Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease

A lead-free solder paste, rosin type technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of solder joint corrosion, excessive post-soldering residues, etc., and achieve good soldering performance, Eliminate cleaning process, no irritating odor effect

Inactive Publication Date: 2007-11-21
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a lead-free soldering solution that uses a high boiling point solvent as a solvent and does not contain halogens to solve t

Method used

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  • Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] polymerized rosin 28

[0025] Succinic acid 13

[0026] Polyethylene glycol 2000 3

[0027] Diethylene glycol diethyl ether 26

[0028] Diethylene glycol 12

[0029] Hydrogenated castor oil 3

[0030] Paraffin 2

[0031] Triethanolamine 8

[0032] Polyacrylic resin 3

[0033] Octylphenol ethoxylate 2

[0034] Specific preparation method: The specific preparation method is a conventional method. First add a high boiling point solvent into a reaction kettle with a stirrer, weigh an appropriate amount of activator and add it to the reaction kettle, heat to control an appropriate temperature, stir to dissolve it completely, and add a polymer After the rosin is completely dissolved, add stabilizers, paste agents, thixotropic agents, surfactants, and then add corrosion inhibitors, stir until the solution is clear and transparent, let stand, and cool with water, that is, rosin-type halogen-free for lead-free solder paste No-clean flux. Then mix flux and lead-free sold...

Embodiment 2

[0036] polymerized rosin 20

[0037] Disproportionated Rosin 5

[0038] Adipic acid 15

[0039] Glutaric acid 5

[0040] Octylphenol ethoxylate 2

[0041] Polyethylene glycol 2000 5

[0042] Diethylene glycol monoethyl ether 22

[0043] Ethylene glycol 15

[0044] Hydrogenated castor oil 4

[0045] Triethylamine 1

[0046] Acrylic 1

[0047] Paraffin 5

[0048] Preparation method is identical with example 1.

Embodiment 3

[0050] Hydrated Rosin 10

[0051] Disproportionated Rosin 10

[0052] amino acid 16

[0053] Nonylphenol ethoxylates 6

[0054] Polyethylene glycol 4000 4

[0055] Diethylene glycol monocaprylyl ether 20

[0056] Ethylene glycol 23

[0057] Hydrogenated castor oil 0.5

[0058] Benzotriazole 4

[0059] Polyacrylic resin 6

[0060] Paraffin 0.5

[0061] The preparation method is the same as in Example 1.

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Abstract

The invention is concerned with low rosin type halogen-free and cleaning-free flux using for lead-free solder paste, belonging to flux field. About the existing rosin type flux, the leftover after welding is high and the leavings with halogen has cauterization. The matter of this invention is 5 to 20 wt percent of organic acid activator, 10 to 29 wt percent of modified rosin, 1 to 10 wt percent of binder, 0.5 to 6 wt percent of stabilizer, 1 to 6 wt percent of surfactant, 1 to 8 wt percent of corrosion inhibitor, 1 to 10 wt percent of thickener, and the rest is solvent with high boiling point. The copper mirror after welding is not penetration, and this invention without halogen has high insulation resistance and good assistant jointing capability. The viscosity of matched solder paste is advisable to solve the high content of rosin in the flux and great smoke. The leftover after welding is colorless and transparent film and it dose not absorb water with the normal temperature without clearing to fit for the welding demand of common production.

Description

technical field [0001] The invention relates to a soldering flux, which is especially suitable for preparing low-rosin type halogen-free no-cleaning soldering flux for alloy-based lead-free solder pastes such as SnAgCu, SnAgCuRE, SnAg and SnCu. Background technique [0002] In reflow soldering, the quality of the solder paste not only affects the soldering performance, but also directly affects the printing performance and storage life of the solder paste. Therefore, the quality of solder paste directly affects the entire process and product quality of surface mount technology (SMT). In the electronics industry, traditional rosin-based fluxes are widely used because they are reliable and stable. However, this type of flux leaves a large amount of residues such as halogen ions after welding, which is easy to cause corrosion. Excessive rosin content will increase the content of non-volatile matter after welding, and the content of residue after welding will be too much. At t...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 雷永平李国伟夏志东徐冬霞张冰冰郭福史耀武杨晓军林延勇
Owner BEIJING UNIV OF TECH
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