166results about How to "Improve processing yield" patented technology

The invention discloses a device and a method for low-thermal-damage laser stripping and cutting of transparent materials, the device comprises a laser, and a first half-wave plate, a linear polarizer, a beam expander, a second half-wave plate, a vortex wave plate and a processing objective lens which are sequentially arranged along the laser transmission direction, and emergent light of the processing objective lens enters a processing material; a machining material is adsorbed and fixed to the cooling suction cup, and the cooling suction cup is installed on the three-dimensional moving platform. Light subjected to polarization modulation is focused into a material through the objective lens to be modified, a complete modified layer is formed along with movement of the three-dimensional platform, the device and the method have the advantages of low thermal damage and high precision when being used for stripping and cutting, and material loss caused in the laser machining process can be reduced.

The invention discloses a method for preparing cellobiose and comprehensively utilizing a by-product of cellobiose. The method is characterized by specifically comprising the following steps: (1) dilution, (2) enzymolysis, (3) flocculation and carbon explosion, (4) decoloration, (5) continuous ion exchange, (6) evaporation and concentration, (7) simulated moving bed chromatographic separation, (8) concentration, (9) finished product preparation and (10) raffinate utilization. The method effectively solves the problems of low preparation purity and high production cost of cellobiose.

The invention discloses a method for detecting the size of a plate of a hexahedral drill. The method comprises the following steps of: 1, generating processing data according to read label information of a processed plate; 2, the control system reads machining data to obtain the plate size and the technological process; 3, a machining program is automatically started, and when the X-direction pushing mechanism and the Y-direction pushing mechanism execute plate positioning, the length and the width of the plate are detected through a magnetic head and a magnetic railing ruler; 4, judging whether the detected length and width of the plate are within the error range of the length and width of the plate set by the control system or not; 5, the plate is clamped by a clamp mechanism, and the thickness of the plate is detected through a magnetic head and a magnetic railing ruler; 6, judging whether the detected thickness size of the plate conforms to the processing data or not; if yes, processing the plate according to an original plate analysis data process; and if not, compensating related process data of the plate according to the detected thickness error of the plate, and then performing processing.

The utility model provides an aluminum shell battery cell structure, which comprises an insulating film, an insulating plate, a lower plastic plate, a top cover and two connecting pieces, and is characterized in that the insulating film is arranged on one side of the insulating plate and is used for wrapping the outer side of a winding battery cell; the lower plastic plate is detachably connected to one side, far away from the insulating film, of the insulating plate; the top cover is arranged on one side, far away from the insulating film, of the lower plastic plate; a positive pole and a negative pole are arranged on the top cover; and the two connecting pieces are arranged between the insulating film and the lower plastic plate, and are correspondingly and electrically connected with the positive pole and the negative pole of the top cover and the positive pole and the negative pole of the winding battery cell respectively. According to the aluminum shell cell structure, the hot melting process of the insulating film and the lower plastic plate is removed, the processes are reduced, the assembly precision is reduced, the insulating film and the insulating plate are hot-melted, assembly with a top cover assembly is not needed, and the assembly difficulty is reduced.

The utility model discloses a heat shrink tube slitting device which is located on one side of a top plate and provided with a supporting seat on a bottom plate, a vertical driving mechanism is installed on the supporting seat, the movable end of the vertical driving mechanism is connected with the top plate, the top plate is connected with a plurality of connecting seats, and a plurality of annular tool bits are rotatably installed at the bottoms of the connecting seats. The upper surface of the bottom plate is provided with a first mounting base with a first arc-shaped groove formed in the top, second mounting bases with second arc-shaped grooves formed in the top, and a plurality of second mounting bases located on one side of the first mounting base and arranged in the length direction of the bottom plate at intervals. The first arc-shaped groove and the second arc-shaped groove which are used for placing the radiofrequency ablation needle are coaxially arranged, and a first groove which is internally provided with two driving rollers is arranged below the first arc-shaped groove and at the top end of the first mounting seat. Passive cutting of the heat shrink tube is achieved, the situation that the radio frequency ablation needle is damaged due to excessive cutting is avoided, the machining yield can be improved, and unnecessary waste is reduced.

