The present disclosure discloses a headphone, and the headphone comprises a speaker
assembly and a wearing
assembly. The speaker
assembly includes a
bone conduction speaker. The
bone conduction speaker includes a core housing, a first vibration transmitting plate, a
transducer, a vibration plate, and a lead wire. The first vibration transmitting plate includes an inner ring fixing portion, an outer ring fixing portion, and at least two elastic connecting portions. The at least two elastic connecting portions are connected between the inner ring fixing portion and the outer ring fixing portion, the inner ring fixing portion is connected to the
transducer, the outer ring fixing portion is connected to the core housing, so that the
transducer is suspended in the core housing, and the vibration plate is connected to the transducer. The lead wire is connected to the transducer and includes a first lead portion extending from the inner ring fixing portion to the outer ring fixing portion. A dimension of the first vibration transmitting plate along a
long axis direction is larger than a dimension of the first vibration transmitting plate along a
short axis direction, and an angle between the first lead portion and the
long axis direction is less than an angle between the first lead portion and the
short axis direction. In this way, the
structural stability of the speaker assembly can be enhanced.