Double-side etching high-temperature and high-pressure printed circuit board heat exchanger

A printed circuit board, high temperature and high pressure technology, applied in the direction of heat exchanger type, indirect heat exchanger, laminated components, etc. Uneven distribution, affecting the safety of heat exchanger operation, etc., to achieve the effect of improving flow uniformity distribution, increasing heat exchange area utilization, and reducing thermal stress

Inactive Publication Date: 2015-11-11
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, there is no public research on the design of the inlet and outlet structure of the printed circuit board heat exchanger, and there is no public publication on the integrally formed structure using the etching method.
[0005] However, the heat exchange plate of the above-mentioned continuous channel printed circuit board heat exchanger is etched on one side, and the cross section of the flow channel is semicircular. When the heat exchanger operates under high temperature and high pressure conditions, considerable The large thermal stress concentration makes the material in a state of thermal fatigue for a long time. In severe cases, it will cause plastic deformation of the material, affect the heat exchange efficiency, and also seriously affect the safety of use; at the same time, the unreasonable layout of the inlet flow channel will make the heat exchanger inside Fluid distribution is uneven, resulting in increased heat exchanger resistance and local temperature rise, thus affecting the operation safety of the heat exchanger

Method used

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  • Double-side etching high-temperature and high-pressure printed circuit board heat exchanger
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  • Double-side etching high-temperature and high-pressure printed circuit board heat exchanger

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Embodiment Construction

[0031] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0032] refer to figure 1 As shown, a double-sided etching high-temperature and high-pressure heat exchanger includes: a core 1, which is divided into three parts according to the arrangement of the etching flow channel, the front section 2 of the core body is the inlet diversion section, the middle section 3 of the core body, and the back section of the core body Section 4 is the outlet diversion section, the hot-side inlet pipe 6 and the cold-side outlet pipe 8 are connected to the front section 2 of the core body through the expansion section 5, and the hot-side outlet pipe 7 and the cold-side inlet pipe 9 are connected to the core through the flow expansion section 5 The rear section 4 of the body ensures countercurrent heat exchange in the core heat exchange area of ​​the middle section 3 of the core body.

[0033] refer to figure 2 As...

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Abstract

The invention relates to a double-side etching high-temperature and high-pressure printed circuit board heat exchanger. The double-side etching high-temperature and high-pressure printed circuit board heat exchanger is composed of a heat exchanging core, a flow equalizing section, a hot fluid inlet and outlet port and a cold fluid inlet and outlet port. The core is divided into an inlet section, a core heat exchanging section and an outlet section. According to the heat exchanger, runners are machined in the double sides of heat exchanging plates with a certain thickness in a photochemistry manner, a laser etching manner, a machining manner and the like. The first heat exchanging plate and the second heat exchanging plate are arranged in a spaced manner. A fusion type channel novel structure is adopted in an inlet distribution section, and fluid in the heat exchanger can be easily distributed more evenly. The heat exchanging efficiency of the heat exchanger can be improved, the thermal stress damage at an existing channel sharp corner is effectively avoided, the circulation section area of the heat exchanger is increased, and the compactness of the heat exchanger is improved; thermal stress distribution at the sharp corner is improved, plastic deformation caused by stress concentration is avoided, and the even distribution of fluid in the heat exchanger is improved; and the safety performance of the heat exchanger is improved, and the service life of the heat exchanger is prolonged.

Description

technical field [0001] The invention relates to a high-temperature and high-pressure plate heat exchanger used in petrochemical, energy, metallurgy, refrigeration, nuclear energy and other industries, in particular to a high-temperature and high-pressure printed circuit board heat exchanger composed of double-sided etched plates, which can adopt photochemical Etching, laser etching and machining and diffusion welding process preparation. Background technique [0002] Plate heat exchanger is an important heat exchange equipment widely used in petrochemical, energy, metallurgy, refrigeration, nuclear energy and other industrial fields. Due to the characteristics of mature manufacturing process, high compactness and high heat transfer efficiency, it occupies a large proportion in heat exchange equipment. In the high temperature and high pressure plate heat exchanger, the hot and cold fluids exchange heat through the wall of the heat exchange plate. In order to meet the purpos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D9/00F28F3/04
Inventor 王秋旺褚雯霄马挺曾敏
Owner XI AN JIAOTONG UNIV
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