Capacitor design structure and method, printed circuit board and electronic equipment

By setting up a hollow structure between the signal layers of the printed circuit board and filling it with a dielectric to form an embedded capacitor, the impedance discontinuity and signal loss problems caused by vias in traditional designs are solved, and the signal integrity and transmission stability are improved.

CN120706347APending Publication Date: 2025-09-26INSPUR (SHANDONG) COMPUTER TECH CO LTD
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Patent Information

Application Number
CN202510883983.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-27
Publication Date
2025-09-26

AI Technical Summary

Technical Problem

Impedance discontinuity and signal loss caused by adding vias in traditional AC coupling capacitor designs affect signal quality and increase the risk of product design failure.

Method used

A hollow structure is set between the signal layers of the printed circuit board and filled with a preset medium with a specific dielectric constant. It is connected to external devices through transmission lines to form an embedded capacitor structure, avoiding additional vias and maintaining the impedance consistency and signal stability of the link.

Benefits of technology

It improves signal integrity and transmission stability, reduces product development risks, and increases the success rate of signal link design.

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Abstract

The invention discloses a design structure and method of a capacitor, a printed circuit board and electronic equipment, and relates to the technical field of circuit design, the design structure comprises a hollow structure, a preset medium and a transmission line, the hollow structure is arranged between a first signal layer and a second signal layer of the printed circuit board, and the preset medium with a specific dielectric constant is filled, so that the transmission line is formed. According to the invention, the function of constructing a required target capacitance value under the condition of not introducing an additional via hole is realized, and meanwhile, the transmission line and the hollow structure are integrated in the same interlayer structure, so that smooth transition and structural symmetry of a link are kept. According to the invention, the problems of discontinuous impedance and signal loss caused by the increase of via holes in the traditional AC coupling capacitor design are solved, and the technical effects of improving the signal integrity, the transmission stability and the design success rate of a signal link and reducing the risk of product development are achieved.
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