Lead-free halogen-free tinol and preparation process

A solder paste and halogen technology, applied in the field of lead-free and halogen-free solder paste and its preparation, can solve the problems of destroying the earth's ecological environment, endangering human health, polluting water sources, etc., achieving no short-circuit defects, good compatibility, soldering Less post-residue effect

Active Publication Date: 2006-12-13
BEIJING XINLI MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, soluble lead-containing salts will be formed, which will dissolve in groundwater and pollute water sources. After people drink for a long time, it will also lead to lead poisoning, seriously endangering human health and destroying the earth's ecological environment.

Method used

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  • Lead-free halogen-free tinol and preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Preparation of modified resin antioxidant (1)

[0028] Raw material (g): Modified rosin resin 80g (prepared from the following raw materials in weight ratio: polymerized rosin, water white rosin, hydrogenated rosin or acrylic rosin, ratio 47:40:2), antioxidant 2g (from the following Preparation of raw materials in weight ratio: tetra[β-3,5-di-tert-butyl 4-hydroxy-phenyl] propionate butanepentaerythritol, 1,3,5-trimethyl-2,4,6- Tris(3,5-tert-butyl-4hydroxybenzyl)benzene, 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, ratio 1:1: 1) The reducing agent 5g is cis-9-octadecenoic acid.

[0029] Preparation method: accurately weigh each raw material according to the ratio, put the polymerized rosin, water white rosin, and acrylic rosin into a glass-lined or enamel kettle to be completely melted, then start the stirrer for low-speed stirring at a stirring speed of 40-60 Turn / min, add antioxidant and reducing agent in sequence under stirring until all are melted and mixed i...

Embodiment 2

[0037] Preparation of flux (1)

[0038] Raw material (g): modified resin antioxidant 40 of one of Example 1, suberic acid 1, malic acid 2, tartaric acid 3, dodecanoic acid 6, monoglyceride 4, hydrogenated rosin methyl ester 3.5, Ceresin 0.5, benzotriazole 0.2, triethylene glycol ether 16, propylene glycol 23.8.

[0039] Preparation method: accurately weigh various raw materials according to the formula ratio, put the modified resin antioxidant in a glass-lined or enamel kettle, add some organic solvents and stir at room temperature until all are dissolved, the stirring speed is 40-60 rpm . In another glass-lined or enamel kettle, add the remaining solvent, add thixotropic agent, plasticizer, forming agent, corrosion inhibitor in sequence while heating to 90-100°C, and stir until all are dissolved. Add the organic acid activator when the temperature is lowered to 70-80°C, and stir until all are dissolved uniformly, and naturally fall to room temperature. The modified resin antioxid...

Embodiment 3

[0059] Preparation of lead-free and halogen-free solder paste (1)

[0060] Raw material (g): 90g of Sn3.0Ag0.5Cu alloy powder, 10g of one of the fluxes of Example 2.

[0061] Preparation method: Put the soldering flux and alloy powder into a stainless steel mixing kettle, evacuate, the vacuum degree is -0.06--0.04MPa, start the stirrer and stir for 30-40min, then the finished solder paste will be obtained.

[0062] Preparation of lead-free and halogen-free solder paste (2)

[0063] Raw material (g): 91 g of Sn3Ag1.2Ni alloy powder, 9 g of one of the fluxes of Example 2.

[0064] Preparation method: Put the soldering flux and alloy powder into a stainless steel mixing kettle, evacuate, and the vacuum degree is -0.06MPa, start the stirrer for stirring for 20 minutes, and then the tin solder paste is finished.

[0065] Preparation of lead-free and halogen-free solder paste for SMT (3)

[0066] Raw material (g): 88g of Sn4Ag6Bi0.18Cu alloy powder, 12g of one of the fluxes of Example 2...

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PUM

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Abstract

The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20; said alloy powder is one of SnAgCu, SnAgNi, SnAgBiCu, SnAgBiSb, SnCu and SnAg; said welding flux concludes following components with percent by weight: modified resin antioxidant 30-60, organic acid activating agent 5-15, thixotropic agent 4-14, plasticizing agent 2-6, plasticizing agent 0.4-2, inhibitor 0.1-0.5 and organic solvent 20-40; said modified resin antioxidant comprises following components with percent by weight: modified rosin resin 80-90, anti-oxidant 2-8, and reducer 2-8. The tonal is characterized by good thixotropic behavior, no oxidation, no dry welding and no short circuit.

Description

Technical field [0001] The invention relates to a tin solder paste, which is particularly suitable for lead-free and halogen-free tin solder paste for circuit board assembly surface mounting technology (SMT, Surface Mount Technology) and a preparation method thereof. Background technique [0002] In the assembly and soldering of electronic industrial products, tin-lead (Sn-Pb) alloy solder has been used, but in the process of melting and use of the solder, death and disability due to lead poisoning in the solder often occur. During the landfill disposal of waste electronic and electrical products, the lead in the solder of the soldering part encounters acid rain or acidic groundwater. It will form soluble lead-containing salts and dissolve in groundwater, which will pollute the water source and lead to lead poisoning after long-term drinking, which seriously endangers human health and destroys the earth's ecological environment. [0003] The Directive No. 2002 / 95 / EC of the Europe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26
Inventor 丁飞
Owner BEIJING XINLI MACHINERY
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