The invention relates to a low
line width and line space
etching control method of a thick
copper plate. The method comprises that
cutting, boring and electroless
copper plating are carried out on the thick
copper plate, a dry film which does not cover holes is pasted to the thick copper plate after electroless
copper plating, and
exposure and development are carried out; after the developed thick copper plate is qualified in AOI scanning, patterned electro-coppering and electro-
tinning are carried out, and first film removing, alkali
etching and
tin stripping are carried out successively; and when the thick copper plate after the first
etching is qualified in AOI scanning, the dry film which does not cover the holes is pasted,
exposure and development are carried out, patterned electro-coppering and electro-
tinning are carried out after the cooper plate is qualified in AOI scanning, second film removing, alkali etching and
tin stripping are carried out successively to obtain a circuit board, and a next procedure is moved to. The method can avoid board material waste caused by insufficient low
line width and line space etching in integrated
electroplating and etching of the board, etching burrs are reduced, the etching quality is improved,
material consumption of the etching technology is reduced, and consumption of copper is reduced.