23 results about "Impedance discontinuity" patented technology

The invention discloses a high-isolation low-loss filtering structure and method for a PCB strip line. According to the high-isolation low-loss filtering structure provided by the invention, the main transmission strip line, the filtering auxiliary strip line with the spur line structure and the grounding layer with the hollowed-out area are integrated in the PCB, so that external discrete filter elements and welding procedures and shielding separation cavities required by the external discrete filter elements are effectively omitted, and therefore, the size of a module is remarkably reduced; weight and complexity. Meanwhile, due to the integrated design, impedance discontinuity and signal reflection caused by the fact that signals are converted between the inner layer and the surface layer of the PCB through the via holes are avoided, and signal integrity is guaranteed. And finally, on the premise of not introducing additional elements, high-performance filtering is realized, and an effective solution is provided for miniaturization and high performance of the radio frequency front-end module.

The application provides a cable accessory fault positioning method and system. The method comprises the following steps: collecting reflection signals of a linear frequency modulation signal reflected at multiple impedance discontinuous points in a cable accessory; arranging all the reflection signals into a reflection signal sequence; selecting a first reflection signal in the reflection signal sequence as a selected signal; identifying bubble migration caused by insulation interface discharge at a reflection position corresponding to the selected signal according to amplitude-frequency characteristics of a nonlinear component in the selected signal; correcting an air gap of a next reflection signal in the reflection signal sequence based on the bubble migration, taking the air gap corrected signal as a new selected signal, repeating the above steps until the last reflection signal in the reflection signal sequence is corrected; and tracing and positioning a fault accessory on the cable according to the linear frequency modulation signal and each air gap corrected reflection signal. The method can eliminate the interference of the gas generated by the discharge at the insulation interface on the reflection signal.

The present application belongs to the technical field of semiconductors. Provided are a packaging structure, an integrated circuit, a memory and an electronic device. The packaging structure comprises: a packaging substrate; a first ball grid array, which is located on a first surface of the packaging substrate and comprises a first metal ball and a second metal ball adjacent to the first metal ball, wherein the first metal ball is electrically coupled to the first surface by means of a first bonding pad, and the second metal ball is electrically coupled to the first surface by means of a second bonding pad; a connecting component, the connecting component being electrically coupled with the first bonding pad; and a functional component, which is connected to the first metal ball by means of the connecting component and comprises a plurality of metal discs and a plurality of metal wires that are located above the second bonding pad, wherein every two adjacent metal discs are connected by means of one metal wire. The present application can reduce far-end crosstalk and impedance discontinuity between the first metal ball and the second metal ball when an electric signal is transmitted by means of the first metal ball.

The application discloses a kind of coplanar waveguide-coaxial transition based on suspended microstrip line, belong to microwave millimeter wave technical field.The transition includes radio frequency coaxial structure, air cavity, coplanar waveguide and L type metal carrier;Wherein, radio frequency coaxial structure and the longitudinal section of L type metal carrier are processed as a whole, and central conductor is extended to form metal probe;Coplanar waveguide structure is placed above the transverse section of L type metal carrier, and the part connected with metal probe is set to gradually change suspended microstrip structure.The application adopts the transition structure of gradually changing suspended microstrip line again to coaxial by coplanar waveguide, by setting gradually changing air cavity below suspended microstrip line, eliminate the adverse effects of assembly gap due to assembly process and machining precision, compensate the mismatch introduced by electromagnetic wave mode change and the impedance discontinuity caused by the existence of assembly gap, so as to realize the transmission of high frequency signal;It also has the advantages of low loss, ultra wide band, simple structure and easy processing.

The present application discloses a circuit for chip testing. The chip includes at least a first peripheral pin and a second peripheral pin. The circuit board has opposite first and second surfaces. The circuit board includes: a first pad and a second pad located on the first surface, the first pad being used for electrically connecting to the first peripheral pin, and the second pad being used for electrically connecting to the second peripheral pin; a first single-ended trace and a second single-ended trace on the same layer, the first single-ended trace being electrically connected to the first pad; the second single-ended trace being electrically connected to the second pad; wherein, the impedances of the first single-ended trace and the second single-ended trace satisfy the same conditions, so that the first single-ended trace and the second single-ended trace can transmit a set of differential signals. When the technical solution of the present application is used for chip high-speed interface testing, it can reduce the influence of the impedance discontinuity of the reference plane in the circuit board on the test result, and improve the test accuracy and reliability.

