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Preparation method of local binderless reinforce panel

A local adhesive-free and reinforcing sheet technology, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve problems such as low production quality and achieve the effect of improving mass production

Active Publication Date: 2014-04-23
南通钢安机械制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a method for preparing a partially glue-free reinforcement sheet, which improves the problem of low production quality in the traditional partial glue-free reinforcement sheet process

Method used

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  • Preparation method of local binderless reinforce panel
  • Preparation method of local binderless reinforce panel
  • Preparation method of local binderless reinforce panel

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Embodiment Construction

[0021] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0022] Embodiments of the present invention include: a method for preparing a partially glue-free reinforcing sheet, the steps of the preparation method comprising:

[0023] First, use the substrate punching die 7 to punch the substrate 1 out of the product hole 2 and the substrate positioning hole 3;

[0024] Second, use the rubber material punching die 8 to punch the rubber material 4 out of the relief area 5 and the rubber material positioning hole 6;

[0025] Thirdly, guide the die-cut base material 1 and adhesive material 4 through the glue-covered guide rod 10;

[0026] Fourth, press the aligned base material 1 and adhesive material 4 through the positioning an...

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Abstract

The invention discloses a preparation method of a local binderless reinforce panel. The preparation method comprises the steps of I, punching a product hole and a base material positioning hole in a base material by utilizing a base material punching die; II, punching an avoiding area and a rubber material positioning hole in a rubber material by utilizing a rubber material punching die; III, centering the punched basal material and the rubber material through a coating guide rod; IV, laminating the centered basal material and the rubber material through a positioning laminating mechanism; V, centering the laminated basal material and the rubber material to a semi-finished product through a centering rod of a forming mechanism; VI, finally placing the semi-finished product into a forming mechanism to be molded in a punching manner so as to form a local binderless reinforce panel. By utilizing the method, the local binderless reinforce panel with precise position and different shapes can be obtained; moreover, continuity in operation can be realized, a foundation is set for realizing the high-quality flexible plate, and the high productivity is greatly improved.

Description

technical field [0001] The invention relates to the field of flexible circuit board production, in particular to a method for preparing a partially glue-free reinforcing sheet. Background technique [0002] In recent years, with the rapid development of the microelectronics industry, the layout of the flexible board has become more scientific and reasonable, and the shape of the reinforcement sheet must also change accordingly. Therefore, it is necessary to do glue-free treatment on the local area of ​​the reinforcement sheet. At present, the production of this kind of partial glue-free reinforcement sheet can only be produced by manual glue coating, which is very easy to produce defects such as misalignment and overflow glue, and the success rate Low, high cost, unable to achieve mass production. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a method for preparing a partial glue-free reinforcement sheet, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 王中飞
Owner 南通钢安机械制造有限公司
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