Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof

A composite powder and wrapping technology, which is applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of unsuitable solder joint density and small solder joint volume

Active Publication Date: 2011-05-18
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, considering its limitations in electrical conduction and heat conduction, it is not suitable for packaging fields with high solder joint density and small solder joint volume.

Method used

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  • Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof
  • Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof
  • Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] According to the mass percentage, the Sn-Bi-Cu self-wrapped composite powder accounts for 88%, and the soldering flux for soldering paste accounts for 12%.

[0029] In the Sn-Bi-Cu self-wrapping composite powder, the content of each component is 41.5% of Sn, 48.2% of Bi, and the balance is Cu in terms of mass percentage.

[0030] In the flux for soldering paste, by mass percentage, the content of each component is hydrogenated rosin 15%, ordinary rosin 8%, adipic acid 12%, triethanolamine 5%, benzotriazole 1%, OP-100.3 %, hydrogenated castor oil 3%, ethylene glycol monobutyl ether 3%, glycerol 15%, and the balance is absolute ethanol.

[0031] The specific preparation method of described Sn-Bi-Cu self-wrapped composite powder solder paste is given below:

[0032] 1) Prepare self-encapsulated composite powder by atomization method according to the ratio of Sn, Bi and Cu mentioned above.

[0033] 2) Prepare the mixed solution A of absolute ethanol, glycerol and ethylene...

Embodiment 2

[0039] According to the mass percentage, the Sn-Bi-Cu self-wrapped composite powder accounts for 90%, and the soldering flux for soldering paste accounts for 10%.

[0040] In the Sn-Bi-Cu self-wrapped composite powder, the content of each component is 38.2% of Sn, 46.1% of Bi, and the balance is Cu.

[0041] In the soldering flux for soldering paste, by mass percentage, the content of each component is water white rosin 12%, ordinary rosin 13%, adipic acid 10%, oxalic acid 3%, triethanolamine 5%, benzotriazole 0.5% %, triethylamine 0.3%, OP-100.5%, hydrogenated castor oil 5%, ethylene glycol monobutyl ether 2%, triethylene glycol 25%, and the balance is isopropanol.

[0042] Preparation method is with embodiment 1.

Embodiment 3

[0044] According to the mass percentage, the Sn-Bi-Cu self-wrapped composite powder accounts for 89%, and the solder flux for soldering paste accounts for 11%.

[0045] In the Sn-Bi-Cu self-wrapped composite powder, according to mass percentage, the content of each component is 42.6% of Sn, 47.3% of Bi, and the balance is Cu.

[0046]In the soldering flux for soldering paste, by mass percentage, the content of each component is hydrogenated rosin 8%, water white rosin 15%, adipic acid 8%, citric acid 8%, triethanolamine 3%, triethylamine 0.6% , vitamin C 0.3%, OP-100.3%, hydrogenated castor oil 4%, ethylene glycol monobutyl ether 6%, triethylene glycol 30%, and the balance is absolute ethanol.

[0047] Preparation method is with embodiment 1.

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Abstract

The invention provides a soldering paste of Sn-Bi-Cu self-packed composite powder and a preparation method thereof, and relates to a soldering paste. The soldering paste of Sn-Bi-Cu self-packed composite powder comprises the following components by weight percent: 88-90% of Sn-Bi-Cu self-packed composite powder and the balance of pasty scaling powder. The preparation method of the Sn-Bi-Cu self-packed composite powder comprises the steps: adding rosin and an activating agent into a dissolvent to be dissolved, adding a corrosion inhibitor, a surface active agent and a thixotropic agent, and cooling to be pasty after the mixture is completely dissolved; and mixing the Sn-Bi-Cu self-packed composite powder with the pasty scaling powder to obtain the soldering paste of the Sn-Bi-Cu self-packed composite powder. The soldering paste is free of lead and halogen, and is good in soldering performance, so that the problem of the influence to the overall performance caused by the bad electrical conductivity or bad thermal conductivity of a soldering point can be solved if the soldering paste is applied to an electric encapsulating field, and the maintenance cost and the repair coast of some precise instruments can be greatly reduced.

Description

technical field [0001] The invention relates to a solder paste, in particular to a solder paste based on liquid phase amplitude modulation decomposition type Sn-Bi-Cu self-wrapped composite powder and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, solder paste, which is widely used in the electronic surface mount field, has attracted much attention. The existing solder paste is mechanically mixed with alloy solder powder and paste flux, usually, the alloy powder accounts for about 90% of the mass fraction of the solder paste. At present, there are more than 40 kinds of lead-free solders that have been developed and can be purchased commercially. All lead-free solders use Sn as the base material. By adding Bi, Cd, In, Zn, Au, Ti, Ga, Hg, Cu, Sb One or more of elements such as Ag and Ag to obtain a suitable melting point and welding performance. Since Pb is widely distributed on the earth and its price is v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26B23K35/363
Inventor 刘兴军陈梁王翠萍王娟刘洪新郁炎马云庆施展张锦彬黄艺雄
Owner XIAMEN UNIV
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