Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wiring board

A wiring board and substrate technology, applied in the direction of multilayer circuit manufacturing, printed circuit components, electrical components, etc.

Inactive Publication Date: 2007-08-08
PANASONIC CORP
View PDF5 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even if wiring with a narrow pitch can be realized, the solder pad existing on the wiring path is a bottleneck in the pursuit of high-density wiring

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wiring board
  • Wiring board
  • Wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0204] FIG. 1A shows a substrate structure of a wiring board 100A according to a preferred embodiment 1 of the present invention. A wiring board 100A shown in FIG. 1A has a shape of a rectangular flat plate. Wiring board 100A includes a plurality of dielectric layers 11 . The respective dielectric layers 11 are arranged along the direction in which the main surfaces of the substrates face each other (thickness direction), and are stacked in the direction w1 crossing the facing direction t at right angles. The orthogonal direction w1 refers to the planar direction of the substrate along either side of the rectangular wiring board 100A. Internal conductor patterns 12 and 13 are provided on the respective dielectric layers 11 . Each internal conductor pattern 12 and 13 is provided on both surfaces of each dielectric layer 11 . On one of the main surfaces 20 and 21 of the substrate, adjacent dielectric layers 11 are formed to be connected to each other so as to be integrally co...

Embodiment approach 2

[0226] 4A, 4B, 4C and 5 show the structure of a wiring board 100B according to the preferred embodiment 2 of the present invention and its manufacturing method. The configurations of the dielectric layer 11, the internal conductor patterns 12 and 13, and the lead-out electrodes 17 are similar to those of the preferred embodiment 1. However, in the present preferred embodiment, the extraction electrode 17 is provided on one main surface 20 of the wiring board 100B, and the extraction electrode 19 is provided on the other main surface 21 of the wiring board 100B. The lead electrodes 17 and 19 are connected through the internal conductor patterns 12 and 13 on the upper and lower surfaces of the wiring board 100B.

[0227] In order to mount chip-type circuit components such as LSI chips at high density, circuit components (electronic parts, etc.) are provided on both surfaces of the wiring board, and must be mounted on one of the surfaces of the wiring board The circuit component...

Embodiment approach 3

[0241] 8A, 8B, 8C, 9 and 10 show the configuration of a wiring board 100C according to a preferred embodiment 3 of the present invention. The basic structure according to this preferred embodiment is the same as that of the preferred embodiment 1. The present preferred embodiment is characterized in that different inner conductor patterns 12 are connected to each other.

[0242] The basic constitution according to the present invention is characterized in that internal conductor patterns formed at high density are incorporated in the wiring board. The individual internal conductor patterns formed parallel to each other in the planar direction of the dielectric layer cannot be connected to each other in the wiring board.

[0243] It is also conceivable that the signal lines connecting the inner conductor pattern constituting one signal line with the inner conductor pattern constituting the other signal line are hard-wired. Figures 8A, 8B, 8C, 9 and 10 show the configuration o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Widthaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

To provide a mutilayer wiring board wherein high density wiring exceeding the application limit of the conventional build up wiring boards is made possible. A wiring board is provided with a board, which is formed by stacking along a board flat plane direction a plurality of dielectric layers arranged along a facing direction of the both main planes of the board, and an inner conductor pattern arranged on the surface of the dielectric layer. The adjacent dielectric layers are integrally formed to be communicated with each other by being connected at the layer edges on one of the board main planes. The connecting portions of the adjacent dielectric layers are alternately provided on one of the board main planes, and the dielectric layers are formed in a shape of one dielectric sheet which is arranged by being bent.

Description

technical field [0001] The present invention relates to a wiring board, a manufacturing method of the wiring board, and an electronic component mounting structure, and more particularly, to a high-density wiring board on which highly integrated LSI chips and the like can be mounted. Background technique [0002] As electronic devices become more powerful and perform better in recent years, LSIs and peripheral circuits constituting electronic devices continue to require larger areas, and the number of wires used to connect LSI chips and peripheral circuits in wiring boards on which these components is also increasing, which requires high-density wiring on the circuit board. [0003] In addition, with the continuous integration of LSI chips, the signal processing speed is also increasing, and it is necessary to transmit signals at a higher speed on the circuit substrate to fully utilize the high performance of the LSI chip. [0004] In order to realize high-density wiring, it...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/46H05K1/02H05K3/00
Inventor 富田佳宏中村祯志
Owner PANASONIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com