Lead-free solder for electronic packaging

An electronic packaging, lead-free solder technology, applied in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problems of high cost of high-silver solder, poor mechanical properties of low-silver solder, etc. Excellent anti-aging properties, reducing adverse effects and improving mechanical properties

Inactive Publication Date: 2013-03-13
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a lead-free solder for electronic packaging in order to solve the technical problems such as the high cost of the existing high-silver solder and the poor mechanical properties of the low-silver solder.

Method used

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  • Lead-free solder for electronic packaging
  • Lead-free solder for electronic packaging

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specific Embodiment approach 1

[0012] Specific Embodiment 1: In this embodiment, the lead-free solder for electronic packaging is composed of 0.35-0.90% Ag, 0.20-1.00% Cu, 0.005-0.20% Ni, 1.20-4.00% Bi, 0.50-2.00% Sb according to the mass percentage , 0.01 to 0.20% Ti, and the rest is composed of Sn.

[0013] The preparation method of lead-free solder for electronic packaging in the present embodiment is as follows:

[0014] Step 1: Weigh according to the composition mass percentage of 35-0.90% Ag, 0.20-1.00% Cu, 0.005-0.20% Ni, 1.20-4.00% Bi, 0.50-2.00% Sb, 0.01-0.20% Ti, and the rest is Sn each alloying element.

[0015] Step 2: Get the Cu weighed in Step 1, and calculate the corresponding metal Sn weight according to Cu and Sn mass percentages of 39.11% and 60.89%, weigh and take out the Sn of this weight from the Sn weighed in Step 1, and The Cu weighed in step 1 and the Sn weighed in step 2 are placed in a quartz tube, and heated by high-frequency induction method. The heating temperature is controll...

specific Embodiment approach 2

[0019] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the lead-free solder for electronic packaging is composed of 0.52-0.83% Ag, 0.45-0.68% Cu, 0.025-0.16% Ni, 2.10-3.80 %Bi, 0.80-1.85% Sb, 0.07-0.17% Ti, and the rest is composed of Sn. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0020] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the lead-free solder for electronic packaging is composed of 0.60-0.72% Ag, 0.45-0.55% Cu, 0.035-0.10% Ni, 2.50-3.50% %Bi, 1.25-1.60% Sb, 0.10-0.15% Ti, and the rest is composed of Sn. Others are the same as in the first embodiment.

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Abstract

The invention relates to a lead-free solder for electronic packaging. The invention solves the technical problems that: the cost of the conventional high-silver solder is higher, and the mechanical property of the conventional low-silver solder is poor. According to percentage by weightmass, the lead-free solder for electronic packaging is composed of Ag, Cu, Ni, Bi, Sb, Ti and the balance of Sn. By designing and optimizing the solder ingredients, the lead-free solder for electronic packaging, which has excellent properties and is low in cost, is obtained. The addition of a variety of elements takes the complementation between the elements into consideration, consequently, while the properties of a certain element are improved, the other adverse affection is reduced, and thereby therefore the comprehensive properties of the solder are effectively enhanced.

Description

technical field [0001] The invention relates to a lead-free solder for electronic packaging. Background technique [0002] At present, the mainstream lead-free solder in the market is Sn-3.0Ag-0.5Cu (SAC305 for short) solder, whose alloy melting temperature range is around 217°C, and has the advantages of good wettability, high joint strength, and good thermal fatigue resistance. , similar Sn-Ag-Cu based solder alloy components such as Sn-4.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu also have good joint microstructure and mechanical properties. However, the higher silver content makes the cost of this type of solder higher; at the same time, compared with SnPb solder, this type of solder has poor reliability under high strain rate conditions such as shock vibration. [0003] In order to reduce costs, low-silver solder has gradually become a hot spot in the development of new solder. Generally, solders with silver content lower than the existing SnAgCu eutectic composition (3.0-4.7 wt%) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 孙凤莲刘洋
Owner HARBIN UNIV OF SCI & TECH
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