The invention relates to a quantum bit packaging device. The quantum bit packaging device comprises a shell, a substrate, a PCB (Printed Circuit Board) and a connector group, the shell is of a hollow structure and is made of an oxygen-free copper material; the substrate is transversely arranged in the shell, the substrate is of a straight-plate-shaped structure, a preassembling opening is formed in the substrate, and the preassembling opening is suitable for placing a chip; the PCB is transversely arranged in the shell, the PCB is located on the substrate, and the PCB abuts against the substrate; the connector group is arranged on the PCB, the connector is provided with a plurality of connectors, and the plurality of connectors and the PCB are longitudinally inserted. The quantum bit packaging device provided by the invention is high in integration level and easy to carry and deploy. Specifically, the PCB is tightly abutted against the substrate, and the chip is mounted between the substrate and the PCB, so that the overall integration level is high, the electrical connection stability between the components is further improved, and the later maintenance and upgrading work is greatly facilitated.

The invention relates to a telescopic cutter device for automatically compensating the abrasion loss of a cutter, which is applied to equipment processing and comprises a cutter sleeve, a grinding cutter and a telescopic spring for dynamically adjusting the extension amount of the grinding cutter in the processing process, the telescopic spring is arranged in the cutter sleeve, and one end of the grinding cutter is inserted into the cutter sleeve; two ends of the telescopic spring are respectively connected with the cutter sleeve and the grinding cutter. According to the invention, the processing efficiency and the processing yield can be improved.

The invention provides an NC30Fe high-chromium nickel-based alloy pierced billet as well as a preparation method and application of the NC30Fe high-chromium nickel-based alloy pierced billet. The preparation method comprises the following steps: firstly, heating an NC30Fe high-chromium nickel-based alloy tube blank to a specific charging temperature, and perforating by utilizing a hot cross rolling perforation process; in the punching process, it is ensured that the dimensional tolerance and eccentricity of a pierced billet meet the requirements by strictly controlling the roller distance, the top temperature and the extension coefficient; and then, quenching treatment is carried out on the pierced billet subjected to perforation, so that the grain size is controlled to be within the range of grade 3 to grade 7, and the high-temperature strength and creep resistance of the material are improved. According to the preparation method disclosed by the invention, through introduction of a hot cross piercing process, the problems of more surface defects, large eccentricity and difficulty in grain control caused by a traditional hot extrusion process are solved, the yield is increased to 93% or above, and the surface smoothness and the dimensional precision are remarkably improved. The pierced billet is suitable for preparation of high-temperature corrosion-resistant and high-precision nickel-based alloy pipes in the fields of petroleum, chemical engineering, aerospace and the like, and has high application value.

The invention relates to the technical field of glass processing, and discloses a processing method of AG (anti-glare) glass, which is high in processing precision and efficiency, low in product breakage rate and processing cost and low in skill requirements on operators, and comprises the following steps: S1, carrying out sand blasting on a glass incoming material, so that a sand surface is formed on the front surface of the glass, and a non-sand surface is formed on the back surface of the glass; s2, cutting the sand-blasted glass to form a plurality of glass sheets; s3, a laser beam is emitted from the non-sand surface of the glass sheet, so that a chamfering pretreatment area, a hole pretreatment area and a hole chamfering pretreatment area are formed in the glass sheet through laser internal carving; s4, putting the glass sheet into an etching solution for chemical etching; s5, carrying out appearance splitting on the glass sheet so as to form a chamfer on the edge of the glass sheet; and S6, carrying out hole splitting on the glass sheet by adopting ultrasonic wave under-liquid splitting, so that hole sites are formed in the hole pretreatment area and the hole chamfering pretreatment area on the glass sheet.

The present invention provides a UV adhesive composition, a UV viscosity-reducing adhesive and a UV viscosity-reducing film. In terms of mass percentage, the UV adhesive composition comprises: 38-80wt% of a mixed resin, 10-48wt% of an active monomer, 0.01-5wt% of a photoinitiator, 0.01-5wt% of a curing agent, and 0.01-40wt% of a solvent; wherein the mixed resin is a non-photosensitive resin and a photosensitive resin, the non-photosensitive resin is selected from any one or more of an epoxy resin, a hydroxyl-containing resin, and a polyurethane resin, and the photosensitive resin is a bifunctional acrylic resin and / or a multifunctional acrylic resin. Through the mutual coordination of the components in the UV adhesive composition, the appropriate viscosity, suitable crosslinking density and hardness of the bonded object are achieved, thereby helping to reduce the probability of overflow, reduce the difficulty of peeling during the process, and improve the process yield.

