Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof

A technology of methanesulfonic acid and additives, which is applied in the field of methanesulfonic acid-based matte pure tin electroplating solution additives and electroplating solutions, can solve the problem that the performance of the electroplating solution and the coating layer is not easy to maintain stable, the wettability is poor, and it is easy to grow. Solder problems such as tin whiskers, and achieve the effect of excellent solderability, good positioning performance, good flexibility and ductility.

Inactive Publication Date: 2010-12-22
济南德锡科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although methanesulfonate matt tin plating is superior to traditional plating solutions, it is prone to tin whiskers, the performance of plating solutions and coatings is not easy to maintain stability, and poor wettability still exists.

Method used

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  • Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof
  • Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof
  • Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Additive water formulation 1

[0031] Hydroquinone 12.5g / L

[0032] Lactic acid 5g / L

[0033] N-Dimethylformamide 1.25g / L

[0034] 2-Mercaptobenzothiazole 0.75g / L

[0035] Nonylphenol polyoxyethylene ether (8EO) 50g / L

[0036] EO-PO (EO=8, PO=6) copolymer 100g / L

[0037] Isopropanol 125g / L

[0038]Water 700g / L

[0039] The preparation method is: mix hydroquinone, lactic acid, N-dimethylformamide and 2-mercaptobenzothiazole with nonylphenol polyoxyethylene ether (8EO), EO-PO (EO=8, PO=6) Dissolve the copolymer and isopropanol, stir to dissolve completely, add water to make up to volume.

Embodiment 2

[0041] Additive water formulation 2

[0042] Catechol 15g / L

[0043] Ascorbic acid 12g / L

[0044] Coconut Oil Diethanolamide 1.0g / L

[0045] 4-Methylquinoline 1.0g / L

[0046] Fatty alcohol polyoxyethylene ether (12C, 8EO) 64g / L

[0047] EO-PO (EO=8, PO=6) copolymer 90g / L

[0048] Methanol 100g / L

[0049] Water 725g / L

[0050] Preparation method: dissolve antioxidant and grain refiner with organic solvent and non-ionic surfactant, stir to dissolve completely, add water to make up volume.

Embodiment 3

[0052] Additive water formulation 3

[0053] Catechol 13g / L

[0054] Ascorbic acid 10g / L

[0055] Acetyl ethanolamine 2g / L

[0056] 4-Methylquinoline 0.5g / L

[0057] p-cumylphenol polyoxyethylene ether (11EO) 80g / L

[0058] Polyethylene glycol 50g / L

[0059] Methanol 50g / L

[0060] Isopropanol 60g / L

[0061] Water 730g / L

[0062] Preparation method is the same as embodiment 2

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Abstract

The invention relates to a methanesulfonic acid-based matte pure tin electroplating solution and an additive thereof. Each liter of an aqueous solution agent of the additive comprises the following components based on concentration: 1.5g/L-3g/L of grain refiner, 100g/L-200g/L of non-ionic surfactant, 10g/L-30g/L of antioxidant and 100g/L-150g/L of organic solvent, wherein the grain refiner is particularly heterocyclic compounds, amine compounds or a mixture of the two. The electroplating solution prepared by the additive in the invention has the advantages of good scatter performance, high flexibility and extensibility of the pure tin-based electroplating layer, and good weldability, and prevents the tin whisker from growing for a long time; and meanwhile, the electroplating solution contains no non-biodegradable substances or surfactant harmful to the environment and the like, thus facilitating the treatment of sewage and meeting the requirements for environmental protection. The invention is worthy of popularizing and applying.

Description

technical field [0001] The invention relates to the field of electroplating pure tin, in particular to an additive to an electroplating solution for matt pure tin plating based on methanesulfonic acid and the electroplating solution. Background technique [0002] Since the European Commission passed the Electronic Devices Waste Regulations, which stipulated that harmful substances such as lead Pb, cadmium Cd, mercury Hg and hexavalent chromium Cr(VI) were strictly prohibited in waste after 2004, the development of lead-free soldering technology and corresponding Pure tin electroplating technology has become the main means to replace Sn-Pb alloy plating. [0003] Tin metal is soft and has great toughness, no toxicity, and excellent corrosion resistance in the air. It has a low melting point and a high boiling point. Few metals can exceed its liquid temperature range. Liquid tin can melt copper and nickel. , palladium, gold and silver, is a very excellent solder. The cost of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32
Inventor 王凯明朱艳丽
Owner 济南德锡科技有限公司
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