The invention provides a cable accessory fault positioning method and system. The method comprises the following steps: collecting reflected signals of a linear frequency modulation signal reflected at a plurality of impedance discontinuous points in a cable accessory; arranging all the reflection signals into a reflection signal sequence, selecting a first reflection signal in the reflection signal sequence as a selected signal, and identifying bubble migration generated by discharge of an insulation interface at a reflection position corresponding to the selected signal according to amplitude-frequency characteristics of a nonlinear component in the selected signal; performing air gap correction on the next reflected signal in the reflected signal sequence based on bubble migration, taking the signal after air gap correction as a new selected signal, and repeating the steps until the last reflected signal in the reflected signal sequence is subjected to air gap correction; and tracing and positioning fault accessories on the cable according to the linear frequency modulation signal and the corrected reflection signal of each air gap. By adopting the scheme of the invention, the interference of gas generated by discharge at the insulation interface on a reflection signal can be eliminated.

The invention relates to a structure for compensating impedance discontinuity of a three-dimensional coaxial interconnection link and a design method, the structure is arranged at an impedance discontinuity point of the three-dimensional coaxial interconnection link which comprises coaxial through silicon vias and is interconnected with a rewiring layer, and the structure is composed of two coaxial through silicon via stubs which are connected in parallel on the rewiring layer; the design method is used for determining the length of two coaxial through-silicon-via stub lines and the distance between the two coaxial through-silicon-via stub lines. The design method comprises the following steps: acquiring a complex number characteristic impedance and a complex number propagation constant of a three-dimensional coaxial interconnection link in a target frequency band; constructing an optimization function taking the length of the two coaxial through silicon via stub lines and the distance between the two coaxial through silicon via stub lines as variables by combining a transmission line theory; setting related constraints such as a value boundary; and solving the optimization function under constraint conditions to obtain a group of structure parameter combinations enabling the reflection coefficients to meet preset requirements. The device can solve the impedance mismatch caused by the structure discontinuity of the coaxial silicon through hole and the rewiring layer under the sub-terahertz frequency band.

The directional coupler comprises a shell, an input port, a straight-through port and a coupling port, the input port, the straight-through port and the coupling port are arranged on the shell, a main transmission conductor and an auxiliary transmission conductor are arranged in parallel in the first direction and connected with the input port, the straight-through port and the coupling port respectively, and a linkage adjusting mechanism is connected with the main transmission conductor and the auxiliary transmission conductor. The main transmission conductor and the auxiliary transmission conductor are driven to synchronously and equivalently perform linear displacement in opposite directions in the second direction orthogonal to the first direction, so that the two conductors are kept in geometric symmetry relative to a middle vertical plane in the whole displacement stroke, and the problems of impedance discontinuity, standing-wave ratio deterioration, uneven coupling and the like caused by single-side adjustment are avoided. According to the directional coupler, the stability of signal coupling strength and the performance uniformity are realized, the bandwidth and the frequency response of the directional coupler are improved, and the requirements of a modern communication system on a high-precision and high-reliability coupler are met.

The application relates to a method for optimizing the impedance mutation of a fan-out area of a connector, comprising the following steps: positioning a target fan-out trace passing through a reverse pad area of the connector; establishing a positioning reference at the boundary of the reverse pad area corresponding to the target fan-out trace; separating a trace segment from other parts of the target fan-out trace based on the positioning reference to construct a width-adjustable trace segment; changing the line width of the width-adjustable trace segment by traversing different line width variables to obtain different impedance results through simulation; and screening the optimal impedance matching the preset standard to obtain the line width value corresponding to the optimal impedance. The application accurately positions the specific trace segment of the target fan-out trace corresponding to the reverse pad area, constructs a width-adjustable trace segment to realize independent impedance regulation and control of the area, and greatly improves the regulation and control accuracy; by traversing the line width variable and simulation analysis, the optimal line width value matching the preset standard is screened out, and the impedance mutation problem caused by the insufficient reference plane of the reverse pad area is eliminated.

The invention relates to the technical field of electronic equipment, and discloses a leading-out clamp for testing the signal quality of a double data rate interface of a solid-state hard disk drive, a testing system and a testing method.The leading-out clamp for testing the signal quality of the double data rate interface of the solid-state hard disk drive is characterized in that a signal leading-out structure is designed into surface layer wiring of a PCB; and the DDR interface is correspondingly connected with the push-in type coaxial connector arranged on the PCB, so that the DDR interface is directly led out from the SSD controller end to send signals. According to the structure, traditional Interposer and Riser structures do not need to be used, the problems of impedance discontinuity and reflection noise superposition caused by multiple times of BGA welding are avoided, and meanwhile the signal distortion risk caused by Stub wiring is eliminated.

