33results about "Cathode sputtering application" patented technology

[Problem] To electrically connect a lead layer and a protective film reliably even when the film thickness of a protective film that covers a functional film is extremely thin. [Solution] After the conductive protective film 51 is formed on the surface of the functional film 20, reverse sputtering is performed while a portion of the surface of the protective film 51 is covered with a mask 60, thereby physically restoring a natural oxide film 52 formed on the surface of the protective film 51 not covered by the mask 60. Thereafter, a lead layer 40 is formed on the surface of the protective film 51 not covered by the mask 60. Consequently, since the natural oxide film 52 formed on the surface of the protective film 51 can be removed without performing etching, the lead layer 40 and the protective film 51 can be connected electrically without damaging the functional layer 20 even when the film thickness of the protective film 51 is extremely thin.

A device having a spin valve layer sequence, wherein the spin valve layer sequence includes a first magnetic layer having a variable direction of magnetization, a second magnetic layer having a fixed direction of magnetization, and a stabilization layer for stabilizing the fixed direction of magnetization of the second magnetic layer, wherein the stabilization layer includes a precious metal-free antiferromagnet.

To reliably electrically connect the lead layer and protective film that covers a functional film even when the film thickness of the protective film is very small. After formation of a conductive protective film 51 on the surface of a functional film 20, reverse sputtering is performed with a part of the surface of the protective film 51 covered with a mask 60 to physically reduce a native oxide film 52 formed on a part of the surface of the protective film 51 that is not covered with the mask 60. Thereafter, a lead layer 40 is formed on a part of the surface of the protective film 51 that is not covered with the mask 60. This can remove the native oxide film 52 formed on the protective film 51 without requiring etching. Thus, even when the film thickness of the protective film 51 is very thin, it is possible to electrically connect the lead layer 40 and protective film 51 without damaging the functional film 20.

A system for the fabrication of ε-phase MnAl / Co bilayer thin films, consisting of: a) a high-frequency magnetron sputtering system for the deposition of multilayer thin films on a silicon substrate, the sputtering system comprising: • a system for maintaining base pressure, configured to maintain a constant pressure; • three 2-inch targets consisting of MnAl, Co and Ta; and • a substrate rotation mechanism configured to rotate the substrate at a constant number of revolutions per minute; b) a layer deposition unit that is operationally connected to the RF magnetron sputtering system and enables the sputtering system to deposit layers sequentially: • a 3 nm thick Ta buffer layer on the silicon substrate; • a 60 nm thick MnAl layer on the Ta buffer layer; • a Co layer with a thickness of 1 nm to 5 nm on the MnAl layer; and • a 5 nm thick Ta top layer on the Co layer; c) an annealing furnace configured to anneal the deposited Ta and MnAl layers for 2 hours at 600 °C before the Co layer is deposited; and d) a characterization unit for analyzing the produced thin films, wherein the characterization unit comprises the following: • an X-ray diffraction (XRD) system for structural characterization; • an optical 3D profilometer for measuring surface structure and mean roughness; and • a field emission scanning electron microscope (FESEM) with energy-dispersive X-ray spectrometer (EDS) for analyzing surface morphology and elemental composition.

The invention relates to the technical field of magnetic materials. The invention provides a light metal-based vertical magnetic anisotropy thin film and a preparation method thereof. The light metal-based vertical magnetic anisotropy thin film structure is a light metal non-magnetic layer / CoFeB / MgO / Ta layer multi-layer film, the use of strong spin orbit coupled heavy metal materials such as W and Ta is avoided, and the preparation cost is reduced; according to the preparation method of the light metal-based vertical magnetic anisotropy thin film, atmosphere outside argon is not needed during magnetron sputtering of the thin film, the sputtering rate is controlled through off-axis sputtering to optimize the quality of a CoFeB / MgO interface, annealing machining is not needed, the low-cost vertical magnetic anisotropy thin film is obtained, meanwhile, a stainless steel mask plate in a Hall bar shape is combined, and the light metal-based vertical magnetic anisotropy thin film is obtained. The prepared thin film has a Hall bar shape, so that photoetching processing is not needed, a binding wire can be directly carried out, an abnormal Hall effect test is carried out in a magnetic field, and a rectangular Hall loop is obtained.

