15results about How to "Improve etch quality" patented technology

The invention discloses full-automatic polishing and etching equipment, and relates to the technical field of automatic glass etching equipment. Comprising a feeding station, a first cleaning station, an alkali polishing station, a second cleaning station and a discharging station which are sequentially distributed in the first direction. Each of the first cleaning station, the alkali polishing station and the second cleaning station comprises a plurality of functional tanks; the plurality of functional tanks are all provided with bubbling assemblies and liquid circulation assemblies, and a throwing mechanism is arranged in the functional tank of the alkali polishing station; the glass basket is used for loading glass; the transferring assembly is used for driving the glass to move along a first direction and a vertical direction; the glass basket comprises two side plates, limiting rods and a first connecting rod, the limiting rods and the first connecting rod are arranged between the two side plates, the two sides of the glass are limited between the limiting rods, the bottom of the glass abuts against the first connecting rod, and a plurality of limiting grooves are distributed in the limiting rods in the second direction; according to the technical scheme provided by the invention, the etching efficiency and the etching quality of the glass can be effectively improved.

The invention relates to an etching solution for a quartz crystal. The etching liquid is prepared from the following components in percentage by mass: 20% of hydrofluoric acid, 15% of nitric acid, 0.15-0.7% of an additive and the balance of ultrapure water. The four-component additive is prepared from sodium butyl naphthalene sulfonate, PE6400, 1-butyl-3-methylimidazolium tetrafluoroborate and 4-mercaptobutyric acid. Wherein the sodium butylnaphthalenesulfonate prevents particles generated in the etching process from being gathered and deposited, and the clearness and uniformity of the etching liquid are kept. PE6400 has both hydrophilicity and hydrophobicity, and has the effects of assisting in dissolving, dispersing and defoaming. The cooperation of the two can significantly reduce the residual protrusions after the quartz crystal is etched, reduce the roughness, and make the surface smoother. The 1-butyl-3-methylimidazolium tetrafluoroborate and the 4-mercaptobutyric acid cooperate to control lateral erosion of quartz, and a symmetrical V-shaped structure is generated.

The present invention provides a semiconductor device and a method for manufacturing the same, including: providing a substrate, on which a dielectric stacking layer including at least two dielectric layers of different materials is formed; forming an opening penetrating the dielectric stacking layer; forming a filling film layer, which is formed of the same material and fills the opening; forming an insulating layer and a conductive layer embedded in the insulating layer; etching the substrate to form a through silicon via; etching the filling film layer exposed by the through silicon via to form a dielectric through hole, wherein the conductive layer is exposed by the dielectric through hole. The present invention removes the portion of the dielectric stacking layer corresponding to the through silicon via position in advance to form an opening, and fills the opening with a single-layer filling film layer formed of the same material, that is, the portion of the dielectric stacking layer corresponding to the through silicon via position is converted from a multi-layer film structure to a single structure in advance, so that the film layer structure of the dielectric through hole formed by subsequent etching is single, thereby improving the etching quality of the dielectric through hole and reducing the process defects of forming the dielectric through hole.

The present disclosure provides an etching device, belonging to the technical field of electronic manufacturing. The etching device comprises a reaction cavity, an epitaxial tray, a liquid injection pipeline and a rotating assembly. The epitaxial tray is located in the reaction cavity, the outlet end of the liquid injection pipeline is located in the reaction cavity, and the outlet end is opposite to the epitaxial tray. The liquid injection pipeline is used for injecting etching solution. The rotating assembly is located in the reaction cavity and connected with the epitaxial tray, and is used for driving the epitaxial tray to rotate. The present disclosure can improve the problem of uneven etching depth of the edge region and the middle region of the wafer, and improve the etching quality of the wafer.

The invention discloses a copper foil etching solution as well as a preparation method, a use method and application thereof. According to the copper foil etching solution, in every 1L of water, the addition amount of copper sulfate pentahydrate is 100g to 200g, the addition amount of a substance containing ammonium ions is 200ml to 500ml, and the addition amount of ammonium fluoride is 50g to 80g. The copper foil etching solution provided by the invention has high etching rate and high etching quality, has wide application prospects in the electronic material processing fields of printed circuit board manufacturing, electronic component production and the like, and can effectively meet the requirements of the industry on an efficient and environment-friendly etching process.