The invention discloses a solar plane mirror gasket bonding production line and a bonding method thereof, and relates to the technical field of solar accessory machining, the solar plane mirror gasket bonding production line comprises a vibration feeding mechanism, and the vibration feeding mechanism is used for gaskets. According to the solar plane mirror gasket bonding production line and the bonding method thereof disclosed by the invention, the vibration feeding mechanism is arranged to feed to-be-glued gasket pieces to the linear conveying mechanism, and the gasket pieces can turn over in the process of falling to the linear conveying mechanism, so that the upper surfaces of the gasket pieces face upwards; the rotary head on the rotary table can be in contact and clamped with the gasket piece, the gasket piece can be transferred to the position below the glue injection nozzle along with rotation of the rotary table, finally glue injection is conducted through the glue injection nozzle, and the rotary head can drive the gasket piece to rotate while glue injection is conducted, so that annular glue is injected to the surface of the gasket piece; the whole production line achieves full automation, and the machining efficiency and the yield are effectively improved.

The invention discloses a thermomechanical treatment method for improving the obdurability and the plate shape of an Al-Cu-Mg alloy plate. The thermomechanical treatment method comprises the following steps: (1) carrying out pre-stretching treatment on a deformed plate; (2) carrying out single-stage or graded solid solution heat treatment on the pre-stretched plate, wherein the final solid solution heat treatment temperature is T1; (3) cooling the plate subjected to solid solution treatment to a temperature T2 at an average cooling rate V1, and then cooling the plate from T2 to a room temperature at an average cooling rate V2; (4) the quenched plate is subjected to cold deformation treatment after being placed at the room temperature; and (5) the plate subjected to cold deformation treatment is subjected to pre-stretching treatment, and then natural aging is conducted under the room temperature condition. According to the method, the Al-Cu-Mg alloy plate is subjected to pre-stretching, solid solution heat preservation, graded controlled cooling quenching, room temperature standing, cold deformation, pre-stretching and natural aging treatment, and the Al-Cu-Mg alloy can obtain an ideal obdurability matching relation on the premise of controlling residual stress and the plate shape.

The invention relates to the technical field of battery production, and discloses pole piece production equipment and a pole piece production process method, and the pole piece production equipment is suitable for processing a continuously moving current collector; the pole piece production equipment comprises a first coating head and a second coating head, wherein the first coating head is suitable for coating a current collector with first slurry; the first drying oven is arranged at the downstream of the first coating head and is suitable for drying the current collector coated with the first slurry; the second coating head is arranged at the downstream of the first drying oven and is suitable for coating the current collector with second slurry, and the second slurry is located on at least one side of the first slurry in the width direction of the current collector; and the second drying oven is arranged at the downstream of the second coating head and is suitable for drying the current collector coated with the first slurry and the second slurry. According to the pole piece production equipment provided by the invention, the conditions of permeation and material mixing on the edges of the ceramic slurry and the positive active material slurry when the ceramic slurry and the positive active material slurry are in a fluid state before drying can be avoided.

The utility model discloses a fixed-distance beveling machine for glass fiber tube processing, which relates to the technical field of glass fiber tube processing and comprises a processing table, a cooling box is fixedly mounted at the bottom end of the processing table, and a support is fixedly mounted on the left side of the top of the processing table. And a bearing arc block is fixedly mounted on the left side of the top of the machining table and located below the supporting bracket, a distance fixing unit is arranged on the right side of the top of the machining table, and a cooling unit is arranged on the left side of the front of the machining table. The circulating pump is started, the cooling liquid in the cooling box is pumped outwards in cooperation with the liquid pumping pipe, the cooling liquid is conveyed to a cutting point in cooperation with the liquid discharging pipe and the nozzle, cooling treatment is conducted on the cutting point, liquid surging downwards enters the recycling tank and is filtered in cooperation with the filter screen, and the cutting point is recycled. Therefore, the glass fiber pipe cooling device is convenient to use repeatedly, so that the effects of quickly cooling and improving the processing yield of the glass fiber pipe are achieved.

The present invention provides an ophthalmic lens and frame glasses having the same. The ophthalmic lens is a frame lens or a contact lens, having a continuous convex-concave surface feature in at least two directions, and the convex-concave surface feature has a plurality of raised portions and a plurality of recessed portions. The technical solution of the present invention has at least the following advantages: the diopter changes continuously without sudden changes. The imaging quality is better; during the molding and demolding process, the continuous smooth surface is easy to demold, and the processing yield is high; during the lens coating process, the coating liquid is not easy to accumulate, the coating is uniform, and the diopter is not easy to change before and after the coating.

