The invention relates to a lead-free solder for electronic packaging. The invention solves the technical problems that: the cost of the conventional high-silver solder is higher, and the mechanical property of the conventional low-silver solder is poor. According to percentage by weightmass, the lead-free solder for electronic packaging is composed of Ag, Cu, Ni, Bi, Sb, Ti and the balance of Sn. By designing and optimizing the solder ingredients, the lead-free solder for electronic packaging, which has excellent properties and is low in cost, is obtained. The addition of a variety of elements takes the complementation between the elements into consideration, consequently, while the properties of a certain element are improved, the other adverse affection is reduced, and thereby therefore the comprehensive properties of the solder are effectively enhanced.