The invention discloses a chemical solution for etching an SMT printing template as well as a preparation method and application of the chemical solution, and relates to the technical field of etching solutions. A preparation method of the chemical solution comprises the following steps: adding ferric trichloride into a hydrochloric acid solution to obtain a solution A; adding sodium chloride into the copper chloride solution to obtain a solution B; the preparation method comprises the following steps: mixing fluorosilane FT-922, distilled water and absolute ethyl alcohol, performing ultrasonic dispersion, taking out, and performing magnetic stirring to fully hydrolyze; adding nonylphenol polyoxyethylene ether NP-10 and sodium silicate, and uniformly stirring to obtain a composite etching protective agent; and mixing the solution A, the solution B and a composite etching protective agent according to the volume ratio of (4-6): 1: (0.01-0.05), and uniformly stirring to obtain the chemical solution for etching the SMT printing template. After the SMT printing template is etched by the chemical solution provided by the invention, the surface of the material is matte, the structure is uniform, and the etched template surface also has excellent hydrophobic and antifouling properties.

The utility model discloses an etching liquid water inlet connector assembly which comprises a main liquid inlet pipe, a plurality of sets of spraying rods and a plurality of sets of filtering connectors, filter elements are arranged in the filtering connectors, the main liquid inlet pipe is sleeved with a plurality of sets of heating sleeves, first threaded connectors are arranged at the two ends of each filtering connector, and second threaded connectors are arranged at the two ends of each filtering connector. A second threaded connector is arranged at one end of the spraying rod; according to the utility model, before entering the plurality of groups of spraying rods, etching liquid flows in the filter joints and is filtered by the filter elements in the filter joints, and impurities in the etching liquid are filtered out, so that the etching quality is improved; the main liquid inlet pipe is sleeved with the multiple sets of heating sleeves, the multiple sets of heating sleeves are electrified to heat the main liquid inlet pipe, etching liquid flowing in the main liquid inlet pipe is heated through the main liquid inlet pipe, the temperature of the etching liquid is kept within a certain range, and the etching quality is improved; the main liquid inlet pipe is in threaded connection with the multiple sets of filtering connectors, the multiple sets of filtering connectors are in threaded connection with the multiple sets of spraying rods, and assembling and disassembling are convenient.

The utility model discloses a kind of gas etchant preparation and etching system for copper-clad plate, including copper-clad plate gas etching device, ammonia gas storage device and electrolytic fluorine device;The copper-clad plate gas etching device includes cover shell, main gas pipe, input pipe, nozzle and for carrying copper-clad plate's object table;The main gas pipe is horizontally arranged in cover shell, and the upper portion of main gas pipe forms reaction cavity, and the lower portion of main gas pipe forms etching cavity;By utilizing ammonia gas storage device output ammonia, fluorine gas is electrolytically generated using electrolytic fluorine device, and ammonia and fluorine gas are mixed and sent into input pipe and react to obtain NF3 gas etchant, then NF3 gas etchant is introduced into etching cavity using main gas pipe and nozzle, copper-clad plate on the object table is etched using NF3 gas etchant, replace the etching mode of traditional acid or alkaline liquid, prevent the appearance of pool effect and side etching effect, effectively improve the etching quality of copper-clad plate, satisfy the need of use.

The invention relates to the technical field of mask manufacturing, in particular to a method for reducing the rejection rate of dry etching, which can remarkably improve the stability and accuracy of dry etching by adopting high-quality etching equipment and instruments, accurately adjusting etching parameters and combining real-time monitoring and parameter adjustment, thereby improving the etching quality and simultaneously reducing the rejection rate of dry etching. The mask plate is subjected to shower dust removal treatment before entering the process cavity, and the shower parameters are adjusted according to the specification of the mask plate, so that particle dust is effectively removed, the defect risk is reduced, and the etching quality is further guaranteed. The measures further enable the whole production process to be more controllable and stable, the production efficiency is optimized, the rejection rate is reduced, and higher economic benefits are brought to enterprises.

The invention discloses an LED display screen production device and process, and particularly relates to the field of LED display screen production.The production device comprises a solution box, the top of the solution box is open, a partition plate is arranged in the solution box, the lower half portion of the partition plate is a liquid containing area used for containing etching liquid, and the upper half portion of the partition plate is a collecting area used for collecting the etching liquid; and a conveying assembly is arranged at the top of the solution box, and the conveying assembly is used for conveying a copper-clad plate. According to the invention, by arranging the blowing mechanism, after one surface is etched, air flow is sprayed to the etched to-be-treated surface of the copper-clad plate, so that residual etching liquid condensed into beads is blown off or air-dried, and the problem of over-etching caused by the residual etching liquid condensed into beads on the complex surface of the copper-clad plate is solved; the problem that the etched surface is excessively etched due to the residual etching liquid when the other surface of the copper-clad plate is etched is avoided, and the etching quality of the copper-clad plate is improved.

