Photoelectric packaging part with cavity and production method thereof

Abstract

The invention provides a photoelectric packaging part with a cavity. An annular outer cavity with inner steps is arranged on a lead frame outer pin by a plastic packaging die, and a plastic packaging outer cavity covers the lead frame outer pin; and gap between an inner pin and a lead frame carrier is connected by a plastic packaging body to form the whole circuit. The production method comprises the following steps: making the plastic packaging outer cavity; thinning down and scribing silicon wafer; molding core; bonding; cementing a glass cover plate; curing; electroplating; printing; and cutting, separating and feeding. The photoelectric packaging part is characterized by simple structure, no exposed outer pin, no coplanarity defect, high chip packaging yield and high installation qualification rate of finished devices. The adopted production method has the advantages of no dambar and forming process, high utilization rate of materials, the adopted glass cover plate made from low-temperature glass and other materials, and higher production efficiency, which is beneficial to product installation. The photoelectric packaging part has the advantages of low cost, small size, high sensitivity, low power consumption, strong anti-interference capacity and good reliability.

Description

technical field [0001] The invention relates to the technical field of electronic information automation component manufacturing, in particular to an optoelectronic chip integrated circuit package, specifically a cavity-equipped optoelectronic integrated circuit package, and the invention includes a production method of the package. Background technique [0002] At present, the general optoelectronic package is packaged in DIP or QFP ceramic inner cavity. Its structure is that the circuit pins are on the outside of the package, and there is a square gold-plated substrate at the bottom of the inner cavity of the package. On the substrate is an adhesive ( Conductive glue or insulating glue), the adhesive glue is IC or photoelectric chip, the pad (PAD) on the IC or photoelectric chip is bonded to the first step on the inner cavity by gold wire (silicon aluminum wire, copper wire) The gold-plated inner lead pins are connected to form the signal and power channels of the circuit....

AI Technical Summary

Problems solved by technology

[0005] 1. The packaged product has exposed gull-wing-shaped outer pins, which are easily damaged and deformed during production, transportation, and use, resulting in poor coplanarity and affecting the packaging yield and the overall installation pass rate;

[0006] 2. Because the product has long external pins, the lead capacitance is large, which affects the high frequency performance of the circuit;

[0007] 3. Since the frame of this product has longer outer pins, the utilization rate of materials is reduced, that is, the number of each frame is small, and the manufacturing process adds two processes of cutting ribs and forming, the production cycle is long, and the relative efficiency Low

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