Inorganic flexible LED color display screen and preparation method
A color display, flexible technology, applied in the direction of identification devices, instruments, etc., can solve the problems of poor visibility, complex process, reduced rollability, etc., to overcome the bottleneck of preparation, high wiring density, and rollability. Good results
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Embodiment 1
[0031] refer to Figure 1-3 , the preparation of the present invention comprises the following specific steps:
[0032] Step 1. Make the flexible circuit board
[0033] The flexible circuit board is composed of a base layer 4, a multi-layer insulating layer 12 and a multi-layer electrode layer, the base layer 4 is the bottom layer, and the insulating layer 12 and the electrode layer are alternately arranged on the base layer;
[0034] 1.1. Prepare the base layer: use PET polyester board, coat a layer of indium tin oxide (ITO), fluorine-doped tin oxide (FTO) or zinc oxide (ZnO) conductive film on the board, and etch it by laser The process etches the plating coating into a common circuit, arranges LED pads 11 in X rows and E columns on the other side of the board, and arranges the common circuit lead-out lines X1~Xn and electrode terminals in X rows, and the shared circuit Connect to the common end of the LED pad 11 to complete the preparation of the base layer;
[0035] 1.2...
Embodiment 2
[0048] refer to Figure 1-3 , the preparation of the present invention comprises the following specific steps:
[0049] Step 1. Make the flexible circuit board
[0050] The flexible circuit board is composed of a base layer 4, a multi-layer insulating layer 12 and a multi-layer electrode layer, the base layer 4 is the bottom layer, and the insulating layer 12 and the electrode layer are alternately arranged on the base layer;
[0051] 1.1. Preparation of base layer: select PI polyimide board, coat a layer of indium tin oxide (ITO), fluorine-doped tin oxide (FTO) or zinc oxide (ZnO) conductive film on the board, and pass laser The etching process etches the plated coating into a common circuit, arranges LED pads 11 in X rows and E columns on the other side of the board, and arranges common circuit lead-out lines X1 to Xn and electrode terminals in X rows, The common circuit is connected to the common end of the LED pad 11 to complete the preparation of the base layer;
[005...
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