The present application relates to a kind of etching solution for quartz crystal.The etching solution is composed of the following components according to mass percentage, 20% hydrofluoric acid, 15% nitric acid, 0.15-0.7% additive, and the rest is ultrapure water.The four-component additive includes sodium butylnaphthalene sulfonate, PE6400, 1-butyl-3-methylimidazolium tetrafluoroborate, 4-mercapto butyric acid.Among them, sodium butylnaphthalene sulfonate prevents the aggregation and deposition of particles generated during etching, maintains the clarity and uniformity of the etching solution.PE6400 has both hydrophilic and hydrophobic properties, and plays a role in solubilization, dispersion and defoaming.The two can significantly reduce the protrusions remaining after etching of quartz crystal, reduce roughness, and make the surface more smooth.1-butyl-3-methylimidazolium tetrafluoroborate and 4-mercapto butyric acid can control the etching of quartz side, and produce symmetrical V-shaped structure.

The invention belongs to the technical field of filtering net piece etching positioning, and particularly relates to a positioning device for filtering net piece etching, which comprises a machine body, one side of the machine body is fixedly connected with a driving motor, the driving motor drives an etching roller, and the etching roller is used for spraying ion beams to generate physical or chemical reaction with the surface of a filtering net piece so as to remove materials. An adjusting assembly is arranged above the machine body and comprises a fixing frame, the upper surface of the fixing frame is fixedly connected with a fixing motor, the output end of the fixing motor is fixedly connected with a lead screw, the lead screw drives a fixing shaft in a reciprocating mode, and the fixing shaft is fixedly connected with the adjusting assembly. The circumferential surface of the fixed shaft is sleeved with an auxiliary roller, and the auxiliary roller is used for assisting the etching roller in positioning the filter plate in the etching process; and by arranging the adjusting assembly and the beating assembly, the problem that the subsequent etching quality is unqualified due to deformation of the metal filter plate caused by existing positioning and clamping is solved.

The invention relates to the technical field of glass processing technologies, in particular to an AG treatment technology of a glass cover plate, which specifically comprises the following steps: cleaning the surface of the glass cover plate by using a chemical cleaning agent, coating a layer of masking material on the glass cover plate, curing the masking material on the surface of the glass cover plate, and carrying out plasma treatment on the glass cover plate. The glass cover plate is put into etching liquid to be etched, the etching liquid is in a flowing state, nitric acid and sulfuric acid are added into the etching liquid to be used for controlling the etching quality, a uniform microscopic concave-convex structure is formed on the surface of the glass cover plate, and the glass cover plate is cleaned after etching is completed. According to the process, a uniform microscopic concave-convex structure can be formed on the surface of the glass cover plate, and the service life of the glass cover plate is longer.

The application provides a radio frequency focusing device, a lower electrode structure and a process chamber. The radio frequency focusing device comprises a base ring, an accommodating cavity is arranged in the base ring, the accommodating cavity is arranged around the axis of the base ring; a focusing ring is arranged in the accommodating cavity, the focusing ring is used for providing a bias voltage; a conductive part is electrically connected with the focusing ring, and the conductive part is used for being electrically connected with a radio frequency source. The radio frequency focusing device of the application sets the annular accommodating cavity on the base ring and sets the focusing ring in the accommodating cavity. During the etching process, the base ring can block the plasma bombarding the focusing ring, so that the risk of etching the focusing ring by the plasma is effectively reduced, the thickness uniformity of the surface of the focusing ring is ensured, the distribution of the plasma is avoided from being affected by the uneven thickness of the surface of the focusing ring after long time use, and the stability of the etching quality is ensured.

The present application discloses a chemical solution, a preparation method and an application thereof for etching of SMT printing templates, and relates to the technical field of etching liquids. The preparation method of the chemical solution is as follows: ferric chloride is added to a hydrochloric acid solution to obtain a solution A; sodium chloride is added to a cupric chloride solution to obtain a solution B; fluorosilane FT-922, distilled water and anhydrous ethanol are mixed and ultrasonically dispersed, and then magnetic stirring is taken out to fully hydrolyze it; nonylphenol polyoxyethylene ether NP-10 and sodium silicate are added and stirred evenly to obtain a composite etching protective agent; solution A, solution B, and a composite etching protective agent are mixed in a volume ratio of 4-6:1:0.01-0.05, stirred evenly, and a chemical solution for etching of SMT printing templates is obtained. After the chemical solution provided in the present application etches the SMT printing template, the surface of the material is matte and the structure is uniform, and the surface of the template after etching also has excellent hydrophobic and antifouling properties.