Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Etching plaster for metal and metal oxide transparent conducting layer and etching process

A transparent conductive layer and oxide technology, applied in the field of etching paste, can solve the problems of complex process, pollute the environment, accelerate equipment aging, etc., and achieve the effect of simplifying the process flow, improving the etching quality, and reducing the cost of environmental protection

Inactive Publication Date: 2010-06-02
张林
View PDF2 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] (1) The organic solvents used in the process, such as thinner, strong acid and strong alkali, produce strong pungent odors, which not only affect the health of workers, pollute the environment, but also corrode equipment and accelerate the aging of equipment
[0004] (2) The process is too complicated, and the requirements of each program are harsh, such as: the regulation of pH is difficult to control

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Etching plaster for metal and metal oxide transparent conducting layer and etching process
  • Etching plaster for metal and metal oxide transparent conducting layer and etching process
  • Etching plaster for metal and metal oxide transparent conducting layer and etching process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The formula of etching paste of the present invention is: by weight, it is made up of the following components:

[0033] Take 0.1 part of ferric chloride;

[0034] Take 2 parts of sulfuric acid and oxalic acid;

[0035] Take 10 parts of water-based polyurethane, polyvinyl alcohol, and water-soluble epoxy resin;

[0036] 0.1 part of castor oil sulfuric acid compound and polyphosphate;

[0037] The defoamer is 0.1 part of SN-D468 defoamer produced by San Nopco in Japan;

[0038] Thickeners are colloidal silicon and methyl cellulose to take 10 parts;

[0039] The bacteriostatic agent is 0.1 part of TS-802 bactericidal and algicide;

[0040] The amount of water is 30 parts; the etching paste is prepared by mixing the above-mentioned raw materials.

[0041] The etching process of the present invention for the etching paste of the metal and metal oxide transparent conductive layers is:

[0042] like figure 1 As shown, the etching paste was printed on indium tin oxide I...

Embodiment 2

[0044] The formula of etching paste of the present invention is: by weight, it is made up of the following components:

[0045] Take 20 parts of ferrous chloride;

[0046] Take 50 parts of sulfuric acid and pyrosulfuric acid;

[0047] Take 30 parts of water-soluble alkyd resin, polyethylene glycol and modified starch;

[0048] Take 10 parts of polyphosphate, silicate and polyacrylic acid derivatives;

[0049] The antifoaming agent is Bevaloid691 antifoaming agent produced by Bew-aloid in the United Kingdom, and take 5 copies;

[0050] Thickeners are carboxymethyl cellulose and hydroxymethyl cellulose, take 40 parts;

[0051] The bacteriostatic agent is 10 copies of SJ-304 bactericidal and algicide;

[0052] The amount of water is 2 parts; the etching paste is prepared by mixing the above-mentioned raw materials.

[0053] The etching process of the present invention for the etching paste of the metal and metal oxide transparent conductive layers is:

[0054] The etching p...

Embodiment 3

[0056]The formula of etching paste of the present invention is: by weight, it is made up of the following components:

[0057] Take 10 parts of copper chloride;

[0058] Take 25 parts of sulfonic acid and carboxylic acid;

[0059] 20 parts of modified cellulose ether, water-soluble oil, rosin modified resin and gum arabic;

[0060] 5 parts of silicate, polyacrylic acid derivatives and polyoxyethylene glycol alkyl ester;

[0061] The antifoaming agent is Bevaloid691 antifoaming agent produced by Bew-aloid in the United Kingdom, and take 3 copies;

[0062] The thickener is polyacrylic acid, organic bentonite and inorganic bentonite to take 25 parts;

[0063] The bacteriostatic agent is 5 copies of 2.4.5.6-tetrachloroisophthalic acid;

[0064] The amount of water is 20 parts; the etching paste is prepared by mixing the above-mentioned raw materials.

[0065] The difference between this embodiment and the second embodiment is that the material is a conductive film on glass, t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an etching plaster for metal and metal oxide transparent conducting layers and an etching process, in the invention, lagging production processes, such as the use of organic solvents, strong acid etching and strong alkaline cleaning and the like, are not used any longer, instead, the etching plaster and the etching process which do not pollute the environment are used. The etching plaster comprises the following components in parts by weight: 0.1-20 parts of salt substance, 2-50 parts of non-volatile acid, 10-30 parts of aqueous high molecular polymer, 0.1-10 parts of dilute wetting dispersant, 0.1-5 parts of defoamer, 10-40 parts of thickening agent, 0.1-10 parts of bacteriostat and 2-30 parts of water. The invention simplifies the process flow, cancels acid and alkali soaking and the use of organic solvents, lowers the environmental protection cost, improves the etching quality of products, and has the effects of high efficiency, energy saving and environmental protection. The invention is widely applied to the fields of electron, semiconductors, fine chemistry industry and the like.

Description

technical field [0001] The invention relates to an etching paste, in particular to an etching and etching process of a transparent metal conductive layer or an oxide transparent conductive layer used in the fields of electronics, semiconductors, fine chemicals and the like. Background technique [0002] The known etching process of conductive coating on glass plate or PVC soft film is: screen printing (acid-resistant ink or protective glue) → drying → acid bubble (etching) → alkali bubble (ink removal) → clean water → pure water cleaning Machine cleaning. That is, according to the requirements of the circuit board circuit pattern, it is coated with acid-resistant ink or protective glue on the conductive coating by screen printing; after it is dried, the glass plate or PVC soft film is immersed in the acid solution, so that it is not covered with ink. The covered conductive coating is corroded, and the circuit pattern covered by acid-resistant ink or protective glue is retai...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09K13/06C09K13/00C23F1/14C03C15/00
Inventor 张林
Owner 张林
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products