116 results about "Impedance discontinuity" patented technology

The invention relates to a waveguide manufacturing and a waveguide manufactured with the method, which can be integrated into a circuit structure manufactured with the multilayer ceramic technique. The core part (23, 33, 43, 53a, 53b, 53c) of the waveguide is formed by a unit assembled of ceramic layers, which is limited in the yz plane by two impedance discontinuities and in the xz plane by two planar surfaces (24, 25, 34, 35, 54a, 54c, 55a, 55b, 55c) made of conductive material. The conductive surfaces can be connected to each other by vias made of conductive material (38, 39, 48, 49). The waveguide manufactured with the method according to the invention is a fixed part of the circuit structure as a whole.

A method for processing radio frequency reflections is provided. The method applies an RF waveform to a transmission line that is a conductor used for providing a utility service. The method uses a RF waveform generator to transmit UltraWideband (UWB) RF waveforms through the conductors of a building. The RF waveforms are emitted at emission points that can be impedance discontinuities along the transmission line or impulse radios. The emitted RF waveforms reflect off of objects in the building and are received at reception points that can be impedance discontinuities or impulse radios. These reflections are processed to determine movement of objects within or near the building. Based on the reflections of the RF waveforms, the position of the objects within or near the building can be determined.

An electrical interconnection system with high speed, differential electrical connectors. The connectors are formed with columns of conductive elements, some of which carry signals some of which act as ground conductors. The conductive elements may contain projections to secure the conductive elements in a housing or to facilitate desirable current flow patterns. To avoid impedance discontinuities caused by the projections, adjacent conductive elements may be formed with complementary portions to provide a relatively uniform edge-to-edge spacing between signal and ground conductors along the length of the signal conductor. To manufacture such a connector in which both the signal and the ground conductive elements contain projections, the conductive elements carrying signals may be inserted into a housing from one side and the conductive elements acting as ground conductors may be inserted from an opposite side.

An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency modules by mitigating the effects of impedance discontinuities ordinarily present at signal trace-to-via transition regions.

A method, system and apparatus for coating plated through holes (PTHs) to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.

A method of routing an integrated circuit package design includes steps of receiving as input at least a portion of an integrated circuit design including a differential pair of two electrical conductors, calculating a value of length mismatch between the two electrical conductors, calculating an added trace length to compensate for an impedance discontinuity of a shorter one of the two electrical conductors, and extending the shorter one of the two electrical conductors by routing the added trace length entirely inside an area surrounded by a contact pad that electrically terminates the shorter one of the two electrical conductors. The routing for the differential pair with the added trace length is generated as output in the integrated circuit design.

A method and apparatus for sensing conditions in a subsurface geologic formation heated for the extraction of hydrocarbons is disclosed. A time domain reflectometer in conjunction with an open wire transmission line is employed in real time to determine impedance discontinuities in the geologic formation. These impedance discontinuities correspond to physical conditions in the geologic formation. The open wire transmission line can include pipes running into the subsurface geologic formation or other conductors, including a split tube well casing. The method may operate in the low frequency window for subsurface electromagnetic propagation.

Methods and apparatus are provided for implementing a receiver capable of receiving signals in simultaneous bi-directional current mode differential links. The receiver comprises a resistor-summing network and a differential amplifier. The resistor-summing network can also comprise capacitors for the purpose of attenuating high-frequency noise at the differential amplifier. The high-frequency noise can arise from impedance discontinuities in the signal paths or from differences in rising or falling transition times between the data driver and the replica driver in the links.

The terminating impedance of a networked device in a wired communication channel is controlled to avoid an impedance discontinuity when power is applied and removed from the node or other event occurs that would change the impedance of the signal interface. When the node transmits or receives signals using the communication channel, the transmit or receive device presents a matched termination to the channel. When power is removed or the device is reset, the transmit and receive circuitry is not operational and the matched impedance is therefore maintained by a separate device. The impedance may be varied slowly from a match to a high impedance to allow other devices in the network to adapt to the change in multipath environment that results from the impedance change. Alternatively, the signal interface can be switched to a passive static impedance that is maintained while power is off or the disrupting event occurs.

Disclosed is a Syntactic Landmine Detector. The syntactic landmine detector processes a received signal from a ground penetrating RADAR which contains at least one spatial sequence, the spatial sequence containing relative spatial information locating impedance discontinuities. The spatial sequence is then associated with at least one physical characteristic of a landmine.