The utility model relates to the technical field of precision machining, in particular to a high-precision detachable long nozzle structure which comprises a cutter bar and a nozzle, a shaft hole is formed in one end of the cutter bar, the inner side of the shaft hole is a precision matching section, and the outer side of the shaft hole is a threaded connection section; one end of the nozzle is inserted into the cutter bar shaft hole and is precisely matched with the inner side of the shaft hole, a groove is formed in the position close to one end of the nozzle, a sealing ring is arranged in the groove, an outer threaded section matched with the shaft hole threaded connection section is further arranged on the outer side of the nozzle, and the nozzle is in threaded connection with the cutter bar shaft hole part and is used for detachable and coarse positioning; the nozzle is precisely matched with the shaft hole part of the cutter bar for precise positioning. The utility model has the advantages that the deformation generated in processing is reduced, and the qualified rate of finished products is higher; the machining complexity is reduced, deformation in the machining process is reduced, and the loss rate and the production cost are reduced; the small diameter of the workpiece is achieved, and the workpiece can extend into a small inner hole to be cleaned; only the nozzle needs to be replaced when the workpiece is replaced, and workpiece replacement operability is improved.

The application provides an automatic flame polishing method for a quartz wafer, which comprises the following steps: placing a quartz wafer to be polished on a clamp, wherein the clamp comprises a roller provided with a groove, and the edge of the quartz wafer is placed in the groove; controlling a polishing gun to be aimed at the surface of the quartz wafer; and controlling the polishing gun to spray a flame and automatically polish the quartz wafer according to a set moving track while the roller drives the quartz wafer to rotate. Compared with traditional manual polishing, the method has high efficiency, stable polishing, uniform appearance of the polished quartz wafer, and good consistency, so that the processing yield is improved. Moreover, the quartz wafer is driven to rotate by the roller, so that the bumping problem caused by repeated clamping during the polishing process of the quartz wafer is avoided.

The invention discloses a composite structure substrate and a preparation method thereof, and an electronic device, the composite structure substrate sequentially comprises a supporting substrate, a bonding structure layer and a functional film layer, the functional film layer is obtained by performing surface treatment on a first functional layer and a second functional layer, a damage layer is formed on a first surface, far away from the supporting substrate, of the first functional layer; wherein the surface treatment comprises the following steps of: performing etching treatment on the first surface in the first functional layer to obtain the second functional layer; the etching thickness of the etching treatment is greater than the thickness of the damaged layer; and performing chemical mechanical polishing treatment on the second functional layer, removing the amorphous layer on the surface of the second functional layer, and performing thinning treatment to obtain the functional thin film layer. According to the invention, the surface treatment is converted into the functional thin film layer twice, so that better film thickness uniformity can be achieved, and the performance of the device can be improved.

The present invention discloses an automatic cutting system for processing curved surfaces of workpieces, comprising: a power assembly; a tool for clamping the workpiece to be cut; an actuator for performing cutting processing; a camshaft is provided on the power output end, and a first cam surface and a second cam surface are provided on the camshaft at a preset distance to match each other; the actuator is installed on a limiting plate through a matching first transmission assembly, and the first cam surface contacts the free end of the first transmission assembly to drive the spatial position of the actuator to change up and down during the rotation of the first cam surface. The present invention provides an automatic cutting system for processing curved surfaces of workpieces, which improves the structure of the equipment so that it can adapt to the processing of special-shaped curved surfaces of workpieces, and has the effects of high automation, high precision, simple structure and controllable cost.

The utility model discloses an automatic bending device for a PC board. An operation table and a supporting table are connected up and down. Two first braking air cylinders are installed on the outer top of the operation table in a penetrating mode, and the bottom ends of the two first braking air cylinders are connected with a bending pressing plate. Two sliding rods are transversely connected to the inner bottom of the operation table, a movable plate is slidably connected to the outer side ends of the two sliding rods, and a first clamping plate used for clamping a PC plate is arranged on the movable plate; a fixing plate is fixed to the inner side ends of the two sliding rods, and a second clamping plate used for clamping a PC plate is arranged on the fixing plate. The movable plate is connected with two second brake cylinders, the two second brake cylinders are assembled on the inner side of the operation table, and the two second brake cylinders are correspondingly and electrically connected with two controllers. According to the utility model, a mechanical integrated symmetrical structure is adopted, the positioning and clamping operation of the PC board can be uniformly controlled through one cylinder, and the bending processing is carried out on the PC board through the other cylinder in the vertical direction, so that the bending accuracy is improved, and cracking and damage caused by stress are avoided.

