The invention discloses an integrated LED packaging structure. The integrated LED packaging structure is characterized by comprising a ceramic substrate, an insulating layer covering the ceramic substrate, an inverted LED chip arranged on the ceramic substrate, a chip capacitor, a chip resistor, a current regulative diode, a rectifier and packaging glue covering the inverted LED chip, wherein the ceramic substrate is provided with a positive electrode and a negative electrode, and the chip capacitor, the chip resistor, the current regulative diode and the rectifier are arranged on the ceramic substrate. The chip capacitor, the chip resistor, the current regulative diode and the rectifier are collectively known as driving ICs. According to the integrated LED packaging structure, the inverted LED chip and the ceramic substrate with matched coefficients of expansion are adopted, the design of gold wires does not exist, the phenomenon that the packaging glue influences the product reliability when the packaging glue is expanded due to cold and heat changes is avoided, meanwhile, the driving ICs and the inverted LED chip share the ceramic substrate, a radiating channel of a power driving module is added, the product size is reduced, large space and the higher degree of freedom are provided for the design of the radiating module, the product working temperature is lowered, and the product service life is prolonged.