802results about "Thermometers using weight distribution" patented technology

A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic device so as to separate the electronic device and the heat sink. The system further includes a plurality of thermal sensors located on the electrical-insulating layer, each of the plurality of thermal sensors in a different location. The plurality of thermal sensors is located within one or more thin film circuit layers disposed adjacent to the electrical insulating layer. The system further includes a module for receiving thermal information from the plurality of thermal sensors during operation of the electronic device. The system further includes a processor coupled to the module for generating a thermal distribution of the electronic device based on the thermal information received from the plurality of thermal sensors.

A data storage system and method capable of reducing the operating temperature of the data storage system, removing any overheating storage devices from operation, reconstructing data, and evacuating data from the overheating storage devices before the devices and the data are damaged or lost.

Systems and methods are provided for determining data center cooling and power requirements and for monitoring performance of cooling and power systems in data centers. At least one aspect provides a system and method that enables a data center operator to determine available power and cooling at specific areas and enclosures in a data center to assist in locating new equipment in the data center.

The invention comprises systems and methods for evaluating changes in the operational efficiency of an HVAC system over time. The climate control system obtains temperature measurements from at least a first location conditioned by the climate system, and status of said HVAC system. One or more processors receives measurements of outside temperatures from at least one source other than said HVAC system and compares said temperature measurements from said first location with expected temperature measurements. The expected temperature measurements are based at least in part upon past temperature measurements.

A method and apparatus are provided to acquire direct thermal measurements, for example, from a LiDAR collecting vehicle or air vessel, of an overhead electrical conductor substantially simultaneous with collection of 3-dimensional location data of the conductor, and utilize temperature information derived from the direct thermal measurements in line modeling, line rating, thermal line analysis, clearance analysis, and / or vegetation management.

Aspects of the invention are directed to systems and methods for designing and analyzing data centers. One aspect is directed to a method of determining cooling characteristics of a data center. The method includes receiving data related to a configuration of equipment in the data center, identifying rack clusters in the configuration of equipment, and determining a capture index for at least one equipment rack of at least one rack cluster.

Methods and apparatuses for dynamically budgeting power usage to control temperatures in a data processing system. In one aspect, a data processing system includes: a first sensor to determine an ambient temperature of an environment in which the data processing system is; and a controller (e.g., a microcontroller or a microprocessor) coupled to the sensor to control operations of the data processing system according to the ambient temperature. In one example, the data processing system further includes a second sensor to determine an actual temperature of a component of the data processing system. In one example, a controller is coupled to the temperature sensors to determine an operating setting of the data processing system based on a prediction of a temperature of the data processing system which is a function of the plurality of actual temperatures and the operating setting of the data processing system.

An integrated circuit system has a reference data table for holding information that is used to control at least one circuit block in the system and also has a power supply circuit, a body bias control circuit, a clock delivery circuit, a temperature monitor circuit, and / or a configuration control circuit. The performance of the system is improved by obtaining system performance data by testing the system at different supply voltages, different body-bias voltages, different clock speeds, and / or different temperatures. Values based on the data are entered into the reference data table. The power supply circuit, the body bias control circuit, the clock delivery circuit, and / or the temperature monitor circuit data is adjusted using the entered values.

A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.

A static heat transfer model is derived from a system of dynamic equations by integrating the dynamic equations over different time periods. That static heat transfer model links periodic (e.g., monthly) energy usage with cooling and heating degree hours, humidifying and dehumidifying hours. Its coefficients of measuring correlations correspond to the thermal parameters of buildings. Temporal data from a building may be used to estimate the overall heat transfer parameters. A clustering scheme may be developed to decompose all the buildings into different clusters based on one or more similarity criteria. The overall heat transfer parameters are separated into values for the wall, roof and window using multiple buildings' data in the same cluster or group.

A prediction type electronic thermometer having an actively controlled heater element thermally isolating the probe tip from the probe shaft. Rapid and accurate temperature measurements are made using predictive algorithms. Control circuitry reads input from the temperature sensing element to compute best heater control signals so that the temperature of the probe shaft rapidly follows changes in the temperature of the probe tip. Thermal isolation between probe shaft and tip impedes heat flow from the heater element to the tip providing more accurate measurements. Rapid and accurate management of shaft temperature allows heat from the patient being measured to be most efficiently transmitted to the temperature sensor element resulting in very fast temperature measurements.

A method and system for identifying a trend in data of heat maps. An initial set of comparison heat maps included in the repository is determined and displayed based on how closely initial comparison area(s) of each comparison heat map match initial target area(s) of a first heat map. A review of the initial set of comparison heat maps determines additional comparison area(s) corresponding to additional target area(s) of the first heat map. In an iterative process, an additional set of comparison heat maps is determined and displayed based on how closely initial and additional comparison areas match respective initial and additional target areas of the first heat map. A trend relating initial and additional target areas is identified based on the displayed additional set of comparison heat maps and based on how closely comparison areas match their respective target areas.

A temperature sensing circuit has numerous trip points in conformity with a temperature change without adding decrease resistance branches, so as to obtain a fine control based on the temperature change. Accordingly, when employed in a semiconductor memory device, the temperature sensing circuit substantially reduces the consumption of refresh electrical power in a stand-by state without decreasing the reliability of the semiconductor memory device.

A monitoring system particularly useful for monitoring food located at one or a plurality of food serving or storage location includes a sensing subsystem and a processing subsystem. The sensing subsystem may include at least one sensing device and the processing subsystem may include a personal computer. The processing subsystem may be adapted to encrypt received data to the end that data stored in memory is substantially impervious to data tampering.