The present application belongs to the technical field of metal magnetic films, and specifically relates to a semi-hard magnetic alloy film material, a preparation method and a magnetic grating device. The preparation method of the semi-hard magnetic alloy film material provided in the present application comprises the following steps: cleaning the substrate, then depositing a FeCoCr film on the surface of the substrate to obtain a prepared FeCoCr film, then performing Al ion implantation on the prepared FeCoCr film, and then performing vacuum annealing; in the Al ion implantation, the implantation energy is 28 keV-32 keV, and the bias voltage is 450 V-500 V; the vacuum annealing temperature is 540℃-560℃. In the preparation method of the specific semi-hard magnetic alloy film material provided in the present application, Al ions are implanted into the FeCoCr film by a specific method, so that the amplitude modulation decomposition temperature of the film is reduced, and then only a relatively low temperature annealing treatment is required to obtain a FeCoCr film with high magnetic properties, thereby avoiding material defects caused by high-temperature processing in traditional methods.

The application relates to a preparation method of a high-coercivity high-remanence-ratio composite ferrite film material, which comprises the following steps: (1) preparing a BaFe9Al3O 19 ferrite target material;(2) depositing an amorphous BaFe9Al3O 19 ferrite film on an Al2O3 (000l) substrate by a pulse laser deposition method;(3) placing the grown amorphous BaFe9Al3O 19 ferrite film in a muffle furnace to perform annealing, so as to form BaFe2O4 and BaFe9Al3O 19 composite ferrite films.The application prepares a hexagonal ferrite target material with good compactness by solid-phase method and Al ion doping, and selects a pulse laser deposition technology to deposit a film; BaFe2O4 and BaFe9Al3O 19 composite films are formed by controlling the growth conditions of the film, the characteristics of soft and hard magnetic composite are fully exerted, the magnetic performance of the ferrite film is improved, and finally, the composite ferrite film material with the c-axis out-of-plane orientation and the high-coercivity characteristic is prepared.The application has the characteristics that the coercivity is greater than 1.83T, the remanence ratio reaches 93%, and the application has a good application prospect in the fields of self-biased microwave devices and magnetic recording.

Provided are a sputtering target for a magnetic material, a sputtering target assembly for a magnetic material, and a method for producing a sputtering target for a magnetic material, with which peeling of a redeposited film can be satisfactorily suppressed. A sputtering target for a magnetic material, the sputtering target having a sputtering region and a non-sputtering region, the arithmetic mean curvature (Spc) of peaks on the surface of the non-sputtering region being 3200 mm-1 or more.

The application discloses a Sm-Fe-based permanent magnetic film and a preparation method and application thereof. The Sm-Fe-based permanent magnetic film comprises a Ta buffer layer, a Sm-Fe layer and a Ta cover layer which are sequentially arranged along the thickness direction of a substrate, the Sm-Fe layer has perpendicular magnetic anisotropy, and the Sm-Fe layer comprises pure SmFe x polycrystalline film, x = 1.8-2. The preparation method comprises the following steps: sequentially depositing a Ta buffer layer, a Sm-Fe layer and a Ta cover layer on a substrate by using a magnetron sputtering technology, and performing annealing heat treatment on the obtained composite film to prepare the Sm-Fe-based permanent magnetic film. The Sm-Fe-based permanent magnetic film has excellent magnetic anisotropy in the vertical direction and has higher coercivity. The successful preparation of the good perpendicular anisotropy magnetic film has important application value in the application of micro-electro-mechanical systems, micro-electronic systems, magnetic recording materials and spin electronic devices.

The application belongs to the field of soft magnetic high-entropy alloy material and magnetron sputtering technology, and particularly relates to a high-entropy alloy and nitride multilayer soft magnetic film for high frequency and a preparation method. The high-entropy alloy soft magnetic film layer comprises Zr and / or B, Fe, Co and Ni elements; the high-entropy alloy soft magnetic nitride film layer comprises Zr and / or B, Fe, Co, Ni and N elements, the N element is nitrogen gas with a certain partial pressure introduced in the magnetron sputtering process and nitrogen atoms are deposited into the high-entropy alloy soft magnetic nitride film layer, pure Ar and argon / nitrogen mixed gas are alternately used, the high-entropy alloy soft magnetic film layer and the high-entropy alloy soft magnetic nitride film layer are alternately sputtered on the surface of the substrate to obtain the multilayer soft magnetic film, the high-entropy alloy nitride soft magnetic film has high resistivity and low coercivity, the high-entropy alloy soft magnetic film has high saturation magnetization, the multilayer soft magnetic film has higher saturation magnetization and resistivity, and is suitable for high frequency application.