The invention belongs to the field of power equipment, and particularly relates to a high-voltage cable typical insulation defect live detection method based on peak value comparison. In field measurement of the high-voltage cable, the coupling capacitor wraps the outer side of the high-voltage cable to inject and receive signals of the high-voltage cable, and when a buffer layer or an insulating layer of the high-voltage cable is affected with damp, corroded or ablated, the volume resistivity and the relative dielectric constant will change. And impedance discontinuity points occur in a transmission line network of the cable. According to a transmission line theory, a signal can be refracted and reflected when passing through an impedance discontinuous point in the cable. A corresponding amplitude-frequency diagram can be obtained by processing a received signal. The device comprises a coupling capacitor, a signal generator, a signal collector and a computer. The cable does not need to be disassembled for maintenance, and the detection and maintenance efficiency is greatly improved.

A system (1) for object detection by time-domain reflectometry comprises a sensor arrangement (10) with at least one signal line (12, 17, 18, 24), which is disposed within a detection area (A), comprises at least one conductor (13) and is adapted to propagate an electromagnetic signal (S, R), wherein a local impedance of the signal line (12, 17, 18, 24) is influenceable by an object (50) in at least one detection region (D1-D4) associated with the signal line (12, 17, 18, 24), and wherein the sensor arrangement (10) comprises, for at least one signal line (12, 17, 18, 24), at least one impedance discontinuity corresponding to a local impedance change; and a control device (30) that is operatively coupled to the at least one signal line (12, 17, 18, 24). The control device (30) is adapted to: - apply (100) a time-dependent detection signal (S) to each signal line (12) and receive a reflection signal (R) from the signal line (12); - identify (110) at least one characteristic feature (C1-C4) in the reflection signal (R) and determine a measured timing of the characteristic feature (C1-C4) wherein the characteristic feature (C1-C4) is associated with a reflection by an impedance discontinuity of the signal line (12, 17, 18, 24), - determine (120), for each characteristic feature (C1-C4), a time shift between the measured timing and a reference timing of the characteristic feature (C1-C4); and - detect (130) an object (50) in at least one detection region (D1-D4) based on the at least one time shift.

The invention relates to a signal trace with discontinuity mitigation of width modulation. A signal conductor having one or more length-tuned wiring tortuosity is selectively widened within the tortuosity region to reduce impedance discontinuities caused by trace pitch differences.

The invention belongs to the technical field of semiconductors, and discloses a preparation method of a detection point of an interposer and the interposer, and the preparation method of the detection point of the interposer comprises the steps: forming a detection bonding pad in the interposer; and processing the side part of the interposer to expose the lateral surface of the detection bonding pad, and forming a metallization structure on the exposed lateral surface to form a detection point located in the lateral direction of the interposer. According to the invention, the technical problems of lengthy signal path, discontinuous impedance, serious reflection noise and occupation of surface wiring space caused by traditional surface test points can be solved, and the technical effects of improving signal integrity, optimizing packaging size, supporting higher-density integration and enhancing anti-interference capability are achieved.

The utility model discloses a structure and a circuit board for reducing the impedance discontinuity at the inner equal-length part of a differential wire winding pair, which comprises a first transmission line and a second transmission line, the first transmission line is provided with an equal-length winding section, the equal-length winding section is provided with a first impedance adjusting part, and the second transmission line is provided with a second impedance adjusting part. The line width of the first impedance adjusting part is larger than that of other parts of the first transmission line, a second impedance adjusting part is arranged at the position, corresponding to the first impedance adjusting part, of the second transmission line, and the line width of the second impedance adjusting part is larger than that of other parts of the second transmission line. According to the utility model, the line widths of the first impedance adjusting part and the second impedance adjusting part are increased, and the impedance of the equilong winding sections is reduced, so that impedance abrupt change points caused by winding are slowed down or eliminated, the impedance of the whole differential line is more continuous and stable, adverse effects of signal reflection, crosstalk and the like are reduced, and the integrity and reliability of signals are improved.

The invention discloses a design structure and method of a capacitor, a printed circuit board and electronic equipment, and relates to the technical field of circuit design, the design structure comprises a hollow structure, a preset medium and a transmission line, the hollow structure is arranged between a first signal layer and a second signal layer of the printed circuit board, and the preset medium with a specific dielectric constant is filled, so that the transmission line is formed. According to the invention, the function of constructing a required target capacitance value under the condition of not introducing an additional via hole is realized, and meanwhile, the transmission line and the hollow structure are integrated in the same interlayer structure, so that smooth transition and structural symmetry of a link are kept. According to the invention, the problems of discontinuous impedance and signal loss caused by the increase of via holes in the traditional AC coupling capacitor design are solved, and the technical effects of improving the signal integrity, the transmission stability and the design success rate of a signal link and reducing the risk of product development are achieved.

