Non-linear fin heat sink

Abstract

A non-linear fin heat sink is provided for dissipating / removing heat uniformly from a device, where the heat generation is non-uniform over that device, while also providing a small and relatively lightweight heat sink. The heat sink has extended surface protrusions that are optimally shaped in recognition of convective heat transfer, conductive heat transfer, and flow resistance allowing the heat sink to offset the temperature rise of a coolant media and provide enhanced cooling for the coolant temperature, deliver optimized cooling efficiency per the local physical properties of the coolant media, be used with a fluid for effectuating heat transfer; either liquid coolant, gas coolant or a combination thereof. Furthermore the heat sink features turbulence enhancement of the coolant stream by a pin array through which coolant stream passes, such fin array featuring a non-linear shape, spacing, and height pattern to provide optimal cooling while simultaneously reducing volume and flow resistance.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to methods and apparatuses for heat transfer. More particularly, the invention relates to optimized extended surfaces used for cooling electronic components and other objects whereas such methods and apparatuses involve heat transfer, such as the removal, absorption and / or dissipation of heat.[0003]2. Description of the Related Art[0004]A “heat sink” (alternatively spelled “heatsink”) is a device used for removing, absorbing and / or dissipating heat from a thermal system. Generally speaking, conventional heat sinks are founded on well known physical principles pertaining to heat transference. Heat transference concerns the transfer of heat (thermal energy) via conduction, convection, radiation or some combination thereof. In general, heat transfer involves the movement of heat from one body (solid, liquid, gas or some combination thereof to another body (solid, liquid, gas or some combinatio...

AI Technical Summary

Benefits of technology

[0039]In view of the foregoing, it is an object of the present invention to provide heat sink method and apparatus which are capable of dissipating / removing heat from a device or other to-be-cooled object which is characterized by a high power density.

[0043]Another object of the present invention is to provide heat sink method and apparatus which offsets the temperature rise of a coolant media and provide enhanced cooling for the local coolant temperature.

[0046]The present invention further features turbulence enhancement of the coolant stream by a pin array through which the coolant stream passes. According to many embodiments, this invention additionally features a non-linear shape, spacing, and height pattern to provide optimal cooling while simultaneously reducing volume and flow resistance.

[0050]The inventive fluid-cooling heat sink apparatus typically comprises fluidity means (e.g., a fluid generation system) and a member. The subject body has a body surface portion. The member has a member surface portion and a plurality of pins projecting therefrom. According to frequent inventive practice the pins are approximately parallel; however, such parallelness is not required in accordance with the present invention. Each pin has a pin end surface portion opposite the member surface portion. The fluidity means includes means emissive of a fluid which is flowable along at least a part of the member surface portion so as to be contiguous at least a part of the body surface portion when at least a part of the body surface portion communicates with at least some of the pin end surface portions. Typically, the pins are arranged and configured in such manner as to be capable of increasing the turbulence of the fluid which passes between the member surface portion and the body surface portion.

[0052]This invention meets most military and commercial requirements for dissipating / removing heat. The inventive heat sink: is capable of dissipating heat from a single or multiple high power density devices; can provide uniform or localized cooling over a baseplate surface area; is highly efficient in terms of mass, total volume, pumping power, and thermal resistance; and, carries relatively low manufacture and assembly costs.

[0056]For instance, in inventive applications involving a module having a dielectric (e.g., ceramic) baseplate, the entirety of the heat is removed through the baseplate by the working fluid (e.g., water or air). The invention's fins serve as mechanical support for the ceramic baseplate and to enhance the turbulent flow of the working fluid; the turbulent flow increases the heat-removal effectiveness of the working fluid. The present invention not only provides support for the baseplate to prevent breakage, but also cools the baseplate.

Problems solved by technology

Also, fin patterns that produce greater cross sectional flow area between fins will have higher turbulence.

Such an arrangement can yield a high heat transfer coefficient at higher flow resistance in the original orientation but will offer low flow resistance and low heat transfer when rotated.

The rapid change in vector and momentum causes a large reduction in the thickness of the velocity and boundary layers at impingement point 164 resulting in a local area of high heat transfer.

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