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Benzimidazole diamine curing type epoxy adhesive and preparation method thereof

A technology of benzimidazole diamine and epoxy adhesive, which is applied in the direction of adhesive, epoxy resin glue, carboxyl rubber adhesive, etc., can solve the problems of high price, unfavorable large-scale promotion and application, high cost of polyetherimide resin, etc. problems, to achieve the effect of convenient operation, low cost, and industrialized production

Inactive Publication Date: 2011-04-27
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] (2) 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) and other monomers are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • Benzimidazole diamine curing type epoxy adhesive and preparation method thereof
  • Benzimidazole diamine curing type epoxy adhesive and preparation method thereof
  • Benzimidazole diamine curing type epoxy adhesive and preparation method thereof

Examples

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Effect test

Embodiment 1

[0030] 10.0 grams of carboxyl-terminated nitrile rubber (CTBN), 10.0 grams of bisphenol A epoxy resin (E-51), 30.0 grams of NOVOLIC novolac epoxy resin and 60.0 grams of N, N, N', N'-tetraglycidyl - Add the epoxy resin of 3,3'-dimethyl-4,4'-diaminodiphenylmethane into the reaction kettle, stir and react at 90°C for 0.5 hours, cool to 50°C, add 50.0 grams of hydrogenated bisphenol A epoxy resin and 50.0 grams of 3,4-epoxy cyclohexyl carboxylate-3', the reactive diluent of 4'-epoxy cyclohexyl methyl ester, stirred and reacted for 1 hour at 80°C to obtain 210.0 grams of homogeneous Transparent viscous liquid, denoted as B component;

[0031] Mix 60.0 grams of the above B component with 3.0 grams of benzimidazole diamine (APABI) curing agent (A component), and stir evenly at room temperature to obtain the benzimidazole diamine curable epoxy adhesive, denoted as AEA-1 , its differential scanning calorimeter (DSC) scanning pattern (nitrogen atmosphere, heating rate 10 ℃ / min) as ...

Embodiment 2

[0035] 20.0 grams of carboxy-terminated nitrile rubber (CTBN), 100.0 grams of NOVOLIC novolac epoxy resin and 300.0 grams of N, N, N', N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy Put the resin into the reactor, stir and react at 90°C for 0.5 hours, then cool to 50°C, add 500.0 grams of hydrogenated bisphenol A epoxy resin, 200.0 grams of resorcinol diglycidyl ether and 100.0 grams of 3,4-cyclo Oxygen-6-methyl-cyclohexanecarboxylic acid-3', 4'-epoxy-6-methyl-cyclohexyl methyl ester reactive diluent, stirred and reacted at 80°C for 1 hour to obtain 1220.0 g of homogeneous Transparent viscous liquid, denoted as B component;

[0036] Mix 60.0 grams of the above B component with 2.0 grams of benzimidazole diamine (APABI) curing agent (A component), and stir evenly at room temperature to obtain the benzimidazole diamine curable epoxy adhesive, denoted as AEA-2 .

[0037] Take an appropriate amount of the above-mentioned AEA-2 benzimidazole diamine curable epoxy adhesive, an...

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Abstract

The invention relates to a benzimidazole diamine curing type epoxy adhesive and a preparation method thereof. The adhesive is prepared from the following raw materials: a component A, namely a benzimidazole diamine curing agent and a component B, wherein the component B is prepared from terminal carboxyl group butadiene-nitrile rubber, epoxy resin and a reactive diluent. The preparation method comprises the following steps of: (1) adding the terminal carboxyl group butadiene-nitrile rubber and the epoxy resin into a reaction kettle, reacting at the temperature of 90 DEG C with stirring, cooling to the temperature of 50 DEG C, adding the reactive diluent, and stirring at the temperature of 80 DEG C to obtain homogeneous and transparent viscous liquid, namely the component B; and (2) mixingthe components A and B, and stirring uniformly to obtain the adhesive. The tensile shear strength of the adhesive is 33.5MPa at the room temperature, and the adhesive has wide application prospect infields of electronics and microelectronics, rigid copper-clad laminates, motors, aerospace and the like; and the preparation process is simple, is low in cost and is convenient to operate, the resources of reaction raw materials are wide, and the adhesive can be conveniently industrially produced.

Description

technical field [0001] The invention belongs to the field of curable epoxy adhesive and its preparation, in particular to a benzimidazole diamine curable epoxy adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts and is the main component of structural adhesives One; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: the curing of epoxy resin is mainly I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J113/00C09J11/06
Inventor 虞鑫海周超毛蒋莉陈梅芳
Owner DONGHUA UNIV
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