A switched current temperature sensing circuit (1) comprises a measuring transistor (Q1) which is located remotely of a measuring circuit (5) which applies three excitation currents (I1,I2,I3) of different values to the measuring transistor (Q1) in a predetermined current sequence along lines (10,11). Resulting base / emitter voltages from the measuring transistor (Q1) are applied to the measuring circuit (5) along the same two lines (10,11) as the excitation currents are applied to the measuring transistor (Q1). Voltage differences ΔVbe of successive base / emitter voltages resulting from the excitation currents are integrated in an integrating circuit (36) of the measuring circuit (5) to provide an output voltage indicative of the temperature of the measuring transistor (Q1). By virtue of the fact that the measuring transistor (Q1) is excited by excitation currents of three different values, the effect of current path series resistance in the lines (10,11) on the output voltage indicative of temperature is eliminated. The predetermined current sequence in which the excitation currents are applied to the measuring transistor (Q1) is selected to minimize the voltages in the integrating circuit (36) during integration of the voltage differences ΔVbe.

Locating and / or marking equipment, such as a locate transmitter or locate receiver, a marking device, or a combined locate and marking device, may be communicatively coupled to and / or equipped with a mobile / portable device (e.g., a mobile phone, personal digital assistant or other portable computing device) that provides processing, electronic storage, electronic display, user interface, communication facilities and / or other functionality (e.g., GPS-enabled functionality) for the equipment. A mobile / portable device may be mechanically and / or electronically coupled to the equipment, and may be programmed so as to log and generate electronic records of various information germane to a locate and / or marking operation (e.g., locate information, marking information, and / or landmark information). Such records may be formatted in various manners, processed and / or analyzed on the mobile / portable device, and / or transmitted to another device (e.g., a remote computer / server) for storage, processing and / or analysis. The mobile / portable device also may provide redundant, shared and / or backup functionality for the equipment to enhance robustness.

A method for determining a bed temperature setpoint for use with a powder in a selective laser sintering machine is disclosed. The method includes the step of providing a powder comprising a polymer for use in a selective laser sintering machine. The method further includes the step of determining a ratio of a liquid portion of the powder to a solid portion of the powder as a function of temperature within a temperature range. A bed temperature setpoint is selected in the temperature range corresponding to a desired ratio of the liquid portion of the powder to the solid portion of the powder. A temperature of a bed of a selective laser sintering machine is set to the selected bed temperature setpoint, and a part is built from the powder using the selective laser sintering machine.

This invention covers electronic time-temperature indicators with a visual output, and other devices and methods by which the thermal history of a material may be monitored, and the subsequent fitness for use of the tracked material may be quickly ascertained. In particular, the invention discloses a rapidly reprogrammable electronic time-temperature tag that may be easily customized with the thermal time-temperature stability profile of an arbitrary material, using electronic data transfer methods. Using this device, a single, low-cost, generic time-temperature tag may be mass-produced, and then subsequently programmed to mimic the stability characteristics of nearly any material of interest.

A system for a meter configured to determine an analyte concentration of a fluid sample includes a housing and a temperature sensor disposed within the housing. The system also includes a processor configured to receive temperature data from the temperature sensor upon the meter entering one of a charge state and a discharge state. The processor is further configured to predict a temperature value that approximates the ambient temperature outside of the housing. The predicted temperature value is based on historical temperature data received from the temperature sensor such that the predicted temperature value remains constant if a recently received temperature value remains within predetermined upper and lower temperature thresholds and the recently received temperature value exceeds the at least one predicted temperature value.

Methods and apparatus are provided for eliminating hot spots on processor chips in a symmetric multiprocessor (SMP) computer system. Some operations, in particular, floating point multiply / add, repetitively utilize portions of a processor chip to the point that the average power of the affected portions exceeds cooling capabilities. The localized temperature of the affected portions can then exceed design limits. The current invention determines when a hot spot occurs and task swaps the task to another processor prior to the localized temperature becoming too hot. Moving of tasks to processors that have data affinity with the processor reporting a hot spot is considered. Further considerations include prioritizing unused processors and those processors that have not recently reported a hot spot.

A multi-antenna GNSS system and method provide earth-referenced GNSS heading and position solutions. The system and method compensate for partial blocking of the antennas by using a known attitude or orientation of the structure, which can be determined by an orientation device or with GNSS measurements. Multiple receiver units can optionally be provided and can share a common clock signal for processing multiple GNSS signals in unison. The system can optionally be installed on fixed or slow-moving structures, such as dams and marine vessels, and on mobile structures such as terrestrial vehicles and aircraft.

A processor power supply voltage controller. The controller includes a temperature sensor configured to sense a temperature of a processor and generate a temperature signal in accordance therewith. A regulator is coupled to provide a power supply voltage to the processor. The regulator is coupled to receive the temperature signal and control the power supply voltage to maintain a substantially stable crosstalk level within the processor.

Systems, methods and media for controlling temperature of a system are disclosed. More particularly, hardware, software and / or firmware for controlling the temperature of a computer system are disclosed. Embodiments may include receiving component temperatures for a group of components and selecting a component to perform an activity based at least partially on the component temperatures. In one embodiment, the lowest temperature component may be selected to perform the activity. Other embodiments may provide for determining an average temperature of the components, and if the average temperature exceeds a threshold, delaying or reducing the performance of the components. In some embodiments, components may include computer processors, memory modules, hard drives, etc.

An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.

A method, apparatus, and computer usable program product for identifying an optimal placement of an item within a storage unit. The process identifies an item for placement in the storage unit. The process determines a preferred storage temperature range for the identified item. The process then selects an optimal placement location within the storage unit for the identified item based on the preferred storage temperature range and a set of temperature readings for the storage unit.