The embodiment of the invention provides a reversible magnetic thin film material, a magnetism regulation and control method, a preparation method and a memory, the reversible magnetic thin film material is used for reversible magnetism regulation and control, the reversible magnetic thin film material comprises an Sb-Co alloy type thin film, and the atomic ratio of Sb to Co is 3: 1. According to the reversible magnetic thin film material provided by the embodiment of the invention, a highly reversible block metal magnetic switch is realized, the magnetic modulation amplitude of block ferromagnetic metal is improved, the metal shielding effect is broken through to realize volume phase regulation and control, stable operation at room temperature is ensured, and the reversible magnetic thin film material has reversible and non-volatile operation characteristics; therefore, a way is laid for practicability of high-performance magnetic electronic devices.

The invention provides a magnetic thin film. The magnetic thin film comprises a substrate and a composite layer, the composite layer comprises a plurality of laminated magnetic layers and a plurality of insulated dielectric layers, and the plurality of magnetic layers and the plurality of dielectric layers are laminated and alternately arranged on one side of the substrate. The thickness of each magnetic layer ranges from 2 nm to 100 nm. And the thickness of each dielectric layer is 2 nm to 10 nm. The composite layer includes a plurality of cracks distributed aperiodically. At least part of the cracks extend in different directions along the cross section perpendicular to the lamination direction of the composite layer, and at least part of the cracks extend non-linearly along the cross section perpendicular to the lamination direction of the composite layer. The invention also provides an electronic device and a semiconductor packaging module applying the magnetic thin film, and a preparation method of the magnetic thin film. And the magnetic film is a wave-absorbing material with high magnetic conductivity in a radio frequency microwave frequency band. The magnetic thin film still has high magnetic conductivity and high resistivity under the condition that the thickness reaches the micron order.

The invention belongs to the technical field of soft magnetic high-entropy alloy materials and magnetron sputtering, and particularly relates to a nitrogen-doped high-entropy alloy film inductance material and a preparation method thereof.The high-entropy alloy components comprise B and / or Zr, Fe, Co and Ni elements, and the nitrogen-doped high-entropy alloy film inductance material is obtained through a magnetron sputtering method. The method specifically comprises the steps that in the sputtering process of the high-entropy alloy film, nitrogen with certain partial pressure is introduced, and the nitrogen element is deposited into the high-entropy alloy film and forms nitride with a high-entropy alloy element; the high resistivity characteristic of the material is improved, magnetic performance deterioration caused by introduction of a non-magnetic phase is weakened, meanwhile, the material has excellent magnetic performance, the performance of the film is regulated and controlled by controlling nitrogen partial pressure, nitrides of various different structures are formed, the regulation and control mode is more accurate, the nitrogen doping effect is more uniform, cost is reduced, and the preparation method is suitable for industrial production. The method is suitable for large-scale industrial production.

The present invention provides L10 type FeNi ordered alloy 5 that has a L10 type ordered structure and includes a transition metal element 2 of group 6 or group 7. Thus, the coercive force of L10 type FeNi ordered alloy 5 can be further increased.

To provide FeCo-based alloy and target material each having excellent corrosion resistance and sputtering property.SOLUTION: FeCo-based alloy for a soft magnetic layer includes TCR element and TAM element. The balance is Fe, Co and inevitable impurities. The content (at%) of each element satisfies formula (1) 0.1≤TCR≤10.0, formula (2) 11.0≤TAM≤25.0, formula (3) 16.0≤[TCR / 2+TAM]≤25.0, and formula (4) 0.20≤[Fe / (Fe+Co)]≤0.80. The FeCo-based alloy has microstructure that consisting of (Fe,CO) phases having Fe and / or Co as a main constituent, and intermetallic compound phases including TCR element or TAM element. In this microstructure, the number of (Fe,Co) phases in which the diameter of the minimum circumscribed circle surrounding the outside of the (Fe,Co) phase exceeds 30 μm is 0.SELECTED DRAWING: Figure 1

The invention concerns a method for fabricating an array of magnets (10), the method comprising: - a step of deposition of a coercivity changing element according to a pattern on a first material having a first coercivity value, the coercivity changing element being adapted to change the coercivity of the first material, and - a step of diffusion of the coercivity changing element into certain regions to form a magnetic layer (16) having first areas (A1) made of the first material and second areas (A2) having a second coercivity, made of a second material comprising the first material and the coercivity changing element.

