2results about How to "Improve etch quality" patented technology

The present disclosure provides an etching device, belonging to the technical field of electronic manufacturing. The etching device comprises a reaction cavity, an epitaxial tray, a liquid injection pipeline and a rotating assembly. The epitaxial tray is located in the reaction cavity, the outlet end of the liquid injection pipeline is located in the reaction cavity, and the outlet end is opposite to the epitaxial tray. The liquid injection pipeline is used for injecting etching solution. The rotating assembly is located in the reaction cavity and connected with the epitaxial tray, and is used for driving the epitaxial tray to rotate. The present disclosure can improve the problem of uneven etching depth of the edge region and the middle region of the wafer, and improve the etching quality of the wafer.

The utility model discloses a kind of gas etchant preparation and etching system for copper-clad plate, including copper-clad plate gas etching device, ammonia gas storage device and electrolytic fluorine device;The copper-clad plate gas etching device includes cover shell, main gas pipe, input pipe, nozzle and for carrying copper-clad plate's object table;The main gas pipe is horizontally arranged in cover shell, and the upper portion of main gas pipe forms reaction cavity, and the lower portion of main gas pipe forms etching cavity;By utilizing ammonia gas storage device output ammonia, fluorine gas is electrolytically generated using electrolytic fluorine device, and ammonia and fluorine gas are mixed and sent into input pipe and react to obtain NF3 gas etchant, then NF3 gas etchant is introduced into etching cavity using main gas pipe and nozzle, copper-clad plate on the object table is etched using NF3 gas etchant, replace the etching mode of traditional acid or alkaline liquid, prevent the appearance of pool effect and side etching effect, effectively improve the etching quality of copper-clad plate, satisfy the need of use.