The application relates to the technical field of wafer processing equipment, in particular to a reaction cavity for a high-hydrogen process and a plasma processing equipment, which comprises a quartz tube, a first coil is arranged outside the quartz tube and is connected with an external radio frequency power source, a Faraday shield cage is arranged outside the quartz tube and between the quartz tube and the first coil, a plurality of slits are formed in the Faraday shield cage and extend along the axial direction, a blocking piece is arranged in the quartz tube, and the structure formed by the orthographic projection of the blocking piece on the circumferential side wall of the Faraday shield cage covers the structure formed by the orthographic projection of the first coil on the circumferential side wall of the Faraday shield cage. The blocking piece arranged in the quartz tube can effectively block the concentrated bombardment of the plasma generated in the high-hydrogen process on the inner wall of the quartz tube, significantly reduces the erosion of the quartz tube and the peeling of the particles, and improves the process yield of the plasma processing equipment and the service life of the equipment.

The invention relates to a light-emitting diode which comprises an epitaxial composite layer, a dielectric layer, a transparent conductive layer and a metal layer. Wherein the epitaxial composite layer is arranged on the dielectric layer, the dielectric layer is arranged on the transparent conductive layer, the transparent conductive layer is arranged on the metal layer, and the outer edge of the transparent conductive layer is coated by the metal layer.

The utility model discloses a clamping mechanism and a self-adaptive machining device. The clamping mechanism comprises a shell, a clamping piece, an elastic piece and an adjusting assembly. The clamping piece is movably arranged in the shell in the axial direction of the shell and used for clamping a tool. The elastic piece is movably arranged in the shell in the axial direction of the shell and abuts against the clamping piece. The adjusting assembly is arranged in the shell and abuts against the end, away from the clamping piece, of the elastic piece, and the adjusting assembly is used for adjusting the length of the elastic piece under the natural condition. When the cutter abuts against the product, the cutter clamped by the clamping mechanism is subjected to counter-acting force to drive the clamping piece to compress the elastic piece, so that the elastic piece can reversely provide pressure for the clamping piece, the cutter is made to be attached to the product in a self-adaptive pressurization mode for machining, and the effects of removing burrs and evenly machining the product are achieved. And the length of the elastic piece under the natural condition is adjusted through the adjusting assembly, so that the cutter can conduct self-adaptive pressurization machining on the product according to the pressure needed by the product.

Embodiments of the present application provide a method and apparatus for generating optimized parameters. The method is suitable for generating optimized parameters related to solder paste printing in surface mount technology. In the method, a cluster parameter model is used to determine whether at least one input parameter deviates from at least one parameter cluster. A global parameter model is used to determine the printing result of a plurality of target parameters in the input parameter. A heuristic algorithm is used to select at least one candidate parameter from the target parameters. An individual parameter model is used to modify the candidate parameter. As a result, the optimized parameters with high operation cycle and low failure rate can be obtained.

This application relates to a multi-station punching and one-time bending continuous die and processing method, belonging to the field of continuous die technology. The continuous die includes a lower die mechanism, comprising a lower die base, a concave die plate disposed on the lower die base, and a guide frame disposed at one end of the lower die base; and an upper die assembly, comprising an upper die base and an upper die assembly, the upper die assembly being provided with several sets of punches, a first cutting punch, a bending punch, and a second cutting punch; the upper die assembly is provided with a first control component and a second control component. The first control component controls the bending punch and the first cutting punch to move synchronously toward the concave die plate, and the second control component controls the second cutting punch to move toward the concave die plate. After the punches have punched ten times consecutively, the first control component drives the bending punch and the first cutting punch to punch synchronously with the punches, forming the bent portion in one step. This application effectively alleviates problems such as tilting and twisting of the strip during continuous punching.

The utility model relates to the technical field of coil processing discloses a kind of coil inner side lead wire soldering machine, including rack, soldering jig, jig driving part and soldering assembly are set on rack, jig driving part is transmission connection with soldering jig, jig driving part drives soldering jig to approach or away from soldering assembly, soldering assembly is used to carry out soldering to the coil on soldering jig;By setting soldering jig on rack to facilitate the coil to be soldered is placed, simultaneously by jig driving part drives soldering jig to move to soldering assembly, by controlling soldering depth and soldering time to grasp the soldering effect of corresponding coil lead, and then improve soldering efficiency and soldering progress, improve processing efficiency and yield.