The present application belongs to the technical field of semiconductors. Provided are a packaging structure, an integrated circuit, a memory and an electronic device. The packaging structure comprises: a packaging substrate; a first ball grid array, which is located on a first surface of the packaging substrate and comprises a first metal ball and a second metal ball adjacent to the first metal ball, wherein the first metal ball is electrically coupled to the first surface by means of a first bonding pad, and the second metal ball is electrically coupled to the first surface by means of a second bonding pad; a connecting component, the connecting component being electrically coupled with the first bonding pad; and a functional component, which is connected to the first metal ball by means of the connecting component and comprises a plurality of metal discs and a plurality of metal wires that are located above the second bonding pad, wherein every two adjacent metal discs are connected by means of one metal wire. The present application can reduce far-end crosstalk and impedance discontinuity between the first metal ball and the second metal ball when an electric signal is transmitted by means of the first metal ball.

Signaling conductors with one or more length-tuning route meanders are selectively widened within the meandered region(s) to reduce impedance discontinuity caused by trace pitch disparity.

The invention discloses a spacecraft non-cooperative target approach detection system and method based on an antenna port impedance abrupt change effect, and the method comprises the steps: connecting a reflection wave monitoring module in parallel on a transmitting link, and transmitting an output signal of the reflection wave monitoring module to a platform control system; the transmitting link comprises a transmitter, a directional coupler and a monitoring antenna; the directional coupler is connected in parallel between the output end of the transmitter and the monitoring antenna, and a coupling port of the directional coupler is connected with the input end of the reflected wave monitoring module; the directional coupler is used for directionally separating signals, so that most of transmitted radio-frequency signals smoothly pass through the monitoring antenna, and meanwhile, a small part of reflected radio-frequency signals which are reversely propagated are coupled to the reflected wave monitoring module; a special reflected wave monitoring module and built-in threshold judgment logic are additionally arranged by utilizing an existing launching system of a spacecraft, and near-field target detection is realized by measuring and analyzing the reflection coefficient change of an antenna port.

A location of conductive material in the vicinity of a magnetoinductive waveguide comprising an array of magnetically coupled resonant circuit elements is determined by analysing a reception signal detected from a reception resonant circuit element of the array. An echo signal is detected in the reception signal, the echo signal corresponding to reflected magnetoinductive waves i by reflection of injected magnetoinductive waves at an impedance discontinuity created by conductive material in the vicinity of a resonant circuit element. A timing of the echo signal is determined and the location of the resonant circuit element at which the impedance discontinuity is created is determined from the timing, as the location of the conductive material.

The utility model relates to a circuit board and electronic equipment, the circuit board comprises a signal layer and a plurality of reference layers, the signal layer comprises a bonding pad, a transition structure and a signal line which are connected in sequence, and the width of the transition structure is gradually reduced in the direction from the bonding pad to the signal line; at least one reference layer comprises a wire area and a hollowed area, and the hollowed area is arranged corresponding to at least one part of the transition structure, so that the distance from the transition structure to the reference layer is gradually reduced in the direction from the bonding pad to the signal line. According to the circuit board, the difference of the characteristic impedance of the transition structure in the direction from the bonding pad to the signal line is small, and the problem of impedance discontinuity between the bonding pad and the signal line is solved, namely the problem of impedance discontinuity of the signal layer is solved.

The present application discloses an evaluation method, an electronic device, and a non-transitory storage medium for a high-speed link system, relating to the field of high-speed electronic interconnection technology. The application proposes setting a cutting plane at the geometric height center of an electrical connection structure as the boundary position for sub-link simulation and cascading, so that the impedance discontinuities and parasitic effects that actually exist in the structure can be fully incorporated into the simulation evaluation, thereby making up for the deficiency of the traditional segmented cascade method in reflecting the actual electromagnetic behavior of the interconnection structure. Thus, while improving the simulation accuracy, it also takes into account the modeling efficiency and engineering practicality. The application can be widely used in the performance evaluation and optimization design of various high-speed packaging interconnection systems.

The invention discloses a 1.5-dimensional transmission line matrix model construction method and system and a medium, and the method comprises the steps: building a basic equation for the propagation of a partial discharge signal in a conductor line; on the basis of a traditional one-dimensional transmission line matrix model, a conductor radial layering equivalent RL network structure is introduced, and a first model is established; the first model is a layered conductor model; taking a tower structure and an auxiliary connection part thereof as impedance discontinuous units, and performing modeling by adopting a multi-section cascade TLM sub-model to obtain a second model; the second model is a cascading tower impedance model; and forming a solution structure of the 1.5-dimensional transmission line matrix model by jointly solving the first model and the second model in a time domain according to the basic equation. According to the method, the skin effect and the impedance discontinuity of the transmission line are considered at the same time, high-frequency overhead line time domain transmission line matrix modeling is carried out, and the problem that the simulation result and actual measurement have large deviation is solved.