4665results about "Support for heads" patented technology

A rotary microactuator-based head-gimbal assembly design controls the unwanted deflection of a flexure in a data storage device and eliminates hinge deformation. The head-gimbal assembly maintains the co-planarity of the hinged islands in the microactuator under the applied load acting on the flexure and two associated hinged islands. The dimple post is placed at the dimple loading region of the flexure tongue and has the same height as adhesive dams on paddles secured to the hinged islands. The dimple post is formed by branching one of the existing conductive traces covered by a photoresist layer to the dimple loading region on flexure tongue. In an alternative embodiment, the dimple post is secured to the dimple loading region of the flexure tongue by means of adhesives with a variety of viscosity and elastic moduli.

A magnetic head includes a slider body having a trailing surface meeting an air-bearing surface at a trailing edge, with a thin-film transducer disposed on the trailing surface of the slider body near the trailing edge. The thin-film transducer includes a coil embedded between first and second poles. A resistive heating element is disposed adjacent and electrically insulated from, the coil. Application of power to the resistive heating element causes expansion of at least the first and second poles.

A magnetic head includes a slider having an air bearing surface (ABS) and a trailing surface, with a transducer fabricated on the trailing surface. The transducer includes an adjunct pole disposed in a first general plane, the adjunct pole having a front edge that is recessed from the ABS and a rear edge. A main pole of the transducer is formed adjacent the adjunct pole, the main pole having a write tip that extends approximately to the ABS. A write coil having a first layer of turns is disposed in a second general plane below the adjunct pole. The magnetic head further includes a heating element, a portion of the heating element being disposed in the first general plane behind the rear edge of the adjunct pole.

A compact write element includes a conductive shield layer, an insulating write gap layer, a pole pedestal, a coil, and a conductive pole layer, and, in some embodiments also includes a backgap. The pole pedestal and the coil, and, in some embodiments the backgap, constitute a self-aligned array of components that may be formed in a single masking operation to allow for very tight tolerances between the components for a shorter yoke length. The pole layer is substantially flat and parallel to the conductive shield layer, providing for a shorter stack height. Also, a compact MR read/write head includes such a write element and a magnetic data storage and retrieval system includes the compact MR read/write head having such a write element.

A method of manufacturing a magnetic head device includes forming a thin film magnetic head element over a substrate, the thin film magnetic head element including a magnetoresistance (MR) element. The substrate is cut such that the MR element is exposed on a side surface of the substrate. The side surface is then polished. Afterward, a magnetically degenerated layer is removed from the thin film magnetic head element along the side surface. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

To provide a suspension board with circuit that enables its terminals to be bonded to the other terminals with sufficient strength with simple structure, to ensure sufficient bonding reliability, the suspension board with circuit 11 includes a suspension board 12, a base layer 13 formed on the suspension board 12, and a conductive layer 14 formed on the base layer 13 and a cover layer 18 with which the conductive layer 14 is covered, wherein external connection terminals 17 to be bonded to terminals 28 of a read/write board 29 are formed without the suspension board 12 and/or the base layer 13 being formed.

Embodiments of the invention provide a magnetic disk drive which has improved electrical properties owing to a reduction in the loss of transmission line, improved vibration properties owing to a reduction in the stiffness of wiring around the head, and a flat impedance in the transmission line. In one embodiment, a magnetic disk drive comprises a suspension; a magnetic head coupled with the suspension and configured to write and read information to and from a magnetic recording medium; and a transmission line disposed on the suspension to transmit writing and reading information to and from the magnetic head. The transmission line includes a writing line and a reading line, a lower conductor disposed underneath the writing line and the reading line, and an insulating layer interposed between the lower conductor and the writing and reading lines. The lower conductor comprises copper or copper-based alloy and has a thickness of substantially less than 25 μm, desirably about 2-12 μm, and more desirably about 5 μm.

An apparatus that provides for rotation about two axes orthogonal to each other includes a gimbal having two arms adjoining a portion that is mounted to a base for rotation about a first axis. A shaft defining a second axis orthogonal to the first pivotally couples a mounting plate to the arms. The mounting plate has an arcuate edge with first and second parallel grooves therein adapted to receiving a drive cable. A drive cable that is engaged with a drive pulley is aligned by at least one idler pulley with the first and second grooves of the mounting plate. The drive cable has opposing free ends that are received in the first and second grooves of the mounting plate. A motor is coupled to the drive pulley for controlling the drive cable travel, to accordingly rotate the mounting plate to provide for orientating a device in a desired direction.

A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type formed from a laminated sheet of material having a stainless steel layer, a conductive lead layer and an insulating layer separating the stainless steel and conductive lead layers. An aperture is formed through at least the insulating layer to expose the stainless steel layer at an interconnect site. An interconnect mask is applied around the interconnect site. Conductive material is electroplated onto the stainless steel layer at the interconnect site to form a plated interconnect. The mask is then removed. The method is used to form an interconnect bond pad on the same side of the stainless steel layer as the conductive lead layer in one embodiment. In another embodiment the aperture is formed through the insulator layer and the stainless steel layer, and conductive material is built up on the stainless steel layer during the electroplating step until it meets and plates onto the conductive lead layer to form a stainless steel side interconnect. In yet another embodiment the aperture is formed through the insulator layer and the conductive lead layer, and conductive material is built up on the stainless steel layer during the electroplating step until it meets and plates onto the conductive lead layer to form a conductive lead side interconnect.