The invention discloses a low-cost high-reliability large-current TYPE-C fast-charging female head and an electronic product, the low-cost high-reliability large-current TYPE-C fast-charging female head comprises an insulation body, a female head terminal group and a shell, the female head terminal group comprises a first GND terminal, a first VBUS terminal, a second VBUS terminal and a second GND terminal, the front sides of the welding pins of the 4PIN terminals are connected with vertical plate parts, and the welding pins of the 4PIN terminals are connected with vertical plate parts. The top and the bottom of the vertical plate part are used as a first GND upper-row contact part, a first GND lower-row contact part, a first VBUS upper-row contact part, a first VBUS lower-row contact part, a second VBUS upper-row contact part, a second VBUS lower-row contact part, a second GND upper-row contact part and a second GND lower-row contact part respectively, so that 8PIN current transmission terminal contacts of a TYPE-C standard are provided through the 4PIN terminal, and the current transmission efficiency is improved. The terminal group is compatible with a fast charging protocol pushed by a USB association, the structure is simple and ingenious, the terminal group is convenient to integrally design and manufacture, the cost is effectively reduced, the sectional area of a contact part is effectively increased, the larger current transmission requirement is met, and the structural strength, the durability and the reliability are enhanced.

The invention discloses a MINI RGB LED lamp bead with a built-in resistor and a preparation method of the MINI RGB LED lamp bead, and relates to the technical field of LEDs, the MINI RGB LED lamp bead with the built-in resistor comprises a substrate, a first chip, a second chip, a third chip and a chip resistor; the front surface of the substrate is provided with a front circuit, the back surface of the substrate is provided with a back circuit, and the front circuit and the back circuit are connected through a through hole; the front circuit comprises a die bonding area, a bonding wire area, an insulating area and a groove area; the die bonding area comprises a first die bonding area, a second die bonding area and a third die bonding area which are separated from one another, the first chip is arranged in the first die bonding area, the second chip is arranged in the second die bonding area, and the third chip is arranged in the third die bonding area; a groove is formed in the groove area, and the chip resistor is arranged in the groove and connected with the first chip in series. According to the invention, burning of the lamp beads and caterpillars on the display screen due to water vapor permeation can be reduced, so that the process yield and the display effect are improved.

The invention relates to the technical field of special equipment for agricultural and sideline product processing, and discloses a sausage spacing self-optimizing energy-saving hanging rod system based on machine vision, which comprises a chassis and an electrical cabinet fixedly mounted at one end of the chassis, two upright posts are arranged on the top surface of the chassis, a top frame is arranged at the top ends of the two upright posts, and a conveying belt is arranged on the outer wall of the top frame; and a driving structure for driving the conveying belt is arranged on the electrical box. A two-stage correction structure of the sausage shaking assembly and the adjusting assembly is adopted, sausage preliminary returning is achieved through regular shaking of the sausage shaking assembly, accurate straightening is completed through the inertia effect by the adjusting assembly when sausage is not corrected in place, and the problem that the ends of sausages are hung mistakenly can be effectively solved through double correction; the sausage hanging device ensures that the joints of sausages are accurately hung at the preset positions of the hooks, so that the distance between the sausages after hanging meets the technological standard, the conditions of uneven heating and stacking extrusion caused by abnormal distance in subsequent processing are avoided, and the sausage processing yield is improved.

The invention discloses a method and a device for picking and placing an ultrathin substrate chip, aiming at the ultrathin chip with the thickness of several microns, a volatile alcohol solution is dipped on the surface of a tip object, and the holding force in the chip picking process is provided by utilizing the principle of liquid surface tension; a tip object holding the chip through surface tension is controlled under a microscope, the tip object is close to the surface of a carrier needing to be placed, and the tension effect between the bottom of the chip and the carrier is provided through rapid spreading of the solution on the surface of the carrier; slowly lifting the tip object to realize that the ultrathin substrate chip is placed on the surface of the carrier; and finally, slowly heating to mildly dry volatile alcohols on the surface of the chip and between the bottom of the chip and the carrier so as to form effective chip placement. According to the method, mechanical damage to the ultrathin chip with only several micrometers in the mechanical picking and placing process can be avoided, and a feasible method is provided for effective placement of effective positions of the ultrathin substrate chip and the packaging carrier.