The invention relates to the technical field of electronics, and discloses a high-precision inductor based on magnetron sputtering and a forming method.The high-precision inductor comprises a thin film deposited on a substrate, the substrate is a carbonyl material or iron silicon chromium, the surface of the substrate is covered with an insulating layer, and the thickness of the insulating layer ranges from 10 nm to 50 nm; the thin film is composed of at least two metal elements, and the thickness of the thin film ranges from 50 nm to 200 nm. The soldering tin layer is deposited on the surface of the thin film and comprises tin or silver, and the thickness of the soldering tin layer ranges from 1 micrometer to 3 micrometers; the magnetic conductivity of the thin film is optimized through material components and a microstructure, so that the inductor has eddy current loss lower than 5% and a Q value higher than 100 in a target frequency range, the thin film is composed of at least two elements of nickel, chromium, copper and vanadium, the magnetic conductivity is optimized, and the adhesive force is enhanced. The material of the inductor is prepared by adopting a magnetron sputtering technology, so that the effect of remarkably improving the conductivity of the inductor is achieved.

To provide an electromagnetic wave attenuation body capable of improving attenuation characteristics for electromagnetic wave, an electronic device, a film deposition device, and a film deposition method.SOLUTION: An electromagnetic wave attenuation body includes a first structure. The first structure includes: a first member including a first magnetic layer and a first nonmagnetic layer with conductivity provided alternately in a first direction as a lamination direction, a second member including a second magnetic layer and a second nonmagnetic layer with conductivity provided alternately in the first direction, and a third member including a third nonmagnetic layer with conductivity. The direction from the third member to the first member is along the first direction. The direction from the third member to the second member is along the first direction. A first magnetic layer thickness of the first magnetic layer along the first direction is larger than a second magnetic layer thickness of the second magnetic layer along the first direction.SELECTED DRAWING: Figure 1

Provided are: a magnetic recording medium having a high magnetocrystalline anisotropy constant Ku and coercive force Hc; and a sputtering target used to produce this magnetic recording medium.　This Pt-oxide sputtering target is formed from 60 vol% or more but less than 100 vol% of a Pt-based alloy phase and more than 0 vol% but 40 vol% or less of an oxide, the Pt-oxide sputtering target being characterized in that the Pt-based alloy phase contains 50 to 100 at% of Pt.

To provide a new multilayer thin film exhibiting a tunnel magnetoresistance effect.SOLUTION: The present invention is a multilayer thin film having an insulating layer and a magnetic layer sandwiching the insulating layer. At least one of the magnetic layers is made of a Co-based alloy containing Al and / or Ga. For example, Co is contained in an amount of 58.5 to 63 at% with respect to the entire Co-based alloy. The Co-based alloy constituting a magnetic layer may be a β phase. The insulating layer is, for example, MgO or MgAl2O4. The magnetic layer on the other side of the insulating layer may be CoFeB (alloy) in addition to CoAl. Each layer is formed by sputtering, and planarization, crystallization, and the like are performed by heat treatment. A magnetic tunnel junction (MTJ) having the multilayer thin film of the present invention exhibits a high magnetoresistance change ratio (MR ratio), and can be applied to a next-generation magnetoresistance memory (MRAM) or the like.SELECTED DRAWING: Figure 3

The present invention provides a sputtering target which enables a magnetic layer of a magnetic recording medium to maintain high coercivity, while being capable of improving magnetic separation between magnetic particles. This sputtering target contains Co and Pt as metal components, while containing NbO2 as a metal oxide component. Alternatively, this sputtering target contains Co and Pt as metal components, while having a phase that contains all of Co, Nb and O.

[Problem] To enhance the flatness of a hard magnetic film without using a plurality of targets in forming a base film. [Solution] A magnetic sensor 100 comprises a base film 30 provided on a substrate 10, a hard magnetic film 40 provided on a surface 34 of the base film 30 so as to be in contact with the base film 30, and a magnetoresistance effect element 60 provided on the hard magnetic film 40. The base film 30 includes a first base film 31 positioned on the substrate 10 side, and a second base film 32 that is made of the same material as the first base film 31 and is in contact with the hard magnetic film 40. In the base film 30, dislocation is present at an interface 33 between the first base film 31 and the second base film 32.

A multi-layered magnetic film, comprising: a substrate; a first magnetic layer arranged on the substrate, wherein the first magnetic layer is Fe (50-80) N (10-20 )B (1-20) M (0-10) includes, where M is Si, Ta, Zr, Ti, Co or a combination thereof; and a second magnetic layer arranged on top of the first magnetic layer, where the second magnetic layer is Fe (50-90) N (10-50) or Fe (60-90) N (1-10 )Ta (5-30) includes; the multilayer magnetic foil exhibits a frequency range of 1 to 5 GHz, a magnetic permeability of greater than or equal to 1800, preferably greater than or equal to 2000, particularly preferably greater than or equal to 3000 over a selected frequency band in the frequency range, preferably over a frequency band of 1 to 10 GHz; a magnetic loss tangent of less than or equal to 0.3, preferably less than or equal to 0.1, over a selected frequency band in the frequency range, preferably over a frequency band from 1 to 10 GHz; and a cutoff frequency greater than or equal to 1 GHz, or greater than or equal to 2 GHz, preferably greater than or equal to 5 GHz.

