The utility model relates to the technical field of lead frames, and discloses a
modular structure for a
semiconductor lead frame mold, which comprises a lower mold body and an upper mold body, the outer surface of the lower mold body is provided with a clamping groove, the inner surface of the lower mold body is provided with a mold cavity, and the outer surface of the upper mold body is provided with an
injection port in a penetrating manner. The lower mold body and the upper mold body are installed in an inserted mode, a fixing
assembly and a circulating
assembly are arranged at the other end, away from the upper mold body, of the lower mold body, the fixing
assembly comprises a fixing box and a base which are fixedly installed at the other end, away from the lower mold body, of a fixing base, and a limiting base and a limiting ring are fixedly installed at the end, close to the lower mold body, of the fixing base. According to the
modular structure for the
semiconductor lead frame mold, through the structure and
communication design of the circulating pipes, cooling liquid is efficiently circulated, the heat exchange area is increased, mold heat dissipation is effectively achieved, stable operation of the mold is guaranteed, the lifting hooks and the clamping hooks can be conveniently matched with
lifting equipment, carrying of the lower mold body and the upper mold body is facilitated, and
operation safety and efficiency are improved.