Magnetoresistance effect device and method of production of the same

a technology of magnetic effect and magnetic field, which is applied in the field of magnetic field, can solve the problems of less suitable mass production process, and achieve the effects of excellent properties, extremely high mr ratio, and excellent properties

Inactive Publication Date: 2006-03-16
CANON ANELVA CORP +1
View PDF18 Cites 87 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0016] According to above magnetoresistance effect device, since the barrier layer has a single crystal or highly oriented fiber-texture structure, the flow of current between the ferromagnetic layers can be made straight and the MR ratio can be made an extremely high value.
[0017] In the magnetoresistance effect device, preferably the MgO layer is a single crystal layer formed by the sputtering method. However, an MgO layer with highly oriented fiber-texture structure also yield excellent properties. According to this configuration, the intermediate barrier layer can be produced simply. This is suitable for mass production.
[0018] In the magnetoresistance effect device, preferably the MgO layer is a single crystal layer formed using an MgO target and the sputtering method. The MgO layer can also be a highly oriented fiber-texture structure.
[0019] In the magnetoresistance effect device, preferably the ferromagnetic layers are CoFeB layers.
[0020] The method of production of a magnetoresistance effect device is a method of production of a magnetoresistance effect device including a multilayer structure comprised of a pair of ferromagnetic layers and a barrier layer positioned between them, comprising forming at least one ferromagnetic layer so that at least at least the part contacting the barrier layer is amorphous and forming the barrier layer having a single crystal or highly oriented fiber-texture structure by using the sputtering method. Further, in the method of production of a magnetoresistance effect device, preferably the MgO layer is formed by RF magnetron sputtering using an MgO target.
[0021] According to the present invention, since the tunnel barrier layer forming the intermediate layer of the TMR device or other magnetoresistance effect device is an MgO layer having a single crystal or highly oriented fiber-texture structure, the MR ratio can be made extremely high. When using this as a memory device of an MRAM, a gigabit class ultra-high integrated MRAM can be realized. Further, by forming the a single crystal or highly oriented fiber-texture MgO layer by the sputtering method, it is possible to fabricate a magnetoresistance effect device suitable for mass production and having high practical applicability.

Problems solved by technology

Further, epitaxial growth of an Fe film by an expensive MBE device, formation of an MgO film by ultrahigh vacuum electron beam evaporation and other sophisticated film deposition technology are required.
There is the problem that the longer the film deposition time, the less suitable the process for mass production.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Magnetoresistance effect device and method of production of the same
  • Magnetoresistance effect device and method of production of the same
  • Magnetoresistance effect device and method of production of the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Below, a preferred embodiment of the present invention will be explained with reference to the attached drawings.

[0030]FIG. 1 shows an example of the multilayer structure of a magnetoresistance effect device according to the present invention, in particular shows the multilayer structure of a TMR device. According to this TMR device 10, a substrate 11 is formed with a multilayer film comprised of for example nine layers forming the TMR device 10. In this nine-layer multilayer film, magnetic films etc. are stacked from the bottommost first layer to the topmost ninth layer with “Ta”, “PtMn”, “70CoFe”, “Ru”, “CoFeB”, “MgO”, “CoFeB”, “Ta”, and “Ru” in that order. The first layer (Ta: tantalum) is an undercoat layer, while the second layer (PtMn) is an anti-ferromagnetic layer. The layers from the third layer to the fifth layer (70 CoFe, Ru, CoFeB) form fixed magnetization layers. The substantive fixed magnetization layer is the fifth layer ferromagnetic layer comprised of “CoFeB...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
temperatureaaaaaaaaaa
pressureaaaaaaaaaa
fiber-texture structureaaaaaaaaaa
Login to view more

Abstract

A magnetoresistance effect device including a multilayer structure having a pair of ferromagnetic layers and a barrier layer positioned between them, wherein at least one ferromagnetic layer has at least the part contacting the barrier layer made amorphous and the barrier layer is an MgO layer having a highly oriented texture structure.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a magnetoresistance effect device and a method of production of the same, more particularly relates to a magnetoresistance effect device fabricated utilizing a simple sputtering film-formation method and having an extremely high magnetoresistance ratio and a method of production of the same. [0003] 2. Description of the Related Art [0004] In recent years, as nonvolatile memories, magnetic memory devices called “magnetoresistive random access memories (MRAMs)” have come into attention and have started entering the commercial stage. MRAMs are simple in structure, so ultra-high density integration to the gigabit level is easy. In MRAMs, the relative orientation of the magnetic moment is utilized to create the storage action. As the result, the number of possible re-writability is extremely high and the operating speed can be reduced to the nanosecond level. [0005]FIG. 4 shows the struct...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(United States)
IPC IPC(8): G11B5/33G11C11/14G11B5/127
CPCB82Y25/00B82Y40/00C23C14/081C23C14/34G11C11/16H01L43/12H01F10/3254H01F41/18H01F41/307H01L43/08H01F10/3204G11C11/161H10N50/10H10N50/01G11C11/15
Inventor DJAYAPRAWIRA, DAVID D.TSUNEKAWA, KOJINAGAI, MOTONOBUMAEHARA, HIROKIYAMAGATA, SHINJIWATANABE, NAOKIYUASA, SHINJI
Owner CANON ANELVA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products