In one embodiment of the present invention, a metallic magnetic thin film is provided, comprising a plurality of columnar structures having an amorphous phase and whose long sides extend in the thickness direction. The columnar structures include a main body portion and a sidewall portion continuous with the main body portion. The columnar structures contain Fe, Co, Si and B. In the sidewall portions, the total amount of Fe and Co is greater than the total amount of Si and B when converted in atomic percentage concentration.

The application belongs to the field of soft magnetic high-entropy alloy material and magnetron sputtering technology, and particularly relates to a pre-nitriding soft magnetic high-entropy alloy target material preparation method, a target material and application, which comprises the following steps: proportioning alloy materials according to the component content of the soft magnetic high-entropy alloy, completing smelting and processing into a target material, and adopting a gas nitriding process to perform nitriding treatment on the target material; polishing the surface of the target material after the nitriding treatment to obtain a pre-nitriding soft magnetic high-entropy alloy target material for magnetron sputtering; and based on the pre-nitriding soft magnetic high-entropy alloy target material, using a magnetron sputtering process to perform sputtering plating on the surface of a substrate to form a soft magnetic high-entropy alloy nitride film; the application avoids the poisoning of the target caused by the traditional sputtering of nitrogen gas and the non-uniformity in the micro area of the sputtered film on the substrate caused by the different distribution of nitrogen gas, reduces the pollution of the internal cavity of the sputtering equipment, and improves the film forming quality of the film and the soft magnetic performance of the film.

A sputtering target capable of maintaining high coercive force in the magnetic layer of a magnetic recording medium and improving magnetic separation between magnetic particles is provided. A sputtering target includes Co and Pt as metal components and NbO2 as a metal oxide component. Or alternatively, a sputtering target includes Co and Pt as metal components, and includes a phase containing Co, Nb, and O.

A method for obtaining chiral coupling in ferrimagnetic alloy belongs to the technical field of new materials, and comprises the following steps: 1) a step of depositing tantalum Ta as a seed layer on a Si / SiO2 substrate by using a direct current magnetron sputtering technology; 2) on the basis of the step 1), a step of depositing platinum Pt as a heavy metal layer on the Ta by using the direct current magnetron sputtering technology; 3) on the basis of the step 2), a step of preparing a TM-RE ferrimagnetic alloy on a multilayer film by using a method of direct current co-sputtering of a magnetic transition metal or alloy TM and a rare earth metal RE; 4) on the basis of the step 3), a step of depositing Ta as a cover layer on the multilayer film by using the direct current magnetron sputtering technology, so as to finally obtain a ferrimagnetic multilayer film; and 5) chiral coupling magnetic structure is constructed by using gallium ion irradiation to change magnetic anisotropy of the ferrimagnetic multilayer film. The chiral coupling can be used to construct a race track memory based on the ferrimagnetic, and the race track memory is expected to show a lower power consumption application potential than a traditional ferromagnetic system in a new type of calculation.

The present invention relates to a metallic hard magnetic material selected from an at least binary ferromagnetic or ferrimagnetic compound, with the metallic hard magnetic material including at least two different elements selected from the group consisting of 3d and 4f elements, where the metallic hard magnetic material is under an external magnetic field B of ≥0.1 T.

To provide an L10-FePt thin film exhibiting both high magnetic anisotropy and low damping constant.SOLUTION: The L10-FePt thin film includes a single-crystal substrate made of magnesium oxide (MgO) or strontium titanate (SrTiO3), and an FePt thin film laminated on the single-crystal substrate. The damping constant falls within a range of 0.018 or more and 0.044 or less, and the magnetic anisotropy falls within a range of 3.0 or more and 7.0 T or less.SELECTED DRAWING: Figure 1

The present invention realizes a translucent magnetic material having excellent optical characteristics. The translucent magnetic material is provided with: a plurality of magnetic particles including a plurality of FeCo particles; and a light-transmitting material in which the plurality of magnetic particles are dispersed, the light-transmitting material comprising: a ceramic material containing a compound of fluorine and at least one element selected from group III, group IV, and group V; and a metal material located in a region between the plurality of FeCo particles and the ceramic material.