third spray head are mounted at the front sides of the ascending-and-descending blocks corresponding to the first spray head, the second spray head and the third spray head. The auxiliary mechanismcomprises a cleaning air bag and a compaction air bag. By means of the remote pipe local annular repair equipment and method, the repair quality can be greatly improved.

A semiconductor package includes an interposer having a separation layer on a rear surface of which a plurality of first recesses is arranged. A plurality of wiring structures is stacked on the separation layer alternately with a plurality of insulation interlayers. A plurality of semiconductor devices is arranged, side by side, on the interposer side and connected to a plurality of the wiring structures. A plurality of contact terminals on the rear surface of the separation layer is connected to the plurality of the wiring structures through the separation layer. A flatness deterioration of the interposer is minimized and the contact surface between the interposer and under fill resin is enlarged.

A lithographic apparatus has a support that is provided with burls for holding an object. The support has been fabricated with a lithographic manufacturing method, e.g., a MEMS-technology, so as to create burls whose orientations or positions are individually electrically controllable.

A method for fabricating a group-III nitride semiconductor laser device stably supplies laser cavity mirrors having a low lasing threshold current through the use of a semi-polar plane. A blade 5g is forced down through a first region ER1 to keep the first region ER1 squeezed between a support member H2 and a movable member H1 together with a part of a protective sheet TF in contact with the first region ER1 while the tension generated in the area of the protective sheet TF in contact with the first region ER1 with the movable member H1 increases until the semi-polar principal surface SF at an end face EG1 of the first region ER1 tilts by a deflection angle THETA from the semi-polar principal surface SF of a second region ER2, and a force is thereby generated in the first region ER1 in a direction opposite to the direction of travel of the blade 5g toward the first region ER1. For example, an angle ALPHA is within the range of 71 degrees to 79 degrees, and the deflection angle THETA is within the range of 11 to 19.

The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed.